| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 08/10/2004 | US6774671 Multi-purpose transistor array |
| 08/10/2004 | US6774659 Method of testing a semiconductor package device |
| 08/10/2004 | US6774499 Non-leaded semiconductor package and method of fabricating the same |
| 08/10/2004 | US6774494 Semiconductor device and manufacturing method thereof |
| 08/10/2004 | US6774483 Semiconductor assembly with a semiconductor module |
| 08/10/2004 | US6774478 Stacked semiconductor package |
| 08/10/2004 | US6774477 Structure and method of stacking multiple semiconductor substrates of a composite semiconductor device |
| 08/10/2004 | US6774476 Power converter and method for producing the same |
| 08/10/2004 | US6774475 Vertically stacked memory chips in FBGA packages |
| 08/10/2004 | US6774473 Semiconductor chip module |
| 08/10/2004 | US6774471 Protected bond fingers |
| 08/10/2004 | US6774468 Power semiconductor device |
| 08/10/2004 | US6774467 Semiconductor device and process of production of same |
| 08/10/2004 | US6774465 Semiconductor power package module |
| 08/10/2004 | US6774006 Microelectronic device fabricating method, and method of forming a pair of field effect transistor gate lines of different base widths from a common deposited conductive layer |
| 08/10/2004 | US6773959 Method for stacking semiconductor package units and stacked package |
| 08/10/2004 | US6773955 Low profile multi-IC chip package connector |
| 08/10/2004 | US6773947 Method of manufacturing semiconductor device including an opening formed by a laser |
| 08/10/2004 | US6773943 Display unit and method of fabricating the same |
| 08/10/2004 | US6773139 Variable optics spot module |
| 08/05/2004 | WO2004066395A2 Fast switching power insulated gate semiconductor device |
| 08/05/2004 | WO2004066324A2 Integrated photovoltaic roofing system |
| 08/05/2004 | US20040153976 High speed low power bitline |
| 08/05/2004 | US20040152348 Socket for mating with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component |
| 08/05/2004 | US20040152235 Double side stack packaging method |
| 08/05/2004 | US20040150969 High speed circuit board and method for fabrication |
| 08/05/2004 | US20040150273 Press-fitting method and rectifying device having press-fitted member |
| 08/05/2004 | US20040150116 Thermal enhance MCM package |
| 08/05/2004 | US20040150115 Electronic device, method of manufacturing the same, and electronic instrument |
| 08/05/2004 | US20040150114 Multi-chip electronic package having laminate carrier and method of making same |
| 08/05/2004 | US20040150107 Stack package and fabricating method thereof |
| 08/05/2004 | US20040150102 Thermal enhance MCM package and manufacturing method thereof |
| 08/05/2004 | US20040150101 Information handling system |
| 08/05/2004 | US20040150098 Multi-stack chip size packaging method |
| 08/05/2004 | US20040150095 Multilayer; carrier and semiconductive chips; electroconductive and dielectric layers |
| 08/05/2004 | US20040150094 Stacked structure of integrated circuits |
| 08/05/2004 | US20040150085 Semiconductor device having a chip-size package |
| 08/05/2004 | US20040150084 Semiconductor device |
| 08/05/2004 | US20040150081 Multichip module, manufacturing method thereof, multichip unit and manufacturing method thereof |
| 08/05/2004 | US20040150068 Membrane 3D IC fabrication |
| 08/05/2004 | US20040150001 Defect-free semiconductor templates for epitaxial growth |
| 08/05/2004 | US20040149995 Multilayer connector frames; light emitting element; light transmission resin |
| 08/05/2004 | US20040149330 Stacked photovoltaic device |
| 08/05/2004 | DE10339239A1 Leistungs-Halbleitereinrichtung Power semiconductor device |
| 08/05/2004 | DE10249205B3 Leistungsbauelementanordnung zur mechatronischen Integration von Leistungsbauelementen Power component assembly for mechatronic integration of power devices |
| 08/05/2004 | CA2512526A1 Integrated photovoltaic roofing system |
| 08/04/2004 | EP1443811A2 High speed circuit board and method for fabrication |
| 08/04/2004 | EP1443809A2 Electronic circuit unit and method for manufacturing the same |
| 08/04/2004 | EP1443562A2 Solid-state automotive lamp |
| 08/04/2004 | EP1443561A2 Stacked chip electronic package having laminate carrier and method of making same |
| 08/04/2004 | EP1443560A2 Multi-chip electronic package having laminate carrier and method of making same |
| 08/04/2004 | EP1443559A2 Integrated circuit assembly module |
| 08/04/2004 | EP1443558A1 Semiconductor device |
| 08/04/2004 | EP1443554A1 Package for semiconductor devices |
| 08/04/2004 | EP1443546A2 Working method of metal material and semiconductor apparatus fabricated by the method |
| 08/04/2004 | EP0792462B1 Probe card assembly and method of using the same |
| 08/04/2004 | CN2631048Y Full-colour LED packing structure |
| 08/04/2004 | CN2631043Y Full-colour light-emitting diode |
| 08/04/2004 | CN2631042Y Electronic module with ball-lattice array |
| 08/04/2004 | CN2631040Y Central welding pad memory body piled-up packing assembly |
| 08/04/2004 | CN2630632Y Light-emitting diode lighting lamp |
| 08/04/2004 | CN1518768A High power LED module for spot illumination |
| 08/04/2004 | CN1518767A Low profile integrated module interconnects |
| 08/04/2004 | CN1518136A Luminescent device |
| 08/04/2004 | CN1518131A Photoelectrical coupling semiconductor device and its manufacturing method |
| 08/04/2004 | CN1518105A Semiconductor chip, semiconductor wafer and semiconductor device and its manufacturing method |
| 08/04/2004 | CN1518104A 半导体器件 Semiconductor devices |
| 08/04/2004 | CN1518094A Manufacturing method of semiconductor device and semiconductor device |
| 08/04/2004 | CN1518080A Electronic element packaging structure and its manufacturing method |
| 08/04/2004 | CN1518067A Manufacturing method of semiconductor device |
| 08/04/2004 | CN1160792C Retractable data processing apparatus |
| 08/04/2004 | CN1160790C High-frequency module and method of manufacture thereof |
| 08/03/2004 | US6770980 Semiconductor device having semiconductor element packaged on interposer |
| 08/03/2004 | US6770964 Semiconductor device including intermediate wiring element |
| 08/03/2004 | US6770960 Transferring semiconductor crystal from a substrate to a resin |
| 08/03/2004 | US6770881 Infrared sensor |
| 08/03/2004 | US6770511 Semiconductor device, and its manufacturing method, circuit substrate, and electronic apparatus |
| 08/03/2004 | US6769754 Ink jet recording apparatus utilizing solid semiconductor element |
| 07/30/2004 | CA2455024A1 Stacked chip electronic package having laminate carrier and method of making same |
| 07/30/2004 | CA2454971A1 Multi-chip electronic package having laminate carrier and method of making same |
| 07/29/2004 | WO2004064159A1 Semiconductor device, three-dimensional mounting semiconductor apparatus, method for manufacturing semiconductor device |
| 07/29/2004 | WO2004064139A2 Semiconductor chip stack and method for passivating a semiconductor chip stack |
| 07/29/2004 | WO2004063980A1 Module for a hybrid card |
| 07/29/2004 | WO2004038798A3 Stacked electronic structures including offset substrates |
| 07/29/2004 | US20040147172 Apparatus, system, and method of electrically coupling photovoltaic modules |
| 07/29/2004 | US20040147083 Working method of metal material and semiconductor apparatus fabricated by the method |
| 07/29/2004 | US20040147064 Neo-wafer device and method |
| 07/29/2004 | US20040145893 Night vision imaging system (NVIS) compliant instrument panel component |
| 07/29/2004 | US20040145301 Light-emitting device |
| 07/29/2004 | US20040145063 Integrated circuit assembly module that supports capacitive communication between semiconductor dies |
| 07/29/2004 | US20040145054 Components, methods and assemblies for stacked packages |
| 07/29/2004 | US20040145051 Semiconductor components having stacked dice and methods of fabrication |
| 07/29/2004 | US20040145050 Contact system |
| 07/29/2004 | US20040145044 a first electrical insulating substrate of a mixture of an inorganic filler and a thermosetting resin containing chips connected to wiring patterns formed on substrate surface; inner vias passing through the substrate connected to wiring patterns |
| 07/29/2004 | US20040145042 Semiconductor device |
| 07/29/2004 | US20040145040 improved reliability of connections of fine metal wires of an upper semiconductor chip to a wiring board when the second semiconductor chip is significantly larger than the first; prevention of microcracks in the second chip |
| 07/29/2004 | US20040145039 substrate with first semiconductor mounted on it and electrically connected to an interposer supported above the semiconductor opposite the substrate; second semiconductor mounted on the interposer; increased semiconductor die density |
| 07/29/2004 | US20040145038 Composite integrated circuit device |
| 07/29/2004 | US20040145035 Signal transmission plate used in an assembly package |
| 07/29/2004 | US20040144996 Coolant cooled type semiconductor device |