| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 08/19/2004 | US20040159940 Hermetically sealed semiconductor power module and large scale module comprising the same |
| 08/19/2004 | US20040159938 Semiconductor component and method for producing same |
| 08/19/2004 | US20040159937 Circuit arrangement |
| 08/19/2004 | US20040159933 Electronic parts packaging structure and method of manufacturing the same |
| 08/19/2004 | US20040159925 Semiconductor device and method for manufacture thereof |
| 08/19/2004 | US20040159919 Electronic circuit device |
| 08/19/2004 | US20040159913 Circuit device and method of manufacture thereof |
| 08/19/2004 | US20040159892 Semiconductor integrated circuit device and electronic card using the same |
| 08/19/2004 | US20040159850 Semiconductor light-emitting device, manufacturing method thereof, and electronic image pickup device |
| 08/19/2004 | US20040159462 Flexible dielectric electronic substrate and method for making same |
| 08/19/2004 | DE10244446B4 Halbleiterchipstapel Semiconductor chip stack |
| 08/19/2004 | CA2515314A1 Light emitting apparatus comprising semiconductor light emitting devices |
| 08/18/2004 | EP1448031A1 Concave cup printed circuit board for light emitting diode and method for producing the same |
| 08/18/2004 | EP1447852A2 Attaching structural unit used for installing quadrangular solar-battery module onto slanted roof |
| 08/18/2004 | EP1447850A2 Electronic parts packaging structure and method of manufacturing the same |
| 08/18/2004 | EP1447849A2 Semiconductor device and circuit board having the same mounted thereon |
| 08/18/2004 | EP1447845A2 Package of electronic components and method for producing the same |
| 08/18/2004 | EP1447617A2 Vehicular headlamp |
| 08/18/2004 | EP1447616A2 Vehicular headlamp |
| 08/18/2004 | EP0944922B1 Manufacture of a chip module |
| 08/18/2004 | CN1522462A Method for preparing low dielectric films |
| 08/18/2004 | CN1522460A Opto-electronic device integration |
| 08/18/2004 | CN1522459A Opto-electronic device integration |
| 08/18/2004 | CN1522127A Medical x-ray device and power module therefor |
| 08/18/2004 | CN1521847A Electronic parts packaging structure and method of manufacturing the same |
| 08/18/2004 | CN1521842A Package of electronic components and method for producing the same |
| 08/18/2004 | CN1521444A Vehicular headlamp |
| 08/18/2004 | CN1521443A Projection light source generating apparatus using light emitting diode |
| 08/18/2004 | CN1162907C Memory module with laminated chips and its making process |
| 08/18/2004 | CN1162906C Stacking type video image sensor and making method thereof |
| 08/18/2004 | CN1162901C Semiconductor device manufacturing process |
| 08/17/2004 | US6778406 Resilient contact structures for interconnecting electronic devices |
| 08/17/2004 | US6778404 Stackable ball grid array |
| 08/17/2004 | US6778389 Microelectronic package with tubular housing |
| 08/17/2004 | US6778142 Electronic device and a circuit arrangement |
| 08/17/2004 | US6777816 Stress-relaxation layers intervening between lands and semiconductor chips; computers |
| 08/17/2004 | US6777801 Large scale integration (?lsi?) chips sealed with resin |
| 08/17/2004 | US6777799 Stacked semiconductor device and method of producing the same |
| 08/17/2004 | US6777798 Stacked semiconductor device structure |
| 08/17/2004 | US6777797 Stacked multi-chip package, process for fabrication of chip structuring package, and process for wire-bonding |
| 08/17/2004 | US6777796 Stacked semiconductor chips on a wiring board |
| 08/17/2004 | US6777795 Semiconductor integrated circuit modules, manufacturing methods and usage thereof |
| 08/17/2004 | US6777794 Circuit mounting method, circuit mounted board, and semiconductor device |
| 08/17/2004 | US6777787 Semiconductor device with warp preventing board joined thereto |
| 08/17/2004 | US6777785 Lead frame containing a master and a slave IC chips and a testing circuit embedded within the master IC chip |
| 08/17/2004 | US6777724 Light-emitting device with organic layer doped with photoluminescent material |
| 08/17/2004 | US6777648 Method and system to manufacture stacked chip devices |
| 08/17/2004 | US6777610 Protective sheet for solar battery module, method of fabricating the same and solar battery module |
| 08/17/2004 | US6777313 Semiconductor device manufacturing method for reinforcing chip by use of seal member at pickup time |
| 08/17/2004 | US6777264 Method of manufacturing a semiconductor device having a die pad without a downset |
| 08/17/2004 | US6777261 Method and apparatus for a semiconductor package for vertical surface mounting |
| 08/17/2004 | US6776399 Chip-scale package |
| 08/17/2004 | CA2090585C Indicator element |
| 08/12/2004 | WO2004068596A1 Lamp module with light emitting diode |
| 08/12/2004 | WO2004067631A1 Resin composition, cured resin, cured resin sheet, laminate, prepreg, electronic part, and multilayer substrate |
| 08/12/2004 | US20040157410 Semiconductor device, semiconductor module, electronic equipment, method for manufacturing semiconductor device, and method for manufacturing semiconductor module |
| 08/12/2004 | US20040157376 Method of manufacturing a semiconductor device and semiconductor device |
| 08/12/2004 | US20040157375 Methods for forming assemblies and packages that include stacked semiconductor devices separated a distance defined by adhesive material interposed therebetween |
| 08/12/2004 | US20040157374 Method for packaging a multi-chip module of a semiconductor device |
| 08/12/2004 | US20040157373 Stacked die module and techniques for forming a stacked die module |
| 08/12/2004 | US20040157365 Method for packaging a multi-chip module of a semiconductor device |
| 08/12/2004 | US20040157361 Semiconductor substrate for build-up packages |
| 08/12/2004 | US20040156177 Package of electronic components and method for producing the same |
| 08/12/2004 | US20040156174 System and method for dissipating heat from an electronic board |
| 08/12/2004 | US20040156172 Thermally enhanced semicoductor package with emi shielding |
| 08/12/2004 | US20040155359 at least one solder bump fills bump-through-hole to connect electrically with portion of trace part of said conductive strip and which protrudes outwardly from encapsulant layer |
| 08/12/2004 | US20040155356 Ceramic circuit board and method for manufacturing the same |
| 08/12/2004 | US20040155355 Semiconductor device, method of fabricating the same, stack-type semiconductor device, circuit board and electronic instrument |
| 08/12/2004 | US20040155354 Semiconductor device, method of fabricating the same, stack-type semiconductor device, circuit board and electronic instrument |
| 08/12/2004 | US20040155330 Semiconductor device and method of manufacturing the same, circuit board and electronic instrument |
| 08/12/2004 | US20040155327 entire die stack is attached to the substrate with one motion thereby reducing the number of iterations as compared to the typical method |
| 08/12/2004 | US20040155326 Semiconductor devices, and manufacturing methods, circuit substrates and electronic equipments for the same |
| 08/12/2004 | US20040155324 Semiconductor package for three-dimensional mounting, fabrication method thereof, and semiconductor device |
| 08/12/2004 | US20040155323 Semiconductor device |
| 08/12/2004 | US20040154956 Stacked die module and techniques for forming a stacked die module |
| 08/12/2004 | US20040154830 Ceramic circuit board and method for manufacturing the same |
| 08/12/2004 | US20040154733 Chip transfer method and apparatus |
| 08/12/2004 | US20040154722 Stacked die module and techniques for forming a stacked die module |
| 08/12/2004 | US20040154655 Attaching structural unit used for installing quadrangular solar-battery module onto slanted roof |
| 08/12/2004 | US20040154164 Ceramic packaging method employing flip-chip bonding |
| 08/12/2004 | US20040154163 Method of forming a connecting conductor and wirings of a semiconductor chip |
| 08/12/2004 | DE10313047B3 Semiconductor chip stack manufacturing method incorporates bridging of conductor paths of one semiconductor chip for design modification |
| 08/12/2004 | DE10303103A1 Microelectronic component comprising chip between substrates, is completed by intervening cast mass which seals substrates without forming peripheral edge |
| 08/12/2004 | DE10258565B3 Schaltungsanordnung für Halbleiterbauelemente und Verfahren zur Herstellung Circuit arrangement for semiconductor devices and methods for making |
| 08/11/2004 | EP1445804A1 Light emitting or light receiving semiconductor module and method for manufacturing the same |
| 08/11/2004 | EP1444733A2 Electronic device carrier adapted for transmitting high frequency signals |
| 08/11/2004 | EP1444719A1 Method of manufacturing modules with an organic integrated circuit |
| 08/11/2004 | CN2632988Y Paster-type digital tube |
| 08/11/2004 | CN2632476Y Parallel light string |
| 08/11/2004 | CN1520611A Structure and method for fabrication of leadless multi-die carrier |
| 08/11/2004 | CN1519933A Semiconductor device and its mfg. method |
| 08/11/2004 | CN1519931A Semiconductor device, electronic appts. their mfg. methods and electronic instrument |
| 08/11/2004 | CN1519930A Semiconductor device, electronic appts. their mfg. methods and electronic instrument |
| 08/11/2004 | CN1519929A Semiconductor chip and its mfg. method |
| 08/11/2004 | CN1519928A Semiconductor device and its mfg. method |
| 08/11/2004 | CN1519920A Semiconductor device and mfg. method for same |
| 08/11/2004 | CN1161834C Semiconductor device and manufacture thereof |
| 08/10/2004 | US6775308 Multi-wavelength semiconductor laser arrays and applications thereof |
| 08/10/2004 | US6775153 Semiconductor device and method of manufacture thereof, circuit board, and electronic instrument |
| 08/10/2004 | US6775145 Construction for high density power module package (case II) |