| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 08/31/2004 | US6784023 Method of fabrication of stacked semiconductor devices |
| 08/31/2004 | US6784021 Semiconductor device, method of fabricating the same and semiconductor device fabricating apparatus |
| 08/31/2004 | US6784019 Intercrossedly-stacked dual-chip semiconductor package and method of fabricating the same |
| 08/31/2004 | US6782745 Slosh supressor and heat sink |
| 08/31/2004 | US6782611 Method of assembling a multi-chip device |
| 08/31/2004 | US6782610 Method for fabricating a wiring substrate by electroplating a wiring film on a metal base |
| 08/26/2004 | WO2004073074A1 Solar cell panel |
| 08/26/2004 | WO2004073064A1 Semiconductor device |
| 08/26/2004 | WO2004073013A2 Electronic component comprising a semiconductor chip and method for producing said component |
| 08/26/2004 | WO2004034433A3 Semiconductor stacked multi-package module having inverted second package |
| 08/26/2004 | WO2004016897A3 Laminated glass and structural glass with integrated lighting, sensors and electronics |
| 08/26/2004 | WO2003061006B1 Stacked die in die bga package |
| 08/26/2004 | US20040166608 Electronic device and a method of manufacturing the same |
| 08/26/2004 | US20040166605 Fabrication method of semiconductor integrated circuit device |
| 08/26/2004 | US20040166335 layers of transparent polymer separated by a transparent non-glass interlayer or an air cavity wherein solid state lighting, sensors, energy generation and storage devices and other electronics are contained within |
| 08/26/2004 | US20040166240 Method for preparing low dielectric films |
| 08/26/2004 | US20040165845 Array of discretely formed optical signal emitters for multi-channel communication |
| 08/26/2004 | US20040165363 Method for attaching chips in a flip-chip arrangement |
| 08/26/2004 | US20040165361 Module component and method of manufacturing the same |
| 08/26/2004 | US20040165277 Single lens multiple light source device |
| 08/26/2004 | US20040164432 Cascaded die mountings with spring-loaded contact-bond options |
| 08/26/2004 | US20040164425 one package includes a plurality of chips, each of which is capable of functioning as one memory chip; dicing line interposed between basic chips that configures a part of the memory chip; bump connecting the logic chip and the memory chip |
| 08/26/2004 | US20040164412 Stackable ball grid array |
| 08/26/2004 | US20040164411 Semiconductor package and method for fabricating the same |
| 08/26/2004 | US20040164408 Noise eliminating system on chip and method of making same |
| 08/26/2004 | US20040164403 Semiconductor device with semiconductor chip formed by using wide gap semiconductor as base material |
| 08/26/2004 | US20040164400 Electronic component having at least one semiconductor chip on a circuit carrier and method for producing the same |
| 08/26/2004 | US20040164394 Multi-chip package and method for manufacturing the same |
| 08/26/2004 | US20040164393 Stacked semiconductor module |
| 08/26/2004 | US20040164392 Stacked semiconductor package and method for fabricating |
| 08/26/2004 | US20040164391 Stacked semiconductor device |
| 08/26/2004 | US20040164390 [semiconductor package with a heat spreader] |
| 08/26/2004 | US20040164388 Power semiconductor module |
| 08/26/2004 | US20040164386 Unmolded package for a semiconductor device |
| 08/26/2004 | US20040164385 multi-chip module wherein plural semiconductor chips are mounted on the same wiring substrate and a main surface is sealed with resin; improving reliability and attaining high-density packaging and low cost |
| 08/26/2004 | US20040164337 Capacitor element, manufacturing method therefor, semiconductor device substrate, and semiconductor device |
| 08/26/2004 | US20040164324 Electronic circuit package |
| 08/26/2004 | US20040163843 Multi-chip package with soft element and method of manufacturing the same |
| 08/26/2004 | US20040163462 Slosh supressor and heat sink |
| 08/26/2004 | US20040163252 Contact carriers (tiles) for populating larger substrates with spring contacts |
| 08/26/2004 | US20040163240 Manufacturing process of a stacked semiconductor device and corresponding device |
| 08/26/2004 | DE19641980C5 Auf der Basis von Leuchtdioden-Chips arbeitende Weißlichtquelle mit nur zwei unterschiedliche Farben emitierenden Leuchtdioden-Chips Operating on the basis of light emitting diode chips white light source with only two different colors of light emitting diode chips emitierenden |
| 08/26/2004 | DE10334761A1 Elektronische Schaltungsvorrichtung An electronic circuit device |
| 08/26/2004 | DE10320579A1 Semiconductor wafer having an upper side, semiconductor chip positions with integrated circuits for first chips, central and edge regions and an equalizing layer useful in semiconductor technology |
| 08/26/2004 | DE10320090A1 Electronic assembly, especially a circuit board, has conducting tracks between components made from carbonized plastic and or agglomerated nano-particles mounted on a plastic substrate |
| 08/26/2004 | DE10306643A1 Druckkontaktierung für ein Leistungshalbleitermodul Pressure contact for a power semiconductor module |
| 08/26/2004 | DE10305870A1 Digital controllable matrix element for preparation of light emitting diodes (LED) useful in pixel electronics, and in electronic image representation based on polymers, silicon, or organic LED |
| 08/26/2004 | DE10221646B4 Verfahren zur Verbindung von Schaltungseinrichtungen und entsprechender Verbund von Schaltungseinrichtungen A method for connection of circuit devices and the appropriate compound of circuit devices |
| 08/25/2004 | EP1450453A2 Array of discretely formed optical signal emitters for multi-channel communication |
| 08/25/2004 | EP1450416A1 Carrier substrate for electronic components |
| 08/25/2004 | EP1450404A2 Assembly in pressure contact with a power semiconductor module |
| 08/25/2004 | EP1449268A2 Radial power megasonic transducer |
| 08/25/2004 | EP1449264A1 Luminescent material, especially for led application |
| 08/25/2004 | EP1449263A2 Optoelectronic component |
| 08/25/2004 | EP1449252A2 Electronic assembly |
| 08/25/2004 | EP1192658A4 Stackable flex circuit ic package and method of making the same |
| 08/25/2004 | EP1135802A4 Three-dimensional packaging technology for multi-layered integrated circuits |
| 08/25/2004 | CN2636426Y Electron assembly parallel packaging structure |
| 08/25/2004 | CN2636411Y Multichip packaging structure |
| 08/25/2004 | CN2636066Y Signal display lamp for mine |
| 08/25/2004 | CN1524293A Microelectronic substrate with integrated devices |
| 08/25/2004 | CN1523681A Semiconductor light-emitting device, manufacturing method thereof, and electronic image pickup device |
| 08/25/2004 | CN1523650A LSI packaging and assembly method thereof |
| 08/25/2004 | CN1523260A Vehicular headlamp employing semiconductor light source |
| 08/24/2004 | US6781854 Matrix converter for transforming electrical energy |
| 08/24/2004 | US6781849 Multi-chip package having improved heat spread characteristics and method for manufacturing the same |
| 08/24/2004 | US6781247 Semiconductor device |
| 08/24/2004 | US6781245 Array structure of solder balls able to control collapse |
| 08/24/2004 | US6781243 Leadless leadframe package substitute and stack package |
| 08/24/2004 | US6781242 Thin ball grid array package |
| 08/24/2004 | US6781241 Semiconductor device and manufacturing method thereof |
| 08/24/2004 | US6781240 Semiconductor package with semiconductor chips stacked therein and method of making the package |
| 08/24/2004 | US6781234 Semiconductor device having electrodes containing at least copper nickel phosphorous and tin |
| 08/24/2004 | US6781233 Semiconductor device and converter device with an integrated capacitor |
| 08/24/2004 | US6781226 Reconfigurable processor module comprising hybrid stacked integrated circuit die elements |
| 08/24/2004 | US6781221 Packaging substrate for electronic elements and electronic device having packaged structure |
| 08/24/2004 | US6781127 Common aperture fused reflective/thermal emitted sensor and system |
| 08/24/2004 | US6781108 Noise canceling photosensor-amplifier device |
| 08/24/2004 | US6780770 Method for stacking semiconductor die within an implanted medical device |
| 08/24/2004 | US6780744 Stereolithographic methods for securing conductive elements to contacts of semiconductor device components |
| 08/24/2004 | US6780677 Process for mounting electronic device and semiconductor device |
| 08/24/2004 | US6780672 Micro eletro-mechanical component and system architecture |
| 08/24/2004 | US6780670 Semiconductor package and fabrication method of the same |
| 08/19/2004 | WO2004071141A2 Metal base wiring board for retaining light emitting elements, light emitting source, lighting apparatus, and display apparatus |
| 08/19/2004 | WO2004070839A2 Light emitting apparatus comprising semiconductor light emitting devices |
| 08/19/2004 | WO2004070835A1 Method for producing microsystems |
| 08/19/2004 | WO2004070792A2 Thin multiple semiconductor die package |
| 08/19/2004 | WO2004049394A3 Digital and rf system and method therefor |
| 08/19/2004 | US20040161926 Method for manufacturing semiconductor device, and method for manufacturing semiconductor module |
| 08/19/2004 | US20040160786 Systems and components for enhancing rear vision from a vehicle |
| 08/19/2004 | US20040160783 Vehicular headlamp |
| 08/19/2004 | US20040160772 Vehicular headlamp |
| 08/19/2004 | US20040160771 Concave cup printed circuit board for light emitting diode and method for producing the same |
| 08/19/2004 | US20040160752 Electronic component built-in module and method of manufacturing the same |
| 08/19/2004 | US20040160751 Printed circuit board and method of manufacturing printed circuit board |
| 08/19/2004 | US20040160742 Three-dimensional electrical device packaging employing low profile elastomeric interconnection |
| 08/19/2004 | US20040160169 Substrate for an electroluminescent display device and method of manufacturing said substrate |
| 08/19/2004 | US20040159962 Semiconductor module having inner pressure release portion |
| 08/19/2004 | US20040159955 Semiconductor chip module |
| 08/19/2004 | US20040159954 Electronic device having a stack of semiconductor chips and method for the production thereof |