| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 09/09/2004 | US20040177237 Reconfigurable processor module comprising hybrid stacked integrated circuit die elements |
| 09/09/2004 | US20040175916 Stackable semiconductor package having semiconductor chip within central through hole of substrate |
| 09/09/2004 | US20040174954 Medical x-ray device and power module therefor |
| 09/09/2004 | US20040174705 LED lamp assembly |
| 09/09/2004 | US20040174223 High speed electronics interconnect and method of manufacture |
| 09/09/2004 | US20040173917 pad for external connection may not be corroded irrespective of a connected state of a wire; chip-on-chip structure; surface protective film for covering internal wiring |
| 09/09/2004 | US20040173914 Semiconductor device |
| 09/09/2004 | US20040173913 Capacitive semiconductor sensor |
| 09/09/2004 | US20040173903 Thin type ball grid array package |
| 09/09/2004 | US20040173902 Ball grid array package stack |
| 09/09/2004 | US20040173901 Thermally enhanced electronic flip-chip packaging with external-connector side die and method |
| 09/09/2004 | US20040173898 Semiconductor apparatus having system-in-package arrangement with improved heat dissipation |
| 09/09/2004 | US20040173894 Integrated circuit package including interconnection posts for multiple electrical connections |
| 09/09/2004 | US20040173889 Multiple die package |
| 09/09/2004 | US20040173885 Semiconductor device |
| 09/09/2004 | US20040173880 High speed electronics interconnect and method of manufacture |
| 09/09/2004 | US20040173822 High speed electronics interconnect and method of manufacture |
| 09/09/2004 | US20040173751 Electronic device and method for manufacturing the same |
| 09/09/2004 | US20040173665 Method of electrically and mechanically connecting electronic devices to one another |
| 09/09/2004 | US20040172813 Method for manufacturing semiconductor device, semiconductor device, circuit board, and electronic apparatus |
| 09/09/2004 | DE19834459B4 Solarbatteriemodul und Verfahren für dessen Herstellung A solar battery module and method for its preparation |
| 09/09/2004 | DE10308866A1 Beleuchtungsmodul und Verfahren zu dessen Herstellung Lighting module and method of producing the |
| 09/08/2004 | EP1455392A1 Semiconductor device and method for manufacturing the same |
| 09/08/2004 | EP1454516A1 Power module and power module assembly |
| 09/08/2004 | CN2640038Y Chip packing structure |
| 09/08/2004 | CN2639683Y High luminous effect cold light lamp for landscape |
| 09/08/2004 | CN2639679Y High-efficient energy-saving lamp |
| 09/08/2004 | CN2639675Y Miner's lamp with semiconductor luminotron |
| 09/08/2004 | CN1527384A 半导体器件 Semiconductor devices |
| 09/08/2004 | CN1527370A Method for producing semiconductor device |
| 09/08/2004 | CN1526985A Vehicle head light |
| 09/08/2004 | CN1165994C Wafer level integration of multiple optical elements |
| 09/07/2004 | US6789222 Single-pass methods for generating test patterns for combinational circuits |
| 09/07/2004 | US6788560 Semiconductor device and process for manufacturing the same |
| 09/07/2004 | US6788546 Multi-chip module |
| 09/07/2004 | US6788541 LED matrix moldule |
| 09/07/2004 | US6787952 Alternator |
| 09/07/2004 | US6787926 Wire stitch bond on an integrated circuit bond pad and method of making the same |
| 09/07/2004 | US6787921 During the reflowing process, the carrier is supported by the solder balls having high-melting-temperature cores, so that the collapse level is controlled |
| 09/07/2004 | US6787917 Apparatus for package reduction in stacked chip and board assemblies |
| 09/07/2004 | US6787916 Structures having a substrate with a cavity and having an integrated circuit bonded to a contact pad located in the cavity |
| 09/07/2004 | US6787915 Rearrangement sheet, semiconductor device and method of manufacturing thereof |
| 09/07/2004 | US6787901 Stacked dies utilizing cross connection bonding wire |
| 09/07/2004 | US6787900 Semiconductor module and insulating substrate thereof |
| 09/07/2004 | US6787894 Apparatus and method for leadless packaging of semiconductor devices |
| 09/07/2004 | US6787893 Pillar member made of aluminum or copper is bonded to a copper pattern which is interposed between the semiconductor element and the insulating substrate, an electroconductive path is formed |
| 09/07/2004 | US6787884 Circuit component, circuit component package, circuit component built-in module, circuit component package production and circuit component built-in module production |
| 09/07/2004 | US6787869 Optical semiconductor housing and method for making same |
| 09/07/2004 | US6787825 Data storage and processing apparatus, and method for fabricating the same |
| 09/07/2004 | US6787442 Method of making a semiconductor having multi-layered electrodes including nickel and phosphorus and solder formed with tin and an alkaline earth metal |
| 09/07/2004 | US6787395 Method of manufacturing a multi-chip module |
| 09/07/2004 | US6786617 Night vision imaging system (NVIS) compliant instrument panel component |
| 09/02/2004 | WO2004066395A3 Fast switching power insulated gate semiconductor device |
| 09/02/2004 | WO2004008488A3 Ganged detector pixel, photon/pulse counting radiation imaging device |
| 09/02/2004 | US20040171193 Semiconductor device and its manufacturing method |
| 09/02/2004 | US20040171191 planarized wire bonding contacts on the die contacts, and a planarized polymer layer encapsulating the wire bonding contacts, which prevents contact between the die encapsulant and the integrated circuits and functions as a stress defect barrier |
| 09/02/2004 | US20040170019 Light-emitting diode light source unit |
| 09/02/2004 | US20040169292 Standoffs for centralizing internals in packaging process |
| 09/02/2004 | US20040169286 Semiconductor device and method for manufacturing the same |
| 09/02/2004 | US20040169285 Memory module having interconnected and stacked integrated circuits |
| 09/02/2004 | US20040169268 Circuit arrangement |
| 09/02/2004 | US20040169266 Power supply packaging system |
| 09/02/2004 | US20040169086 Ic card |
| 09/02/2004 | US20040168316 Low profile multi-IC chip package connector |
| 09/02/2004 | DE10297047T5 Lötfreie Leiterplatten-Baugruppe Solderless PCB assembly |
| 09/02/2004 | DE10250621B4 Verfahren zum Erzeugen verkapselter Chips und zum Erzeugen eines Stapels aus den verkapselten Chips A method for generating encapsulated chips and for producing a stack of the encapsulated chips |
| 09/01/2004 | EP1453111A2 Light source unit |
| 09/01/2004 | EP1453110A2 Light-emitting diode light source unit |
| 09/01/2004 | EP1453109A2 Light-emitting diode light source unit |
| 09/01/2004 | EP1453108A1 Single lens multiple light source device |
| 09/01/2004 | EP1453082A1 GAS FOR PLASMA REACTION, PROCESS FOR PRODUCING THE SAME, AND USE |
| 09/01/2004 | EP1451872A2 Led-luminous panel and carrier plate |
| 09/01/2004 | EP1451870A2 Semiconductor with multiple rows of bond pads |
| 09/01/2004 | EP1399953A4 Opto-electronic device integration |
| 09/01/2004 | CN2638248Y White light luminescent element |
| 09/01/2004 | CN1526169A Method of producing a lamp |
| 09/01/2004 | CN1526168A Single package containing multiple integrated circuit devices |
| 09/01/2004 | CN1526156A Opto-electronic device integration |
| 09/01/2004 | CN1525804A Circuit board and its manufacturing method |
| 09/01/2004 | CN1525581A Light source unit |
| 09/01/2004 | CN1525580A Light-emitting diode light source unit |
| 09/01/2004 | CN1525579A Light-emitting diode light source unit |
| 09/01/2004 | CN1525549A Fabrication process and using method for three dimensional structure memory |
| 09/01/2004 | CN1525545A Soft soldering method for semiconductor components and semiconductor device |
| 09/01/2004 | CN1525485A Three dimensional structure memory |
| 08/31/2004 | US6785447 Single and multilayer waveguides and fabrication process |
| 08/31/2004 | US6785147 Circuit module |
| 08/31/2004 | US6785143 Semiconductor memory module |
| 08/31/2004 | US6784576 Integrally formed rectifier for internal alternator regulator (IAR) style alternator |
| 08/31/2004 | US6784555 Die attach adhesives for semiconductor applications utilizing a polymeric base material with inorganic insulator particles of various sizes |
| 08/31/2004 | US6784551 Electronic device having a trimming possibility and at least one semiconductor chip and method for producing the electronic device |
| 08/31/2004 | US6784541 Resin is filled around the semiconductor chips so that they are sandwiched between the wiring board and the heat spread plate, as well as a mounting method for the semiconductor module |
| 08/31/2004 | US6784538 Heat transfer structure for a semiconductor device utilizing a bismuth glass layer |
| 08/31/2004 | US6784530 Circuit component built-in module with embedded semiconductor chip and method of manufacturing |
| 08/31/2004 | US6784529 Package- stacked structure, having increased memory capacity without increasing a mounting area |
| 08/31/2004 | US6784526 Integrated circuit device module |
| 08/31/2004 | US6784523 Method of fabricating semiconductor device |
| 08/31/2004 | US6784458 Random partitionable dot matrix LED display |
| 08/31/2004 | US6784087 Method of fabricating cylindrical bonding structure |
| 08/31/2004 | US6784074 Defect-free semiconductor templates for epitaxial growth and method of making same |