| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 09/22/2004 | CN1531085A Semiconductor devices |
| 09/22/2004 | CN1531069A Electronic device and producing method thereof |
| 09/22/2004 | CN1531068A Electronic device and producing method thereof |
| 09/22/2004 | CN1531067A Circuit device and producing method thereof |
| 09/22/2004 | CN1531043A Producing method for electronic device and chip carrier |
| 09/22/2004 | CN1531041A Method for packing semiconductor device on printing circuit board and the printing circuit board |
| 09/22/2004 | CN1531027A Producing method for semiconductor device, semiconductor device, circuit placode and electronic apparatus |
| 09/22/2004 | CN1168133C Semiconductor chip, semiconductor device and mfg. method therefor |
| 09/21/2004 | US6795120 Solid-state imaging apparatus and camera using the same |
| 09/21/2004 | US6794749 Chip package with grease heat sink |
| 09/21/2004 | US6794748 Substrate-less microelectronic package |
| 09/21/2004 | US6794747 Semiconductor device |
| 09/21/2004 | US6794742 Inverter module having a plurality of terminals at a predetermined pitch |
| 09/21/2004 | US6794741 Three-dimensional stacked semiconductor package with pillars in pillar cavities |
| 09/21/2004 | US6794725 Amorphous silicon sensor with micro-spring interconnects for achieving high uniformity in integrated light-emitting sources |
| 09/21/2004 | US6794686 White light source |
| 09/21/2004 | US6794674 Integrated circuit device and method for forming the same |
| 09/21/2004 | US6794653 SPECT for breast cancer detection |
| 09/21/2004 | US6794273 Semiconductor device and manufacturing method thereof |
| 09/21/2004 | US6794222 HDI module with integral conductive electromagnetic shield |
| 09/21/2004 | US6793502 Press (non-soldered) contacts for high current electrical connections in power modules |
| 09/21/2004 | US6793371 LED lamp assembly |
| 09/21/2004 | US6793123 Packaging for multi-processor shared-memory system |
| 09/16/2004 | WO2004080134A2 High frequency chip packages with connecting elements |
| 09/16/2004 | WO2004079823A2 Thermally enhanced electronic flip-chip packaging with external-connector-side die and method |
| 09/16/2004 | WO2004079797A2 High speed electronics interconnect and method of manufacture |
| 09/16/2004 | WO2004079792A2 Electrical bus with associated porous metal heat sink and method of manufacturing same |
| 09/16/2004 | WO2004079700A1 Element transfer method and display device |
| 09/16/2004 | WO2004053933A3 Composite leadframe led package and method of making the same |
| 09/16/2004 | US20040180472 Method of assembling a semiconductor device including sweeping (with a squeegee) encapsulant over the device repeatedly |
| 09/16/2004 | US20040180471 Method of manufacturing stacked semiconductor device |
| 09/16/2004 | US20040180468 Semiconductor device, method of fabricating the same and semiconductor device fabricating apparatus |
| 09/16/2004 | US20040179383 Micro power converter with multiple outputs |
| 09/16/2004 | US20040179373 Light-emitting diode light source unit |
| 09/16/2004 | US20040179359 Light source unit |
| 09/16/2004 | US20040179341 Power module |
| 09/16/2004 | US20040179145 Apparatuses and methods for flexible displays |
| 09/16/2004 | US20040178819 Multi-chip programmable logic device having configurable logic circuitry and configuration data storage on different dice |
| 09/16/2004 | US20040178514 Method of encapsulating semiconductor devices on a printed circuit board, and a printed circuit board for use in the method |
| 09/16/2004 | US20040178510 Electronic parts packaging structure and method of manufacturing the same |
| 09/16/2004 | US20040178508 Stacked semiconductor device |
| 09/16/2004 | US20040178502 Semiconductor device |
| 09/16/2004 | US20040178499 Semiconductor package with multiple sides having package contacts |
| 09/16/2004 | US20040178496 Memory expansion and chip scale stacking system and method |
| 09/16/2004 | US20040178495 Microelectronic devices and methods for packaging microelectronic devices |
| 09/16/2004 | US20040178491 Method for fabricating semiconductor components by forming conductive members using solder |
| 09/16/2004 | US20040178490 Semiconductor device |
| 09/16/2004 | US20040178488 Techniques for packaging multiple device components |
| 09/16/2004 | US20040178487 Electronic circuit unit that is easy to manufacture and method of manufacturing the same |
| 09/16/2004 | US20040178485 Semiconductor device housing plural stacked semiconductor elements |
| 09/16/2004 | US20040178482 Techniques for packaging a multiple device component |
| 09/16/2004 | US20040178473 Package with integrated inductor and/or capacitor |
| 09/16/2004 | DE10329646A1 Electronic component with several identical, parallel-connected electronic circuit units, e.g. integrated circuits |
| 09/16/2004 | DE10320646A1 Electronic component, typically integrated circuit, system support and manufacturing method, with support containing component positions in lines and columns, starting with coating auxiliary support with photosensitive layer |
| 09/16/2004 | DE10308926A1 Semiconductor chip appliance with exchange of signals between semiconductor substrates takes place via lateral contacts in substrate side faces, instead of via printed circuit board |
| 09/16/2004 | DE10308855A1 Semiconductor wafer for electronic components, with integrated circuits in lines and columns for semiconductor chips on wafer top surface with strip-shaped dividing regions between chip integrated circuits |
| 09/16/2004 | DE10308323A1 Halbleiterchipanordnung mit ROM Semiconductor chip assembly with ROM |
| 09/16/2004 | DE102004008204A1 Spritzschutz und Wärmesenke Splash guard and heat sink |
| 09/15/2004 | EP1458024A2 Interposer and semiconductor device |
| 09/15/2004 | EP1456886A1 Profiled photovoltaic roofing panel |
| 09/15/2004 | EP1456882A2 Circuit arrangement comprising electronic components on a nonconducting supporting substrate |
| 09/15/2004 | CN2641451Y Illuinating device composed of thin light-emitting diode |
| 09/15/2004 | CN1529914A Light source coupler, illuninant device, patterned conductor and method for manufacturing light source coupler |
| 09/15/2004 | CN1529913A Electromagnetic radiation sensing with signal crystal SiC |
| 09/15/2004 | CN1529902A Semiconductor device and method of making same |
| 09/15/2004 | CN1529872A IC card |
| 09/15/2004 | CN1167115C Inverse-fastening process of miniature chip |
| 09/14/2004 | US6791832 Electronic package |
| 09/14/2004 | US6791242 Uniform acoustic energy cleaning of rotating objects |
| 09/14/2004 | US6791195 Semiconductor device and manufacturing method of the same |
| 09/14/2004 | US6791192 Multiple chips bonded to packaging structure with low noise and multiple selectable functions |
| 09/14/2004 | US6791183 Power semiconductor module and cooling element for holding the power semiconductor module |
| 09/14/2004 | US6791178 Multi-chip module including semiconductor devices and a wiring substrate for mounting the semiconductor devices |
| 09/14/2004 | US6791175 Stacked type semiconductor device |
| 09/14/2004 | US6791174 Semiconductor device with gel resin vibration limiting member |
| 09/14/2004 | US6791170 Onboard semiconductor device |
| 09/14/2004 | US6791168 Semiconductor package with circuit side polymer layer and wafer level fabrication method |
| 09/14/2004 | US6791167 Resin-molded device and manufacturing apparatus thereof |
| 09/14/2004 | US6791166 Stackable lead frame package using exposed internal lead traces |
| 09/14/2004 | US6791127 Semiconductor device having a condenser chip for reducing a noise |
| 09/14/2004 | US6790748 Thinning techniques for wafer-to-wafer vertical stacks |
| 09/14/2004 | US6790710 Method of manufacturing an integrated circuit package |
| 09/14/2004 | US6790706 Apparatus and method for leadless packaging of semiconductor devices |
| 09/14/2004 | US6790704 Method for capacitively coupling electronic devices |
| 09/14/2004 | US6790702 Three-dimensional multichip module |
| 09/14/2004 | US6790692 Method for fabricating semiconductor device |
| 09/14/2004 | US6790691 Opto-electronic device integration |
| 09/14/2004 | US6790684 Wafer on wafer packaging and method of fabrication for full-wafer burn-in and testing |
| 09/10/2004 | WO2004077903A1 Method for manufacturing an electronic module, and an electronic module |
| 09/10/2004 | WO2004077902A1 Method for manufacturing an electronic module |
| 09/10/2004 | WO2004077578A2 Lighting module based on light-emitting diodes and method for the production thereof |
| 09/10/2004 | WO2004077560A1 Multilayer printed wiring board |
| 09/10/2004 | WO2004077559A1 Integrated circuit package and method for producing it |
| 09/10/2004 | WO2004077548A2 Connection technology for power semiconductors |
| 09/10/2004 | WO2004077545A1 Semiconductor chip for constructing a semiconductor chip stack |
| 09/10/2004 | WO2004077525A2 Ball grid array with bumps |
| 09/10/2004 | WO2004077450A1 Semiconductor chip arrangement with rom |
| 09/10/2004 | WO2004057666A3 Rf power transistor with internal bias feed |
| 09/10/2004 | WO2004053973A8 Method of packaging integrated circuits, and integrated circuit packages produced by the method |
| 09/10/2004 | WO2003085725A3 In package power supplies for integrated circuits |