| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 09/30/2004 | US20040188837 Wafer level package, multi-package stack, and method of manufacturing the same |
| 09/30/2004 | US20040188834 Semiconductor device |
| 09/30/2004 | US20040188827 Semiconductor device and method of assembling the same |
| 09/30/2004 | US20040188824 Semiconductor interconnect having laser machined contacts |
| 09/30/2004 | US20040188822 Semiconductor chip, semiconductor wafer, semiconductor device and method of manufacturing the same, circuit board, and electronic instrument |
| 09/30/2004 | US20040188820 Packaged microelectronic devices and methods for assembling microelectronic devices |
| 09/30/2004 | US20040188819 Wafer level methods for fabricating multi-dice chip scale semiconductor components |
| 09/30/2004 | US20040188818 Multi-chips module package |
| 09/30/2004 | US20040188811 Circuit package apparatus, systems, and methods |
| 09/30/2004 | US20040188782 Semiconductor device having multiple substrates |
| 09/30/2004 | US20040188719 Light-emitting device |
| 09/30/2004 | US20040188718 Semiconductor apparatus having a large-size bus connection |
| 09/30/2004 | US20040188706 High-power, integrated AC switch module with distributed array of hybrid devices |
| 09/30/2004 | US20040187909 Solar cell unit and method for mounting the solar cell unit on roof |
| 09/30/2004 | US20040187308 Method for fixing an electrical element and a module with an electrical element fixed thus |
| 09/30/2004 | DE19923523B4 Halbleitermodul mit übereinander angeordneten, untereinander verbundenen Halbleiterchips Semiconductor module arranged with one above the other, interconnected semiconductor chips |
| 09/29/2004 | EP1463116A2 Method for fabricating self-assembling microstructures |
| 09/29/2004 | EP1461836A2 Method for the production of light-guiding led bodies in two chronologically separate stages |
| 09/29/2004 | EP1461833A1 Matrix-addressable apparatus with one or more memory devices |
| 09/29/2004 | EP1461715A1 Reconfigurable processor module comprising hybrid stacked integrated circuit die elements |
| 09/29/2004 | EP1461645A2 Uniform illumination system |
| 09/29/2004 | EP0984494B1 Solar battery |
| 09/29/2004 | EP0853337B1 Method for manufacturing semiconductor device |
| 09/29/2004 | CN2645242Y Combination illuminator |
| 09/29/2004 | CN1533687A Method and apparatus for fabricating circuit board, with three dimensional surface mounted array of semiconductor chips |
| 09/29/2004 | CN1533605A Solder-free PCB assembly |
| 09/29/2004 | CN1533604A Semiconductor device and its producing method, circuit board and electronic instrment |
| 09/29/2004 | CN1533603A Semiconductor device and its producing method, circuit board and electronic instrument |
| 09/29/2004 | CN1532954A Light-emitting diode lamp |
| 09/29/2004 | CN1532932A Semiconductor device and its producing method, electronic device and electronic instrument |
| 09/29/2004 | CN1532931A Semiconductor device and producing method, semiconductor package, electronic device and producing method, electronic instrment |
| 09/29/2004 | CN1532930A Semiconductor, electronic device and their producing method and electronic instrument |
| 09/29/2004 | CN1532924A Wafer grade package, multiple package overlapping and its producing method |
| 09/29/2004 | CN1532904A Method for producing semiconductor device, semiconductr device and electronic device |
| 09/29/2004 | CN1169220C Electronic part with laminated assembly and manufacturing method thereof |
| 09/29/2004 | CN1169215C Semiconductor device and method for manufacture thereof |
| 09/28/2004 | US6798679 Semiconductor memory module |
| 09/28/2004 | US6798307 Sheet substrate for crystal oscillator and method of manufacturing surface-mount crystal oscillators using same |
| 09/28/2004 | US6798295 Single package multi-chip RF power amplifier |
| 09/28/2004 | US6798071 Semiconductor integrated circuit device |
| 09/28/2004 | US6798070 Electronic device assembly and a method of connecting electronic devices constituting the same |
| 09/28/2004 | US6798061 Multiple semiconductor chip (multi-chip) module for use in power applications |
| 09/28/2004 | US6798057 Thin stacked ball-grid array package |
| 09/28/2004 | US6798056 Semiconductor module having an upper layer semiconductor package overlying a lower layer semiconductor package |
| 09/28/2004 | US6798055 Die support structure |
| 09/28/2004 | US6798054 Method of packaging multi chip module |
| 09/28/2004 | US6798051 Connection of packaged integrated memory chips to a printed circuit board |
| 09/28/2004 | US6798049 Semiconductor package and method for fabricating the same |
| 09/28/2004 | US6798045 Lead frame, circuit board with lead frame, and method for producing the lead frame |
| 09/28/2004 | US6797984 Light-emitting diode packaging structure having rectification circuit |
| 09/28/2004 | US6797890 High frequency module device and method for its preparation |
| 09/28/2004 | US6797603 Semiconductor device and method of production of same |
| 09/28/2004 | US6797538 Memory package |
| 09/23/2004 | WO2004082344A1 A substrate structure, a method and an arrangement for producing such substrate structure |
| 09/23/2004 | WO2004081764A2 Multi-chip programmable logic device having configurable logic circuitry and configuration data storage on different dice |
| 09/23/2004 | WO2004081306A2 Modular shade system with solar tracking panels |
| 09/23/2004 | WO2004061954A3 Electronic unit integrated into a flexible polymer body |
| 09/23/2004 | WO2003092042A3 Clamping assembly for high-voltage solid state devices |
| 09/23/2004 | US20040185195 Laminated glass and structural glass with integrated lighting, sensors and electronics |
| 09/23/2004 | US20040184270 LED light module with micro-reflector cavities |
| 09/23/2004 | US20040184250 Multi-chips stacked package |
| 09/23/2004 | US20040184240 Semiconductor package with heat sink |
| 09/23/2004 | US20040183480 Lighting assembly |
| 09/23/2004 | US20040183209 High performance IC chip having discrete decoupling capacitors attached to its IC surface |
| 09/23/2004 | US20040183207 Multi-substrate microelectronic packages and methods for manufacture |
| 09/23/2004 | US20040183206 Contact member stacking system and method |
| 09/23/2004 | US20040183193 Packaging method, packaging structure and package substrate for electronic parts |
| 09/23/2004 | US20040183192 Semiconductor device assembled into a chip size package |
| 09/23/2004 | US20040183190 Multi-chips stacked package |
| 09/23/2004 | US20040183188 Semiconductor module and semiconductor device |
| 09/23/2004 | US20040183185 Packaged integrated circuits and methods of producing thereof |
| 09/23/2004 | US20040183183 Integrated circuit stacking system and method |
| 09/23/2004 | US20040183182 Apparatus incorporating small-feature-size and large-feature-size components and method for making same |
| 09/23/2004 | US20040183181 Stacked package for integrated circuits |
| 09/23/2004 | US20040183180 Multi-chips stacked package |
| 09/23/2004 | US20040183179 Package structure for a multi-chip integrated circuit |
| 09/23/2004 | US20040183173 Semiconductor device |
| 09/23/2004 | US20040183170 Semiconductor device and method for manufacturing the same, circuit substrate and electronic apparatus |
| 09/23/2004 | US20040183161 Microelectronic device fabricating method, method of forming a pair of conductive device components of different base widths from a common deposited conductive layer, and integrated circuitry |
| 09/23/2004 | US20040183089 Multicolor light-emitting lamp and light source |
| 09/23/2004 | US20040183088 Multi element, multi color solid state LED/laser |
| 09/23/2004 | US20040182595 Flexible microstrip signal and power bus cable |
| 09/23/2004 | DE20122195U1 Trägersubstrat für elektronische Bauteile Substrate for electronic components |
| 09/23/2004 | DE10309869A1 Semiconductor chip production process, fills contact holes with conductive material to connect circuits to conductor rail and then divides into chips |
| 09/23/2004 | DE102004011958A1 Mikro-Stromrichter mit mehreren Ausgängen Micro-power converter with multiple outputs |
| 09/23/2004 | DE102004001829A1 Halbleitervorrichtung Semiconductor device |
| 09/22/2004 | EP1460688A2 Resin sealed electronic assembly and method of manufacturing the same |
| 09/22/2004 | EP1459380A1 Memory device packaging including stacked passive devices and method for making the same |
| 09/22/2004 | EP1459355A2 Stacking multiple devices using direct soldering |
| 09/22/2004 | CN2643151Y AC and DC shareable Christmas illumination structure |
| 09/22/2004 | CN1531757A Substrate for electroluminescent display device and method of manufacturing said substrate |
| 09/22/2004 | CN1531119A LED module with high-efficient radiation |
| 09/22/2004 | CN1531093A Microminiature power converter with multiple output |
| 09/22/2004 | CN1531092A Resin sealing semiconductor device and producing method thereof |
| 09/22/2004 | CN1531091A Semiconductor device, electronic apparatus, carrier placode, their manufacturing methods and electronic equipment |
| 09/22/2004 | CN1531090A Semiconductor device, electronic apparatus and their manufacturing methods, electronic equipment |
| 09/22/2004 | CN1531089A Semiconductor device, electronic apparatus and their manufacturing methods, elecronic equipment |
| 09/22/2004 | CN1531088A Semiconductor device, electronic apparatus and their manufacturing methods, electronic equipment |
| 09/22/2004 | CN1531087A Laminated semiconductor sealer |
| 09/22/2004 | CN1531086A Semiconductor device, producing method thereof, electronic apparatus and method |