Patents
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
10/2004
10/14/2004US20040201096 Wiring circuit board, manufacturing method for the wiring circuit board, and circuit module
10/14/2004US20040201095 Through-via vertical interconnects, through-via heat sinks and associated fabrication methods
10/14/2004US20040201094 Semiconductor device
10/14/2004US20040201091 Stacked module systems and methods
10/14/2004US20040201089 Semiconductor devices and manufacturing methods therefore
10/14/2004US20040201088 Semiconductor multi-chip package and fabrication method
10/14/2004US20040201087 Stack package made of chip scale packages
10/14/2004US20040201085 Multi-chip circuit module and method for producing the same
10/14/2004US20040201082 Resin sealing-type semiconductor device and method for manufacturing the same
10/14/2004US20040201080 Leadless leadframe electronic package and IR transceiver incorporating same
10/14/2004US20040201056 Audio signal processing circuit and a display device incorporating the same
10/14/2004US20040200885 Methods for assembling semiconductor devices in stacked arrangements by positioning spacers therebetween
10/14/2004US20040200573 Opto-electronic device integration
10/14/2004US20040200521 Solar cell
10/14/2004DE10315131A1 Scheinwerfer für Fahrzeuge Headlights for vehicles
10/14/2004DE10308095B3 Elektronisches Bauteil mit mindestens einem Halbleiterchip auf einem Schaltungsträger und Verfahren zur Herstellung desselben The same electronic component having at least a semiconductor chip on a circuit carrier and methods for preparing
10/14/2004CA2520992A1 Method for manufacturing an electronic module and an electronic module
10/13/2004EP1467417A2 Light emitting diode lamp
10/13/2004EP1467413A1 Light receiving or emitting semiconductor apparatus
10/13/2004EP1467407A1 Power semiconductor module
10/13/2004EP1467406A1 Modular power semiconductor module
10/13/2004EP1466371A1 Multi substrate organic light emitting devices
10/13/2004EP1466363A1 Semiconductor device with co-packaged die
10/13/2004EP1466348A2 Optical chip packaging via through hole
10/13/2004EP0917733B1 Integrated circuit device manufacture
10/13/2004CN2648605Y Water-cooled plate type electronic power semiconductor device assembly
10/13/2004CN2648597Y Plate type electronic power semiconductor device assembly
10/13/2004CN1537328A High temperature electrostatic chuck
10/13/2004CN1536641A Semiconductor integrated circuit device and its mfg. method
10/13/2004CN1536263A Vehicular front headlight and semiconductor luminous element
10/13/2004CN1171321C Lighting system
10/13/2004CN1171312C Multiwafer integrated circuit package structure
10/13/2004CN1171298C 半导体器件 Semiconductor devices
10/13/2004CN1171295C Assembling method for monolithic electronic member and monolithic electronic member
10/12/2004US6803732 LED array and LED module with chains of LEDs connected in parallel
10/12/2004US6803663 Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board
10/12/2004US6803655 Semiconductor integrated circuit device with EMI prevention structure
10/12/2004US6803651 Optoelectronic semiconductor package device
10/12/2004US6803646 Semiconductor device having first chip secured within resin layer and second chip secured on resin layer
10/12/2004US6803640 Capacitor
10/12/2004US6803605 Method to GaAs based lasers and a GaAs based laser
10/12/2004US6803515 Solar-cell-installed structure, and photovoltaic power generation system
10/12/2004US6803254 Wire bonding method for a semiconductor package
10/12/2004US6803253 Method for laminating and mounting semiconductor chip
10/12/2004US6802745 Housing for accomodating a power semiconductor module and contact element for use in the housing
10/07/2004WO2004086497A2 Method for producing chip stacks
10/07/2004WO2004063980B1 Module for a hybrid card
10/07/2004WO2004038801A3 Light emitting diode assembly for ac operation and methods of fabricating same
10/07/2004WO2004034240A3 A scalable computer system having surface-mounted capacitive couplers for intercommunication
10/07/2004US20040199890 Semiconductor integrated circuit device and manufacturing method thereof
10/07/2004US20040198081 Microelectronic spring contact elements
10/07/2004US20040197956 Memory expansion and chip scale stacking system and method
10/07/2004US20040197951 Membrane IC fabrication
10/07/2004US20040196682 Semiconductor unit having two device terminals for every one input/output signal
10/07/2004US20040196663 Vehicular headlamp and semiconductor light emitting element
10/07/2004US20040196635 Stacked chip package with heat transfer wires
10/07/2004US20040196634 Metal ball attachment of heat dissipation devices
10/07/2004US20040195985 Power stage for driving an electric machine
10/07/2004US20040195700 Multi-chip package combining wire-bonding and flip-chip configuration
10/07/2004US20040195686 Semiconductor device and method of manufacturing the same
10/07/2004US20040195682 Semiconductor device
10/07/2004US20040195681 Multi-chip package
10/07/2004US20040195680 Arrangement comprising at least two different electronic semiconductor circuits
10/07/2004US20040195671 Semiconductor device
10/07/2004US20040195668 Semiconductor device, electronic device, electronic equipment, method of manufacturing semiconductor device, and method of manufacturing electronic device
10/07/2004US20040195667 Semiconductor multipackage module including processor and memory package assemblies
10/07/2004US20040195666 Stacked module systems and methods
10/07/2004US20040195649 Semiconductor device
10/07/2004US20040195617 Nonvolatile semiconductor memory device and nonvolatile semiconductor memory system
10/07/2004US20040195591 Digital and RF system and method therefor
10/07/2004US20040194993 Compact circuit module
10/07/2004US20040194856 Powder containing soft and hard ferromagnetic crystalline phases; heat treatment, rapid cooling; uniformity, performance
10/07/2004US20040194301 Method and apparatus for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips
10/07/2004US20040194294 Methods for manufacturing resistors using a sacrificial layer
10/07/2004DE102004013056A1 Verfahren zur Herstellung eines Halbleiterbauelements und zugehörige Leiterplatte A process for producing a semiconductor device and associated circuit board
10/06/2004EP1465256A1 A method of producing a light source and a light source assembly
10/06/2004EP1465244A2 Integrated circuit package with exposed die surfaces and auxiliary attachment
10/06/2004EP1464088A1 Electroluminescent device
10/06/2004CN2646813Y Composite true color LED matrix module
10/06/2004CN2646548Y Electronic lamp
10/06/2004CN1534772A Semiconductor device and mfg. method thereof
10/06/2004CN1534771A Semiconductor device, 3-D mounted semiconductor device mfg. method, circuitboard and electronic apparatus
10/06/2004CN1534770A Semiconductor device, circuit substrate and electronic apparatus
10/06/2004CN1534355A Assembly for lighting device, lighting device, back side lighting device and display
10/06/2004CN1170315C Semiconductor chip package and method for fabricating the same
10/06/2004CN1169436C Threatening device
10/05/2004US6800996 Light emitting device, display apparatus with an array of light emitting devices, and display apparatus method of manufacture
10/05/2004US6800945 Multi-chip semiconductor device with specific chip arrangement
10/05/2004US6800942 Vertically mountable semiconductor device and methods
10/05/2004US6800934 Power module
10/05/2004US6800930 Semiconductor dice having back side redistribution layer accessed using through-silicon vias, and assemblies
10/05/2004US6799865 LED-based planar light source
10/05/2004US6799864 High power LED power pack for spot module illumination
09/2004
09/30/2004US20040192045 Apparatus and methods for maskless pattern generation
09/30/2004US20040192033 Semiconductor device, method of manufacturing the same, circuit board, and electronic instrument
09/30/2004US20040192029 Systems and methods for electrically isolating portions of wafers
09/30/2004US20040188855 Semiconductor device and manufacturing methods thereof
09/30/2004US20040188854 Semiconductor device
09/30/2004US20040188853 Semiconductor device
09/30/2004US20040188852 Semiconductor device