H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices

Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
10/2004
10/28/2004	US20040212067 Multi-chips stacked package
10/28/2004	US20040212066 Multi-chips stacked package
10/28/2004	US20040212065 Multi-chips package
10/28/2004	US20040212064 Multi-chips stacked package
10/28/2004	US20040212059 Circuit device and method for manufacturing the same
10/28/2004	US20040212056 [chip package structure]
10/28/2004	US20040212034 Semiconductor device, manufacturing method of the same and semiconductor module
10/28/2004	US20040211583 Surface-mount-type high-frequency module
10/28/2004	US20040211460 Thin film solar cell thermal radiator
10/28/2004	US20040211456 Apparatus, system, and method of diagnosing individual photovoltaic cells
10/28/2004	DE202004012322U1 Lamp based on light-emitting diodes for use in vehicle, includes thermally conductive sheet attached to carrier introduced into lamp holder
10/28/2004	DE10345966A1 Halbleitervorrichtung Semiconductor device
10/28/2004	DE10339216A1 Three-point power converter, has heat sink and multiple different semiconductor devices, arranged so that dissipated energy decreases in propagation direction of cooling medium
10/28/2004	DE10333800B3 Semiconductor component e.g. bridge circuit, using chip-on-chip technology with end sections of electrical terminal bonding wires as contact region between lower and upper semiconductor elements
10/28/2004	DE102004010905A1 Kapazitiver Halbleitersensor Capacitive semiconductor sensor
10/28/2004	DE10022267B4 Halbleiterbauelement mit räumlich getrennten Halbleiterkörpern A semiconductor device comprising spatially separated semiconductor bodies
10/28/2004	CA2773112A1 Metal base circuit board and its production process
10/28/2004	CA2773085A1 Metal base circuit board and its production process
10/28/2004	CA2773076A1 Metal base circuit board and its production process
10/27/2004	EP1471778A1 Memory module having space-saving arrangement of memory chips and memory chip therefor
10/27/2004	EP1471604A1 Electronic component module
10/27/2004	EP1471571A1 Semiconductor device and manufacturing method thereof
10/27/2004	EP1470743A2 Power module
10/27/2004	EP1470598A2 Structures and materials for dye sensitized solar cells
10/27/2004	EP1470588A2 Split-gate power module and method for suppressing oscillation therein
10/27/2004	EP1470586A2 Power semiconductor, and method for producing the same
10/27/2004	EP1470583A1 Chip and wafer integration process using vertical connections
10/27/2004	EP0870627B1 Semiconductor device
10/27/2004	CN1541420A Multicolor light-emitting lamp and light source
10/27/2004	CN1541419A Method to GaAs based lasers and GaAs based laser
10/27/2004	CN1540771A Solar cell modular and solar cell modular array
10/27/2004	CN1540755A Semiconductor integrated circuit device and electronic card using smae
10/27/2004	CN1540750A Surface-mounting high frequency modular
10/27/2004	CN1540688A High frequency inductor with low inductance and less inductance fluctuation, and its mfg. method
10/27/2004	CN1540665A Memory modular and memory system
10/27/2004	CN1173609C Single system module for electric/electronic equipment
10/27/2004	CN1173417C Light-emitting semiconductor device and surface-emitting device
10/27/2004	CN1173416C Circular arc flat-bottom cupped light emitting diode manufacturing method
10/26/2004	US6809475 Led lamp with light-emitting junctions arranged in a three-dimensional array
10/26/2004	US6809421 Multichip semiconductor device, chip therefor and method of formation thereof
10/26/2004	US6809416 Low thermal resistance; heat spreader in thermal contact with the semiconductor die; connected by vias to selected conductive terminals on the second surface
10/26/2004	US6809413 Microelectronic device package with an integral window mounted in a recessed lip
10/26/2004	US6809411 Low-inductance semiconductor components
10/26/2004	US6809410 Power semiconductor module
10/26/2004	US6809251 Inclined photovoltaic assembly
10/26/2004	US6808950 Semiconductor light-emitting device and method for manufacturing the device
10/21/2004	WO2004090977A1 Encapsulated power semiconductor assembly
10/21/2004	WO2004090737A2 Sense amplifying latch with low swing feedback
10/21/2004	US20040209400 Process and apparatus for packaging a tape substrate
10/21/2004	US20040209399 Electronic parts packaging structure and method of manufacturing the same
10/21/2004	US20040209396 Electronic unit integrated into a flexible polymer body
10/21/2004	US20040208210 Light-emitting apparatus package, light-emitting apparatus, backlight apparatus, and display apparatus
10/21/2004	US20040207313 LED device and portable telephone, digital camera and LCD apparatus using the same
10/21/2004	US20040207089 Semiconductor device, method of manufacturing three-dimensional stacking type semiconductor device, circuit board, and electronic instrument
10/21/2004	US20040207082 Semiconductor package and production method
10/21/2004	US20040207081 Semiconductor component having thinned substrate, backside pin contacts and circuit side contacts
10/21/2004	US20040207070 High power semiconductor module
10/21/2004	US20040207065 [stack-type multi-chip package and method of fabricating bumps on the backside of a chip]
10/21/2004	US20040207061 Multi-chip electronic package and cooling system
10/21/2004	US20040207058 Side braze packages
10/21/2004	US20040207049 Electronic component and semiconductor wafer, and method for producing the same
10/21/2004	US20040206964 LED device and manufacturing method thereof
10/21/2004	US20040206801 Electronic devices including metallurgy structures for wire and solder bonding
10/21/2004	US20040206534 Power electronics component
10/21/2004	DE102004015654A1 Endstufe zum Ansteuern einer elektrischen Maschine Power amplifier for driving an electric machine
10/21/2004	DE102004014709A1 Halbleiteranordnung Semiconductor device
10/21/2004	DE102004014444A1 Halbleiteranordnung mit mehreren Substraten A semiconductor device having a plurality of substrates
10/20/2004	EP1469516A1 White-light emitting semiconductor device using a plurality of light emitting diode chips
10/20/2004	EP1469515A2 Power stage to drive an electric machine
10/20/2004	EP1469512A1 Module device
10/20/2004	EP1469490A1 An audio signal processing circuit and a display device incorporating the same
10/20/2004	EP1468594A2 High density 3-d integrated circuit package
10/20/2004	EP1468449A2 Multi-chip module semiconductor devices
10/20/2004	CN2649942Y Multi-colour LED light source decorative lamp
10/20/2004	CN1539171A Improved solar cell
10/20/2004	CN1539168A Semiconductor assembly with multiple semiconductor chips
10/20/2004	CN1539163A Semiconductor component with at least one semiconductor chip on base chip serving as substrate and method for production thereof
10/20/2004	CN1538538A LED lamp
10/20/2004	CN1538520A Semiconductor packing and manufacturing method
10/19/2004	US6806559 Method and apparatus for connecting vertically stacked integrated circuit chips
10/19/2004	US6806536 Multiple-function electronic chip
10/19/2004	US6806428 Module component and method of manufacturing the same
10/19/2004	US6806415 Method for controlling a solar power generation system having a cooling mechanism
10/19/2004	US6806179 Connection substrate, a method of manufacturing the connection substrate, a semiconductor device, and a method of manufacturing the semiconductor device
10/19/2004	US6806176 Semiconductor device and method of manufacturing the same, circuit board and electronic instrument
10/19/2004	US6806120 Contact member stacking system and method
10/14/2004	WO2004089048A1 Method for manufacturing an electronic module and an electronic module
10/14/2004	WO2004088761A1 Light-emitting panel
10/14/2004	WO2004088731A2 Methods for fabricating three-dimensional all organic interconnect structures
10/14/2004	WO2004088727A2 Multi-chip ball grid array package and method of manufacture
10/14/2004	WO2004088201A1 Vehicle headlamp
10/14/2004	WO2004073013A3 Electronic component comprising a semiconductor chip and method for producing said component
10/14/2004	WO2004038759A3 Method and apparatus for using light emitting diodes
10/14/2004	WO2004032235A3 Device for producing a bundled light flux
10/14/2004	US20040203244 Electronic component and fabricating method
10/14/2004	US20040203193 Semiconductor device substrate, semiconductor device, and manufacturing method thereof
10/14/2004	US20040203190 Stacked packages
10/14/2004	US20040201987 LED lamp
10/14/2004	US20040201970 Chip interconnection method and apparatus
10/14/2004	US20040201109 Semiconductor devices, manufacturing methods therefore, circuit substrates and electronic devices

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