| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 08/05/2014 | US8796115 Light-emitting diode arrangement and method for producing the same |
| 08/05/2014 | US8796074 Method of manufacturing semiconductor device |
| 08/05/2014 | US8796047 Semiconductor chip repair by stacking of a base semiconductor chip and a repair semiconductor chip |
| 08/05/2014 | US8794797 Hybrid illuminator |
| 08/05/2014 | US8794501 Method of transferring a light emitting diode |
| 07/31/2014 | WO2014116538A1 Embedded package on package systems |
| 07/31/2014 | WO2014114003A1 Semiconductor device including embedded controller die and method of making same |
| 07/31/2014 | US20140212996 Microelectronic package with stacked microelectronic units and method for manufacture thereof |
| 07/31/2014 | US20140209944 White led apparatus |
| 07/31/2014 | US20140209941 Light emitting device and method of fabricating the same |
| 07/31/2014 | US20140209939 Ceramic led package |
| 07/31/2014 | US20140209928 Light source assembly and a process for producing a light source assembly |
| 07/31/2014 | DE10223850B4 Verfahren zum Verbinden eines optoelektrischen Moduls mit einem Halbleitergehäuse A method for connecting an optoelectric module with a semiconductor package |
| 07/31/2014 | DE102014100878A1 Chipanordnung und Chipbaugruppe Chip array and chip assembly |
| 07/31/2014 | DE102013201327A1 Leiterplatte, optoelektronisches Bauteil und Anordnung optoelektronischer Bauteile PCB, optoelectronic device and arrangement of optoelectronic components |
| 07/31/2014 | DE102009042600B4 Herstellungsverfahren für ein Leistungshalbleitermodul Manufacturing method for a power semiconductor module |
| 07/31/2014 | DE102009037257B4 Leistungshalbleitermodul mit Schaltungsträger und Lastanschlusselement sowie Herstellungsverfahren hierzu Power semiconductor module with circuit carriers and load connection element and manufacturing method therefor |
| 07/30/2014 | EP2760047A2 Light emitting module, lighting apparatus, and lighting fixture |
| 07/30/2014 | EP2760046A2 Lamp unit |
| 07/30/2014 | EP2760044A1 Embedded package on package systems |
| 07/30/2014 | EP2759067A1 Wireless communication with dielectric medium |
| 07/30/2014 | CN203746912U 一种高性能半导体热电元件 A high-performance semiconductor thermoelectric element |
| 07/30/2014 | CN203746910U 一种大功率led芯片主动对流散热式板级封装结构 One kind of power led chip active convection-style board-level package structure |
| 07/30/2014 | CN203746909U 一种灯丝型led One kind of filament type led |
| 07/30/2014 | CN203746902U 具有快速插接引脚的透明u型led发光片及构成的led灯泡 With a quick plug pin u-transparent sheet and led bulb led light constituted |
| 07/30/2014 | CN203746880U 一种水流分布均匀的热量回收用集热管道 A heat recovery water distribution pipes with collectors |
| 07/30/2014 | CN203746877U 一种并联式低倍聚光伏组件 Kind of Parallel Low-fold poly PV modules |
| 07/30/2014 | CN203746852U 一种平板式功率半导体模块 A flat-type power semiconductor module |
| 07/30/2014 | CN203746851U 新型耐高压二极管 The new high voltage diode |
| 07/30/2014 | CN203746850U 一种全方位出光的高效led模组器件 A holistic and efficient light led module devices |
| 07/30/2014 | CN203746849U 新型玻璃基板光源 The new glass substrate source |
| 07/30/2014 | CN203746848U 一种n电极延伸线点状分布的正装led芯片 N - electrode extension cord punctate distribution suits led chip |
| 07/30/2014 | CN203746847U 一种led灯丝及照明器具 One kind of led filament and Lighting |
| 07/30/2014 | CN203746846U 一种led发光结构 One kind of led light structure |
| 07/30/2014 | CN203746845U 一种4πLED发光元件 One kind of light-emitting elements 4πLED |
| 07/30/2014 | CN203746844U 功率模块封装结构 Power module package structure |
| 07/30/2014 | CN203746843U 一种功率半导体模块 A power semiconductor module |
| 07/30/2014 | CN203746842U 一种散热一体化功率模块的封装结构 A package structure integrated power module cooling |
| 07/30/2014 | CN203746841U 功率半导体模块 Power semiconductor module |
| 07/30/2014 | CN203746840U 一种大功率半桥模块 One kind of high-power half-bridge module |
| 07/30/2014 | CN203746839U 高功率塑封瞬时抑制二极管 Plastic high power transient suppression diodes |
| 07/30/2014 | CN203746838U 新型复合二极管 New composite diode |
| 07/30/2014 | CN203746837U 一种容量为4G×16bit的立体封装NAND FLASH存储器 One kind of capacity for 4G × 16bit stereo package NAND FLASH memory |
| 07/30/2014 | CN203746832U 半导体芯片和半导体器件 Semiconductor chips and semiconductor devices |
| 07/30/2014 | CN203746829U 一种小功率绝缘栅双极性晶体管全桥模块 A small-power insulated gate bipolar transistor full bridge modules |
| 07/30/2014 | CN203745763U 一种消除液晶显示模组背光源暗影的结构 For eliminating LCD backlight module structure Shadow |
| 07/30/2014 | CN103958280A 电子组件 Electronic Components |
| 07/30/2014 | CN103956422A 一种led灯丝 One kind of led filament |
| 07/30/2014 | CN103956421A 基于透明荧光陶瓷的led灯 Based on transparent ceramics led fluorescent lamp |
| 07/30/2014 | CN103956360A 集成音乐封装的引脚式led Integrated music style led pin package |
| 07/30/2014 | CN103956359A 单端供电全向led灯丝及其制备方法 Single-ended power supply omnidirectional led filament and its preparation method |
| 07/30/2014 | CN103956358A Led模组的散热结构及散热方法 Thermal structure and thermal methods Led module |
| 07/30/2014 | CN103956357A 一种led灯丝的制造方法 A method of manufacturing a filament led |
| 07/30/2014 | CN103956356A 一种高效导热的大功率led集成封装结构 An efficient thermal power led integrated package |
| 07/30/2014 | CN103956355A 一种全光谱cob光源 An all-spectrum light source cob |
| 07/30/2014 | CN103956330A 用于集成电路及类似物的侧堆叠互连 Integrated circuits and the like for the side of the stack of interconnect |
| 07/30/2014 | CN103953902A Led驱动电源大芯片 Led drive power big chip |
| 07/30/2014 | CN103021989B 一种多组件的芯片封装结构 A multi-chip package assembly |
| 07/30/2014 | CN102637681B 垂直式发光器件及其制作方法 Vertical light emitting device and manufacturing method thereof |
| 07/30/2014 | CN102484099B 用于不同半导体裸片和/或晶片的半导体晶片到晶片结合 The semiconductor wafer is used for different semiconductor die and / or wafer to wafer bonding |
| 07/30/2014 | CN102420223B 电路装置及其制造方法 Circuit device and manufacturing method thereof |
| 07/30/2014 | CN102412245B 发光组件及其制作方法 The lighting assembly and manufacturing method thereof |
| 07/30/2014 | CN102379038B 电子器件安装构造及电子器件安装方法 The electronic component mounting structure and an electronic device mounting method |
| 07/30/2014 | CN102246615B 母线系统得到冷却的功率转换器模块 The bus system has been cooled power converter module |
| 07/30/2014 | CN102246322B 用于制造光伏模块的方法和光伏模块 Method for manufacturing a photovoltaic module and a photovoltaic module |
| 07/30/2014 | CN102113118B 用于电线杆分布式太阳能发电的系统和方法 System and method for utility pole distributed solar power generation for |
| 07/30/2014 | CN101728467B 发光装置、背光模块及液晶显示器 Light-emitting device, backlight module and LCD display |
| 07/29/2014 | US8793547 3D built-in self-test scheme for 3D assembly defect detection |
| 07/29/2014 | US8791662 Power semiconductor module, electric-power conversion apparatus, and railway vehicle |
| 07/29/2014 | US8791562 Stack package and semiconductor package including the same |
| 07/29/2014 | US8791554 Substrates for semiconductor devices including internal shielding structures and semiconductor devices including the substrates |
| 07/29/2014 | US8791477 Light emitting device array |
| 07/29/2014 | US8790963 LED array formed by interconnected and surrounded LED chips |
| 07/29/2014 | US8790742 Method for manufacturing 3D circuits from bare die or packaged IC chips by microdispensed interconnections |
| 07/24/2014 | US20140206143 Chip stack with electrically insulating walls |
| 07/24/2014 | US20140203457 Stacked die package, system including the same, and method of manufacturing the same |
| 07/24/2014 | US20140203454 Semiconductor device and semiconductor module |
| 07/24/2014 | US20140203428 Chip stack with electrically insulating walls |
| 07/24/2014 | US20140203384 Push-Pull Magnetoresistive Sensor Bridges and Mass Fabrication Method |
| 07/24/2014 | US20140203306 Semiconductor light-emitting device |
| 07/24/2014 | DE102014100743A1 Chipgehäuse und Verfahren zu seiner Herstellung Chip package and process for its preparation |
| 07/24/2014 | DE102013207507B3 Leistungsmodul, Stromrichter und Antriebsanordnung mit einem Leistungsmodul Power module, power converter and drive assembly with a power module |
| 07/24/2014 | DE102013200990A1 Beleuchtungsanordnung mit optoelektronischem Bauelement Lighting arrangement with optoelectronic device |
| 07/24/2014 | DE102013100711A1 Verfahren zur Herstellung einer Vielzahl optoelektronischer Bauelemente und optoelektronisches Bauelement A process for the production of a variety of optoelectronic devices and optoelectronic component |
| 07/24/2014 | DE102013100388B4 Bauelement mit einer MEMS Komponente und Verfahren zur Herstellung Device having a MEMS component and methods for making |
| 07/23/2014 | EP2757586A1 Semiconductor power module and method for manufacturing the same |
| 07/23/2014 | CN203733847U Led封装结构 Led package structure |
| 07/23/2014 | CN203733839U Cob光源模块 Cob light source module |
| 07/23/2014 | CN203733796U 一种可编程芯片与flash die封装的布图装置 With a programmable chip and flash die package layout device |
| 07/23/2014 | CN203733795U 一种led封装结构 One kind of led package structure |
| 07/23/2014 | CN203733794U 一种led灯丝及灯具 One kind of led lamps and filament |
| 07/23/2014 | CN203733793U 一种led灯丝及发光装置 One kind of filament and the light-emitting device led |
| 07/23/2014 | CN203733792U Led灯丝 Led filament |
| 07/23/2014 | CN203733791U 半导体叠层封装结构 Semiconductor laminated packaging structure |
| 07/23/2014 | CN203733790U 一种内部去耦的集成电路封装 An internal decoupling an integrated circuit package |
| 07/23/2014 | CN203733786U 半导体器件 Semiconductor devices |
| 07/23/2014 | CN203731154U 全角度发光led灯泡 Whole point of light led bulb |
| 07/23/2014 | CN103947126A 具有电隔离以及电介质传输媒介的ehf通信 Ehf communications with electrical isolation and dielectric transmission medium |
| 07/23/2014 | CN103946978A 半导体装置以及电子设备 A semiconductor device and an electronic device |
| 07/23/2014 | CN103946977A 功率转换装置 Power conversion means |