H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices

Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
11/2004
11/09/2004	US6815810 High-frequency semiconductor device
11/09/2004	US6815803 Multiple chip semiconductor arrangement having electrical components in separating regions
11/09/2004	US6815746 Semiconductor device and method of manufacturing the same
11/09/2004	US6815255 Semiconductor device and manufacturing method thereof
11/09/2004	US6815254 Semiconductor package with multiple sides having package contacts
11/09/2004	US6815253 Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods
11/09/2004	US6815251 High density modularity for IC's
11/09/2004	CA2258463C Rectifier bridges dispersing characteristics and an electrical arcing-free design
11/04/2004	WO2004095590A1 Selfluminous device
11/04/2004	WO2004095537A2 Semiconductor multipackage module including processor and memory package assemblies
11/04/2004	WO2004081764A3 Multi-chip programmable logic device having configurable logic circuitry and configuration data storage on different dice
11/04/2004	WO2004015764A3 Vertical system integration
11/04/2004	US20040219765 Method of forming a multi-layer semiconductor structure incorporating a processing handle member
11/04/2004	US20040219763 Process of vertically stacking multiple wafers supporting different active integrated circuit (IC) devices
11/04/2004	US20040219719 Device having resin package and method of producing the same
11/04/2004	US20040219717 Method of manufacturing chip size package semiconductor device without intermediate substrate
11/04/2004	US20040219713 Elimination of RDL using tape base flip chip on flex for die stacking
11/04/2004	US20040219700 Method of manufacturing a light emitting semiconductor package
11/04/2004	US20040218389 LED lamp assembly
11/04/2004	US20040218372 LSI package provided with interface module and method of mounting the same
11/04/2004	US20040217485 Stacked flip chip package
11/04/2004	US20040217483 Semiconductor device and method for fabricating the semiconductor device
11/04/2004	US20040217471 Component and assemblies with ends offset downwardly
11/04/2004	US20040217468 Semiconductor chip, semiconductor device, method of manufacturing the same, circuit board, and electronic equipment
11/04/2004	US20040217465 Power semiconductor module
11/04/2004	US20040217461 Microelectronic adaptors, assemblies and methods
11/04/2004	US20040217452 Semiconductor chip arrangement and a method for its production
11/04/2004	US20040217380 Semiconductor device, electronic device, electronic apparatus, method for manufacturing a semiconductor device, and method for manufacturing an electronic device
11/04/2004	US20040217369 Light emitting device
11/04/2004	US20040217364 Multiple component solid state white light
11/04/2004	US20040217363 Integrated circuit device packaging structure and packaging method
11/04/2004	US20040217348 Flexible organic electronic device with improved resistance to oxygen and moisture degradation
11/04/2004	US20040217293 Radiation detector, radiation detector element, and radiation imaging apparatus
11/04/2004	US20040216918 Two-layer electrical substrate for optical devices
11/04/2004	DE202004011854U1 Image-Modul Image Module
11/04/2004	DE10316357A1 Verfahren zur Überwachung von Leistungshalbleiterbauelementen The method for monitoring power semiconductor components
11/04/2004	DE10315303A1 Semiconductor device system e.g. DRAM, has two semiconductor devices e.g. in stacked arrangement, and powered from power supply provided in first device
11/04/2004	DE10297225T5 Plättchenbefestigungsklebstoffe für Halbleiteranwendungen, Verfahren zur Herstellung von Halbleiterbauelementen und nach derartigen Verfahren hergestellte Halbleiterbauelemente Die attach adhesives for semiconductor applications, to processes for the production of semiconductor components and manufactured by such a method, semiconductor devices
11/04/2004	DE10297224T5 Plättchenbefestigungsklebstoffe für Halbleiteranwendungen, Verfahren zur Herstellung von Halbleiterbauelementen und nach derartigen Verfahren hergestellte Halbleiterbauelemente Die attach adhesives for semiconductor applications, to processes for the production of semiconductor components and manufactured by such a method, semiconductor devices
11/03/2004	EP1473771A1 Color mixing light emitting diode
11/03/2004	EP1473553A1 Optical sensor
11/03/2004	EP1472915A2 Circuit carrier and production thereof
11/03/2004	EP1472733A1 Receptacle for a programmable, electronic processing device
11/03/2004	EP1472730A1 Space-saving packaging of electronic circuits
11/03/2004	EP1472724A2 Semiconductor device and method of manufacturing the same
11/03/2004	CN2653697Y Semiconductor switch module
11/03/2004	CN1543689A Structure and method for fabrication of a leadless chip carrier with embedded antenna
11/03/2004	CN1543674A Leadless chip carrier with embedded inductor
11/03/2004	CN1543654A Extendible drain members for grounding rfi/emi shielding
11/03/2004	CN1543291A Electronic component built-in module and method of manufacturing the same
11/03/2004	CN1542990A LED device and portable telephone, digital camera and LCD apparatus using the same
11/03/2004	CN1542963A Semiconductor device and method of manufacturing the same, electronic device, electronic instrument
11/03/2004	CN1542957A Semiconductor device
11/03/2004	CN1542944A 半导体集成电路器件 The semiconductor integrated circuit device
11/03/2004	CN1542932A Method of manufacturing semiconductor device and electronic device
11/03/2004	CN1542509A Audio signal processing circuit and a display device incorporating the same
11/03/2004	CN1542320A Vehicle head lamp
11/03/2004	CN1174482C Modular assembly and electronic component
11/03/2004	CN1174475C Method for making RF module element with sound wave surface wave unit
11/02/2004	US6812578 Semiconductor device bonding pad resistant to stress and method of fabricating the same
11/02/2004	US6812575 Semiconductor device
11/02/2004	US6812567 Semiconductor package and package stack made thereof
11/02/2004	US6812566 Lower profile package with power supply in package
11/02/2004	US6812565 Semiconductor device and a method of manufacturing the same
11/02/2004	US6812561 Thin high-frequency module having integrated circuit chip with little breakage
11/02/2004	US6812559 Power module with improved transient thermal impedance
11/02/2004	US6812557 Stacked type semiconductor device
11/02/2004	US6812556 Noncracking; no die pad; centering location; thinner; avoids electrical connection between bonding wires and prevents cut off during resin molding
11/02/2004	US6812549 Wiring board and fabricating method thereof, semiconductor device and fabricating method thereof, circuit board and electronic instrument
11/02/2004	US6812498 Multi-color light emitting diode package
11/02/2004	US6812481 LED device and manufacturing method thereof
11/02/2004	US6812078 Method for transferring and stacking of semiconductor devices
11/02/2004	US6812066 Semiconductor device having an interconnecting post formed on an interposer within a sealing resin
11/02/2004	US6812046 Method and apparatus for electronically aligning capacitively coupled chip pads
11/02/2004	CA2392920C Nonrotating pivotable solar panel
10/2004
10/28/2004	WO2004093238A1 Integrated passive devices fabricated utilizing multi-layer, organic laminates
10/28/2004	WO2004093190A2 Multichip module comprising a plurality of semiconductor chips and printed circuit board comprising a plurality of components
10/28/2004	WO2004093186A1 Metal-base circuit board and its manufacturing method
10/28/2004	WO2004091838A2 Method of soldering or brazing articles having surfaces that are difficult to bond
10/28/2004	US20040214387 Methods for fabricating three dimensional integrated circuits
10/28/2004	US20040213525 Ceramic optical sub-assembly for opto-electronic module utilizing LTCC (low-temperature co-fired ceramic) technology
10/28/2004	US20040213377 Radiation imaging apparatus, radiation imaging system and radiation imaging method
10/28/2004	US20040212970 [chip package structure]
10/28/2004	US20040212965 Electronic circuit apparatus and method of manufacturing the same
10/28/2004	US20040212415 Sense amplifying latch with low swing feedback
10/28/2004	US20040212099 Semiconductor components having stacked dice and methods of fabrication
10/28/2004	US20040212096 Multi-chips stacked package
10/28/2004	US20040212088 Multi-chip package substrate for flip-chip and wire bonding
10/28/2004	US20040212086 Semiconductor apparatus and production method thereof
10/28/2004	US20040212084 Thick film millimeter wave transceiver module
10/28/2004	US20040212083 Method to prevent die attach adhesive contamination in stacked chips
10/28/2004	US20040212082 Method to prevent die attach adhesive contamination in stacked chips
10/28/2004	US20040212081 Process for fabricating a power hybrid module
10/28/2004	US20040212075 Semiconductor device including a wiring board with a three-dimensional wiring pattern
10/28/2004	US20040212074 DC-DC converter implemented in a land grid array package
10/28/2004	US20040212072 Semiconductor package
10/28/2004	US20040212071 Systems and methods for stacking chip components
10/28/2004	US20040212070 Memory module having space-saving arrangement of memory chips and memory chip therefore
10/28/2004	US20040212069 Multi-chips stacked package
10/28/2004	US20040212068 Multi-chips stacked package

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