H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices

Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
11/2004
11/18/2004	WO2004100261A2 Semiconductor wafer, panel and electronic component comprising stacked semiconductor chips, and method for the production thereof
11/18/2004	WO2004100259A2 Semi-conductor component and method for the production of a semi-conductor component
11/18/2004	WO2004100253A2 Electronic component as well as system support and panel for the production thereof
11/18/2004	WO2004100226A2 Method and apparatus for led panel lamp systems
11/18/2004	WO2004100222A2 Electronically tunable rf chip packages
11/18/2004	WO2004055891A9 Semiconductor device and stacked semiconductor device
11/18/2004	US20040229418 Electronic device and method of manufacturing the same, chip carrier, circuit board, and electronic instrument
11/18/2004	US20040229403 Die stacking scheme
11/18/2004	US20040229402 Low profile chip scale stacking system and method
11/18/2004	US20040229401 Method for fabricating semiconductor component having stacked, encapsulated dice
11/18/2004	US20040229394 Protective sheet for solar battery module, method of fabricating the same and solar battery module
11/18/2004	US20040228115 High-brightness LED-phosphor coupling
11/18/2004	US20040228094 Dual power module power system architecture
11/18/2004	US20040227258 Electronic component packaging structure and method for producing the same
11/18/2004	US20040227251 Semiconductor device and method for fabricating semiconductor device
11/18/2004	US20040227250 Semiconductor component having stacked, encapsulated dice
11/18/2004	US20040227240 Semiconductor component having encapsulated die stack
11/18/2004	US20040227238 Electronic device and method of manufacturing the same, circuit board, and electronic instrument
11/18/2004	US20040227236 Semiconductor device, electronic device, electronic apparatus, and methods for manufacturing carrier substrate, semiconductor device, and electronic device
11/18/2004	US20040227235 Electronic device and method of manufacturing the same, circuit board, and electronic instrument
11/18/2004	US20040227231 Power module with voltage overshoot limiting
11/18/2004	US20040227223 Semiconductor device, electronic device, electronic apparatus, and methods for manufacturing semiconductor device and electronic device
11/18/2004	US20040227222 Stacked semiconductor package
11/18/2004	US20040227221 Method and apparatus for electrostatically aligning integrated circuits
11/18/2004	US20040227220 Semiconductor package and structure thereof
11/18/2004	US20040227156 Surface mounted power supply circuit apparatus and method for manufacturing it
11/18/2004	US20040226744 Module with built-in circuit component and method for producing the same
11/18/2004	DE10318847A1 Integrated circuit having two circuit parts on the same wafer made using specific first and second exposure masks from sets of masks specific to that circuit part
11/18/2004	DE10317018A1 Multichipmodul mit mehreren Halbleiterchips sowie Leiterplatte mit mehreren Komponenten Multi-chip module with a plurality of semiconductor chips and printed circuit board with multiple components
11/18/2004	DE10316136A1 Gekapselte Leistungshalbleiteranordnung Encapsulated power semiconductor device
11/18/2004	DE10232051A1 Kühlkörper und Gleichrichterbaueinheit für eine elektrische Maschine Heat sink and rectifier unit for an electrical machine
11/18/2004	DE102004016416A1 Fahrzeugscheinwerfer und Halbleiterlichtemissionselement Vehicle headlights and semiconductor light emitting element
11/17/2004	EP1478023A1 Module part
11/17/2004	EP1476902A2 Electronic component with an adhesive layer and method for the production thereof
11/17/2004	CN2657203Y Luminous diode packaging device with rectification circuit
11/17/2004	CN2656802Y Integrated navigation lamp light source for LED
11/17/2004	CN1547778A Process for producing microelectromechanical components
11/17/2004	CN1547771A High performance, low cost microelectronic circuit package with interposer
11/17/2004	CN1547769A Method of forming a raised contact for a substrate
11/17/2004	CN1176315C Energy-saving type LED lamp set
11/16/2004	US6819565 Cavity-down ball grid array semiconductor package with heat spreader
11/16/2004	US6818999 Semiconductor device having multiple semiconductor chips in a single package
11/16/2004	US6818998 Stacked chip package having upper chip provided with trenches and method of manufacturing the same
11/16/2004	US6818983 Semiconductor memory chip and semiconductor memory device using the same
11/16/2004	US6818980 Stacked semiconductor package and method of manufacturing the same
11/16/2004	US6818979 High-frequency semiconductor device
11/16/2004	US6818978 Ball grid array package with shielding
11/16/2004	US6818977 Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assemblies and packages including such semiconductor devices or packages
11/16/2004	US6818974 Semiconductor device
11/16/2004	US6818963 Surface mount package for linear array sensors
11/16/2004	US6818840 Method for manufacturing raised electrical contact pattern of controlled geometry
11/16/2004	US6818819 Solar cell module
11/16/2004	US6818818 Concentrating solar energy receiver
11/16/2004	US6818545 Low fabrication cost, fine pitch and high reliability solder bump
11/16/2004	US6818474 Method for manufacturing stacked chip package
11/16/2004	US6817735 Illumination light source
11/16/2004	US6817093 Electronic component and manufacturing method therefor
11/11/2004	WO2004097947A2 Light emitting diodes and the manufacture thereof
11/11/2004	WO2004097838A2 Memory-circuit arrangement and method for the production thereof
11/11/2004	WO2004097780A1 Plasma display device
11/11/2004	WO2004088727A3 Multi-chip ball grid array package and method of manufacture
11/11/2004	WO2004061962A3 Multi-layer integrated semiconductor structure
11/11/2004	WO2004034428A3 Semiconductor device package
11/11/2004	US20040225980 Architecture for a connection block in reconfigurable gate arrays
11/11/2004	US20040224647 High density interconnect structure for use on software defined radio
11/11/2004	US20040224481 Semiconductor devices, manufacturing methods therefor, circuit substrates and electronic devices
11/11/2004	US20040223339 Light source device
11/11/2004	US20040223337 Vehicle head lamp
11/11/2004	US20040222809 System for probing, testing, burn-in, repairing and programming of integrated circuits
11/11/2004	US20040222534 Semiconductor device, electronic device, electronic equipment, method of manufacturing semiconductor device, and method of manufacturing electronic device
11/11/2004	US20040222521 Semiconductor chip and production thereof, and semiconductor device having semiconductor chip bonded to solid device
11/11/2004	US20040222519 Semiconductor device, electronic device, electronic apparatus, method of manufacturing semiconductor device, and method of manufacturing electronic device
11/11/2004	US20040222518 Ball grid array with bumps
11/11/2004	US20040222512 Method and system to manufacture stacked chip devices
11/11/2004	US20040222510 Semiconductor device, semiconductor pack age, electronic device, electronic apparatus, and manufacturing methods of semiconductor device and electronic device
11/11/2004	US20040222509 Semiconductor device, electronic device, electronic equipment and manufacturing method thereof
11/11/2004	US20040222508 Semiconductor device, electronic device, electronic apparatus, method of manufacturing semiconductor device, and method of manufacturing electronic device
11/11/2004	US20040222507 Circuit module having interleaved groups of circuit chips
11/11/2004	US20040222433 Light emitting diodes packaged for high temperature operation
11/11/2004	US20040222357 Optical excitation/detection device and method for making same using fluidic self-assembly techniques
11/11/2004	US20040221658 Movement actuator/sensor systems
11/11/2004	US20040221451 Method for packaging circuits and packaged circuits
11/11/2004	DE19923467B4 Halbleitermodul mit mehreren Halbleiterchips und leitender Verbindung mittels flexibler Bänder zwischen den Halbleiterchips A semiconductor module having a plurality of semiconductor chip and conductively connected by means of flexible bands between the semiconductor chips
11/11/2004	DE10316356A1 Modular aufgebautes Leistungshalbleitermodul Modular power semiconductor module
11/11/2004	DE102004010649A1 Gestapeltes Halbleiterpaket Stacked semiconductor package
11/11/2004	DE10145492B4 Elektrolumineszente Lichtemissionseinrichtung, insbesondere als Weißlichtquelle The electroluminescent light emission device, in particular as a white light source
11/11/2004	CA2563997A1 An encased thermal management device and method of making such a device
11/10/2004	EP1475846A2 Light emitting diode based light source with cooling liquid arrangement, and projection-type display apparatus
11/10/2004	EP1475836A1 Circuit module having interleaved groups of circuit chips
11/10/2004	EP1475835A2 Color mixing light emitting diode
11/10/2004	EP1475834A2 High density interconnect structure for use on software defined radio
11/10/2004	EP1475832A1 Pressure-contactable power semiconductor module
11/10/2004	EP1474959A1 Method for embedding a component in a base and forming a contact
11/10/2004	EP1474828A2 Housing for a power semiconductor module which is resistant to high voltages
11/10/2004	CN2655429Y LED structure
11/10/2004	CN2655428Y Power LED
11/10/2004	CN1545727A Semiconductor device, its manufacturing method, and radio communication device
11/09/2004	US6815832 Semiconductor device having opposed and connected semiconductor chips with lateral deviation confirming electrodes
11/09/2004	US6815829 Semiconductor device with compact package
11/09/2004	US6815828 Large multi-function integrated circuit device

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