H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices

Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
12/2004
12/02/2004	US20040238957 Semiconductor components having multiple on board capacitors
12/02/2004	US20040238954 Module component
12/02/2004	US20040238951 Semiconductor component
12/02/2004	US20040238948 Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device
12/02/2004	US20040238936 Through silicon via, folded flex microelectronic package
12/02/2004	US20040238935 Semiconductor device and method of manufacturing semiconductor device
12/02/2004	US20040238934 High-frequency chip packages
12/02/2004	US20040238933 Stacked package for electronic elements and packaging method thereof
12/02/2004	US20040238932 Array printed circuit board
12/02/2004	US20040238927 Method of manufacturing semiconductor device, semiconductor device, circuit substrate and electronic apparatus
12/02/2004	US20040238924 Semiconductor package
12/02/2004	US20040238857 High frequency chip packages with connecting elements
12/02/2004	US20040238850 Integrated circuit device and method for forming the same
12/02/2004	US20040238836 Flip chip structure for light emitting diode
12/02/2004	US20040238833 Light-emitting or light-receiving semiconductor module and method of its manufacture
12/01/2004	EP1482622A2 Alternator for motor vehicle
12/01/2004	EP1482567A1 Light-emitting device comprising led chip and method for manufacturing this device
12/01/2004	EP1482566A2 Light emitting diode electrode structure and full color light emitting diode formed by overlap cascaded die bonding
12/01/2004	EP1482241A2 A vehicle lighting device and method of assembling a vehicle lighting device
12/01/2004	EP1481424A2 A modular integrated circuit chip carrier
12/01/2004	EP1481423A2 Electronic module, panel with individual electronic modules and method for the production thereof
12/01/2004	EP1481421A2 Semiconductor package device and method of formation and testing
12/01/2004	EP1481196A2 Piezoelectric ignition mechanism
12/01/2004	CN1551719A Module with built-in circuit component and method for producing the same
12/01/2004	CN1551468A Surface mounted power supply circuit apparatus and method for manufacturing it
12/01/2004	CN1551351A Semiconductor multi-chip package and fabrication method
12/01/2004	CN1551350A Semiconductor device
12/01/2004	CN1551347A 半导体装置及其制造方法 Semiconductor device and manufacturing method
12/01/2004	CN1551344A Semiconductor device and stacked semiconductor devcie and their manufacturing method
12/01/2004	CN1551343A Electronic component packaging structure and method for producing the same
12/01/2004	CN1551313A Semiconductor device and stacked semiconductor device and its manufacturing method
12/01/2004	CN1551312A Method for manfacturing semiconductor chip, semiconductor device manufacturing method, semiconductor chip and semiconductor device
12/01/2004	CN1551221A Circuit module having interleaved groups of circuit chips
12/01/2004	CN1550869A Light source device and mfg. method and projection display device
12/01/2004	CN1178305C Method and device for making display device generate white light
11/2004
11/30/2004	US6826066 Semiconductor memory module
11/30/2004	US6826053 Electronic device
11/30/2004	US6825817 Dielectric interconnect frame incorporating EMI shield and hydrogen absorber for tile T/R modules
11/30/2004	US6825708 Apparatus and method for an offset-correcting sense amplifier
11/30/2004	US6825567 Side surface of second chip is progressive distance from chip accommodation space for lessening capillary flow of underfilling material between concave wall and side surface
11/30/2004	US6825066 Stiffener design
11/30/2004	US6825064 Multi-chip semiconductor package and fabrication method thereof
11/30/2004	US6825055 Method for assembling integral type electronic component and integral type electronic component
11/25/2004	WO2004102663A1 Semiconductor chip mounting body and manufacturing method thereof
11/25/2004	WO2004102653A1 Semiconductor device and interposer
11/25/2004	WO2004102632A2 High power allngan based mulit-chip light emitting diode
11/25/2004	US20040235234 Semiconductor device and method of manufacturing the same
11/25/2004	US20040235222 Integrated circuit stacking system and method
11/25/2004	US20040235221 Electronic device and method for manufacturing the same
11/25/2004	US20040235218 Method for producing miniature amplifier and signal processing unit
11/25/2004	US20040234214 Low-profile package for housing an optoelectronic assembly
11/25/2004	US20040234213 Package for housing an optoelectronic assembly
11/25/2004	US20040233678 Vehicular lamp
11/25/2004	US20040233671 Led-luminous panel and carrier plate
11/25/2004	US20040233649 Electronic chip and electronic chip assembly
11/25/2004	US20040233648 Electronic component module
11/25/2004	US20040233035 Methods for manufacturing resistors using a sacrificial layer
11/25/2004	US20040232572 Optical device and method for manufacturing the same, and electronic apparatus
11/25/2004	US20040232559 Interconnect method for directly connected stacked integrated circuits
11/25/2004	US20040232549 Semiconductor device and manufacturing method thereof
11/25/2004	US20040232539 Rearrangemet sheet, semiconductor device and method of manufacturing thereof
11/25/2004	US20040232537 Method and structure for interfacing electronic devices
11/25/2004	US20040232531 Semiconductor package device and method for fabricating the same
11/25/2004	US20040232526 Lead frame for stacked semiconductor packages, stacked semiconductor packages using it, and fabrication method thereof
11/25/2004	US20040232523 Electronically tunable RF chip packages
11/25/2004	US20040232485 Semiconductor device
11/25/2004	US20040232458 Ferroelectric memory and method of fabricating the same
11/25/2004	US20040231888 High speed circuit board and method for fabrication
11/25/2004	DE19914305B4 Elektronische Vorrichtung Electronic device
11/25/2004	DE10319538A1 Halbleitervorrichtung und Verfahren zur Herstellung einer Halbleitereinrichtung A semiconductor device and method of manufacturing a semiconductor device
11/25/2004	DE10319271A1 Speicher-Schaltungsanordnung und Verfahren zur Herstellung Memory circuitry and methods for preparing
11/25/2004	DE102004015305A1 Solarzelleneinheit und deren Montage auf einem Dach Solar cell unit and its installation on a roof
11/25/2004	CA2521881A1 High power alingan based multi-chip light emitting diode
11/24/2004	EP1479107A2 Stacked die semiconductor device
11/24/2004	EP1478899A2 Measurement method for determining a surface profile
11/24/2004	EP1063913B1 X-ray detector
11/24/2004	CN1549339A Functional module with built-in radiating fin
11/24/2004	CN1549338A Functional module with built-in flat plate type radiating element
11/24/2004	CN1549317A Device having resin package and method of producing the same
11/24/2004	CN1177367C Surface adhered diode array and its manufacture
11/24/2004	CN1177358C Semiconductor device chip scale surface assembling and packaging, and mfg. method therefor
11/24/2004	CN1177252C Method for assembling components
11/23/2004	US6822990 Semiconductor laser device
11/23/2004	US6822921 Semiconductor device having semiconductor memory
11/23/2004	US6822868 Heat sink with integrated electronics
11/23/2004	US6822339 Semiconductor device
11/23/2004	US6822316 Integrated circuit with improved interconnect structure and process for making same
11/23/2004	US6822164 Semiconductor device and electro-optical device including the same
11/23/2004	US6821821 Methods for manufacturing resistors using a sacrificial layer
11/23/2004	US6821818 Method of assembling a semiconductor device including sweeping (with a squeegee) encapsulant over the device repeatedly
11/23/2004	US6821804 Enhanced light extraction in LEDs through the use of internal and external optical elements
11/23/2004	US6821802 Silicon interposer with optical connections
11/23/2004	US6821793 Optical excitation/detection device and method for making same using discrete photoemitter devices
11/23/2004	US6821009 Light source device
11/18/2004	WO2004100628A1 Electrical element comprising lines made of carbonated plastic, and method and device for the production thereof
11/18/2004	WO2004100626A2 Radiocommunication module on a substrate having a surface area greater than that of the encapsulation case thereof, and corresponding radiocommunication device and platform
11/18/2004	WO2004100343A2 Light emitting diodes packaged for high temperature operation
11/18/2004	WO2004100275A1 White light emitting lamp
11/18/2004	WO2004100265A2 Light-emitting diode system
11/18/2004	WO2004100264A1 Module including circuit elements

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