H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices

Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
12/2004
12/15/2004	EP1485951A1 Multijunction photovoltaic device with shadow-free independent cells and the production method thereof
12/15/2004	EP1092338B1 Assembly of an electronic component with spring packaging
12/15/2004	CN2664204Y Luminous semiconductor device with built-in integrated circuit driving chip
12/15/2004	CN2664202Y Multi-chip image sensor module
12/15/2004	CN2664200Y A LED dot-matrix module having highly effective reflection hole
12/15/2004	CN2664199Y Luminous semiconductor packaging assembly
12/15/2004	CN2664198Y Multi-chip packaging structure
12/15/2004	CN1555596A Method of manufacturing optical devices and related improvements
12/15/2004	CN1555583A White light led with multicolor light-emitting layers of macroscopic structure widths, arranged on a light-diffusing glass
12/15/2004	CN1555582A Solar array concentrator system and method for concentratiing solar energy
12/15/2004	CN1555578A Image sensor with recessed planarizing layers and method for making same
12/15/2004	CN1555576A Thin electronic label and method for making same
12/15/2004	CN1555573A Microelectronic package having an integrated heat sink and build-up layers
12/15/2004	CN1555064A Nonvolatile semiconductor memory device and nonvolatile semiconductor memory system
12/15/2004	CN1180477C Semiconductor device adn semiconductor assembly
12/15/2004	CN1180304C Self luminescence display equipment
12/15/2004	CN1180195C Method for producing water pipe lamp using light-emitting diode
12/14/2004	US6832049 Optical Module
12/14/2004	US6831528 High-frequency switching module and high-frequency apparatus equipped with the same
12/14/2004	US6831370 Method of using foamed insulators in three dimensional multichip structures
12/14/2004	US6831367 Semiconductor device and method of manufacturing the same
12/14/2004	US6831360 Semiconductor device having an elastic resin with a low modulus of elasticity
12/14/2004	US6831359 Power semiconductor module
12/14/2004	US6831355 Flip-chip sub-assembly, methods of making same and device including same
12/14/2004	US6831351 Semiconductor device with semiconductor chip formed by using wide gap semiconductor as base material
12/14/2004	US6831305 Semiconductor light-emitting device
12/14/2004	US6831132 Useful as adhesives in microelectronics industry; film adhesives may be used to produce microelectronic assemblies with very thin bond lines without compromising adhesive strength
12/14/2004	US6831000 Semiconductor device manufacturing method
12/14/2004	US6830955 Semiconductor package and method for manufacturing the same
12/14/2004	US6830946 Device transfer method and panel
12/14/2004	US6830711 Mold tool for an optoelectronic element
12/14/2004	US6830496 Method of fabricating light emitting diode device with multiple encapsulants
12/09/2004	WO2004107461A1 Light emitting diode package and light emitting diode system having at least two heat sinks
12/09/2004	WO2004107457A2 Led inspection lamp, cluster led, and led with stabilizing agents
12/09/2004	WO2004107443A1 Insulated metal substrate with at least one light diode, light diode matrix and production method
12/09/2004	WO2004107442A1 Bi-directional switch, and use of said switch
12/09/2004	WO2004107441A1 An integrated circuit package employing a flexible substrate
12/09/2004	WO2004107440A1 Electronic parts, module, module assembling method, identification method, and environment setting method
12/09/2004	WO2004107439A1 An integrated circuit package employing a head-spreader member
12/09/2004	WO2004107263A1 Semiconductor device and its manufacturing method
12/09/2004	US20040248342 Method for packaging integrated circuit chips
12/09/2004	US20040248330 Semiconductor device and its manufacturing method
12/09/2004	US20040245946 Spectrally calibratable multi-element RGB LED light source
12/09/2004	US20040245655 Semiconductor device, its manufacturing method, and radio communication device
12/09/2004	US20040245652 Semiconductor device, electronic device, electronic appliance, and method of manufacturing a semiconductor device
12/09/2004	US20040245651 Semiconductor device and method for fabricating the same
12/09/2004	US20040245649 Optical device, optical module, semiconductor apparatus and its manufacturing method, and electronic apparatus
12/09/2004	US20040245647 Three-dimensional percolated layer is a metallic mesoporous conductive structure of nanoparticles; the interconnection or connection is produced by tunneling; cavities house luminescent particles
12/09/2004	US20040245634 Stacked device underfill and a method of fabrication
12/09/2004	US20040245627 Die stacking scheme
12/09/2004	US20040245626 Semiconductor device, system device using it, and manufacturing method of a semiconductor device
12/09/2004	US20040245623 Semiconductor device, circuit substrate and electronic instrument
12/09/2004	US20040245618 Integrated circuit and method for fabricating an integrated circuit
12/09/2004	US20040245617 Dense multichip module
12/09/2004	US20040245616 Stacked device underfill and a method of fabrication
12/09/2004	US20040245615 Point to point memory expansion system and method
12/09/2004	US20040245614 Semiconductor package having semiconductor constructing body and method of manufacturing the same
12/09/2004	US20040245591 Package structure for light emitting diode and method thereof
12/09/2004	US20040245548 Power semiconductor module
12/09/2004	US20040244827 Solar cell module and roof equipped with power generating function using the same
12/09/2004	DE10320877A1 Halbleiterbauelement und Verfahren zum Herstellen eines Halbleiterbauelements A semiconductor device and method of manufacturing a semiconductor device
12/09/2004	DE10297316T5 Gestapelte Baugruppen Stacked modules
12/09/2004	DE102004020038A1 Memory module e.g. dynamic random access memory (DRAM) for motherboard, comprises several DRAM chips stacked on input-output chip, connected through penetration electrodes
12/09/2004	DE102004019857A1 Fahrzeugscheinwerfer Vehicle headlights
12/09/2004	DE102004018434A1 Multi-chip package comprises package substrate having bond fingers, first chip having first bonding pads on its center portion, insulating support structures, bonding wire, and second chip with second bonding pads disposed over bonding wire
12/09/2004	CA2527717A1 Led inspection lamp, cluster led, and led with stabilizing agents
12/08/2004	EP1484797A1 Inverter power device and method of making it
12/08/2004	EP1484795A1 Method for manufacturing a chip scale package at wafer level
12/08/2004	CN2662448Y Circuit module with joint line
12/08/2004	CN1553505A Semiconductor device and producing method thereof
12/08/2004	CN1553490A Electronic sealer with three-dimensional stack and assembling method thereof
12/08/2004	CN1553074A Miner's lamp with semiconductor luminotron
12/08/2004	CN1179414C 电子电路组件 Electronic circuit assembly
12/07/2004	US6829265 Semiconductor laser array
12/07/2004	US6829147 Multilayered hybrid electronic module
12/07/2004	US6829023 Light-emitting display device
12/07/2004	US6828686 Chip size stack package and method of fabricating the same
12/07/2004	US6828670 Module component
12/07/2004	US6828514 High speed circuit board and method for fabrication
12/07/2004	US6828506 Wiring structure
12/07/2004	US6828233 Forming reliable, defect free material with substantial void elimination; covering exposed surface and interior sidewalls of hole with titanium aluminide and titanium nitride layers then depositing conductive plug
12/07/2004	US6828175 Semiconductor component with backside contacts and method of fabrication
12/07/2004	US6828174 Semiconductor device and a method of manufacturing the same
12/02/2004	WO2004105134A1 An integrated circuit package
12/02/2004	WO2004105132A1 An electrical connection for a microelectronic chip, and a method for manufacturing such a connection
12/02/2004	WO2004105126A1 Thermal transfer container for semiconductor component
12/02/2004	WO2004105119A2 Method for the production of a chip arrangement and varnish comprising magnetically conductive particles for electrically contacting the chip
12/02/2004	WO2004088731A3 Methods for fabricating three-dimensional all organic interconnect structures
12/02/2004	US20040242031 Pressure piece for use in a power semiconductor module
12/02/2004	US20040241908 Semiconductor package with semiconductor chips stacked therein and method of making the package
12/02/2004	US20040241907 Method of manufacturing a semiconductor device
12/02/2004	US20040241899 Image sensor with recessed planarizing layers and method for making same
12/02/2004	US20040241894 Light emitting device, display apparatus with an array of light emitting devices, and display apparatus method of manufacture
12/02/2004	US20040240229 Led module for illumination systems
12/02/2004	US20040240219 Vehicular headlamp and light-emitting module therefor
12/02/2004	US20040240203 LED lamp
12/02/2004	US20040239243 Light emitting assembly
12/02/2004	US20040239242 LIght-emitting unit and illuminator utilizing the same
12/02/2004	US20040239195 Alternator for motor vehicle
12/02/2004	US20040238971 Chip-scale package

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