H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices

Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
12/2004
12/29/2004	EP1492165A2 Electronic component module
12/29/2004	EP1490908A2 Power module comprising at least two substrates and method for producing the same
12/29/2004	EP1490899A1 Composition for removing sidewall residues
12/29/2004	CN2667671Y Polarization luminous pipe and polarization luminous array thereof
12/29/2004	CN2667670Y Multichip illuminating diode encapsulating apparatus
12/29/2004	CN1559088A Semiconductor device and method of manufacturing semiconductor device
12/29/2004	CN1559087A Device with power semiconductor components for controlling the power of high currents and use of said device
12/29/2004	CN1558713A Multilayer substrate module and wireless portable terminal
12/29/2004	CN1558712A Multilayer substrate module and wireless portable terminal
12/29/2004	CN1558452A Multiple pin type light-emitting diode assembly
12/29/2004	CN1558451A Light emitting diode element capable of preventing electrostatic damage
12/29/2004	CN1182590C Light-emitting or light-receiving semiconductor device and method for fabricating same
12/29/2004	CN1182589C Light-emitting or light-detecting semiconductor module and method of manufacture therefor
12/29/2004	CN1182584C Optical device and its producing method and electronic device
12/28/2004	US6836138 Module having test architecture for facilitating the testing of ball grid array packages, and test method using the same
12/28/2004	US6836025 Semiconductor device configured to be surface mountable
12/28/2004	US6836021 Semiconductor device
12/28/2004	US6836010 Semiconductor device include relay chip connecting semiconductor chip pads to external pads
12/28/2004	US6836009 Packaged microelectronic components
12/28/2004	US6836007 Semiconductor package including stacked semiconductor chips
12/28/2004	US6836006 Semiconductor module
12/28/2004	US6836002 Semiconductor device
12/28/2004	US6835994 Power semiconductor module
12/28/2004	US6835971 Semiconductor integrated circuit device with a plurality of limiter circuits
12/28/2004	US6835898 Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures
12/28/2004	US6835598 Stacked semiconductor module and method of manufacturing the same
12/28/2004	US6835596 Connecting electrodes pads with photopolymerization
12/28/2004	US6834981 Light-emitting unit, light-emitting unit combination, and lighting apparatus assembled from a plurality of light-emitting units
12/23/2004	WO2004112155A1 Optical semiconductor device
12/23/2004	WO2004112136A1 Electronic device
12/23/2004	WO2004112135A1 Substrate for semiconductor devices and semiconductor device
12/23/2004	WO2004112128A2 Low profile stacking system and method
12/23/2004	WO2004112109A1 Defect-free semiconductor templates for epitaxial growth and method of making same
12/23/2004	WO2004066324A3 Integrated photovoltaic roofing system
12/23/2004	US20040259325 Wafer level chip scale hermetic package
12/23/2004	US20040259282 Transferring semiconductor crystal from a substrate to a resin
12/23/2004	US20040257847 Memory module and memory system
12/23/2004	US20040257842 Maximum power tracking technique for solar panels
12/23/2004	US20040257749 Capacitor, capacitor equipped semiconductor device assembly, capacitor equipped circuit substrate assembly and electronic unit including semiconductor device, capacitor and circuit substrate
12/23/2004	US20040257103 Module having test architecture for facilitating the testing of ball grid array packages, and test method using the same
12/23/2004	US20040256925 Rectifier for a vehicle alternator
12/23/2004	US20040256742 Semiconductor module and method of manufacturing the same
12/23/2004	US20040256738 Battery protection circuit with integrated passive components
12/23/2004	US20040256736 Method of forming a stacked device filler
12/23/2004	US20040256734 Multi-dice chip scale semiconductor components and wafer level methods of fabrication
12/23/2004	US20040256727 Multi-layer fine wiring interposer and manufacturing method thereof
12/23/2004	US20040256724 Method of forming a stacked device filler
12/23/2004	US20040256721 Package for semiconductor devices
12/23/2004	US20040256717 LSI package
12/23/2004	US20040256711 Semiconductor device, semiconductor module and hard disk
12/23/2004	US20040256710 Device with power semiconductor components for controlling the power of high currents and use of said device
12/23/2004	US20040256709 Semiconductor device and method of manufacture thereof, circuit board, and electronic instrument
12/23/2004	US20040256708 Multi-chip module with extension
12/23/2004	US20040256706 Molded package and semiconductor device using molded package
12/23/2004	US20040256630 Illuminating light
12/23/2004	US20040256626 White light source
12/23/2004	US20040256466 Thin electronic label and method for making same
12/23/2004	US20040256349 Method for producing electronic componets
12/23/2004	US20040255458 Programmed material consolidation methods for fabricating semiconductor device components and conductive features thereof
12/23/2004	DE10323394A1 Connecting semiconductor chip or wafer sections, provides contact pin in recess between opposite faces which are pressed together to make local contact
12/22/2004	EP1489657A1 Semiconductor chip mounting board, its manufacturing method, and semiconductor module
12/22/2004	EP1488427A1 A volumetric data storage apparatus comprising a plurality of stacked matrix-addressable memory devices
12/22/2004	EP1423877A4 Structure and method for fabrication of a leadless chip carrier with embedded inductor
12/22/2004	CN2665936Y Packaging structure of LED
12/22/2004	CN1181544C Electronic display structure
12/22/2004	CN1181543C Parallel semi-conductor piling-up device
12/21/2004	US6833993 Multichip package
12/21/2004	US6833984 Semiconductor module with serial bus connection to multiple dies
12/21/2004	US6833628 Mutli-chip module
12/21/2004	US6833626 Multichip module structure
12/21/2004	US6833623 Enhanced barrier liner formation for via
12/21/2004	US6833618 Memory system with a socket having socket pins for mounting memory modules
12/21/2004	US6833613 Stacked semiconductor package having laser machined contacts
12/21/2004	US6833607 Resin-molded semiconductor device that includes at least one additional electronic part
12/21/2004	US6833563 Multi-stack surface mount light emitting diodes
12/21/2004	US6833287 System for semiconductor package with stacked dies
12/16/2004	WO2004110113A2 Electrical devices embedded in printed circuit boards
12/16/2004	WO2004109812A2 Housing for a radiation-emitting component, method for the production thereof, and radiation-emitting component
12/16/2004	WO2004109802A1 Memory expansion and integrated circuit stacking system and method
12/16/2004	WO2004109801A1 Power semiconductor module
12/16/2004	WO2004109771A2 Stackable semiconductor device and method of manufacturing the same
12/16/2004	US20040253762 Chip stack package, connecting board, and method of connecting chips
12/16/2004	US20040252474 Integrated circuit stack with lead frames
12/16/2004	US20040252251 Method and apparatus for transferring blocks
12/16/2004	US20040251554 Semiconductor device, circuit board, electronic instrument, and method of manufacturing semiconductor device
12/16/2004	US20040251540 Semiconductor module and mounting method for same
12/16/2004	US20040251536 Semiconductor device
12/16/2004	US20040251533 Hybrid integrated circuit device
12/16/2004	US20040251531 Stack type flip-chip package
12/16/2004	US20040251530 Three-dimensionally mounted semiconductor module and three-dimensionally mounted semiconductor system
12/16/2004	US20040251529 Multi-chip ball grid array package
12/16/2004	US20040251528 Electric power semiconductor device
12/16/2004	US20040251526 System for semiconductor package with stacked dies
12/16/2004	US20040251523 Stackable integrated circuit package and method therefor
12/16/2004	US20040251509 CMOS type image sensor module having transparent polymeric encapsulation material
12/16/2004	US20040251476 Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages
12/16/2004	US20040251464 Multi-chip light emitting diode package
12/16/2004	US20040250407 Device comprising components vertically stacked thereon and method for manufacturing the same
12/16/2004	DE102004004880A1 Verbindungsverfahren für direkt verbundene gestapelte integrierte Schaltungen Connection method to directly connected stacked integrated circuits
12/15/2004	EP1486814A1 Light beam switching/adjusting apparatus and manufacturing method thereof

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