| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 01/06/2005 | WO2005001933A2 Multichip semi-conductor component and method for the production thereof |
| 01/06/2005 | WO2005001927A2 Stackable integrated circuit package and method therefor |
| 01/06/2005 | WO2005000733A2 Integrated circuit on high performance chip |
| 01/06/2005 | US20050003664 Method and apparatus for low temperature copper to copper bonding |
| 01/06/2005 | US20050003652 Method and apparatus for low temperature copper to copper bonding |
| 01/06/2005 | US20050003650 Three-dimensional stacked substrate arrangements |
| 01/06/2005 | US20050003587 Method of manufacturing semiconductor device and method of manufacturing electronics device |
| 01/06/2005 | US20050003581 Thin stacked package and manufacturing method thereof |
| 01/06/2005 | US20050003580 Stacked chip semiconductor device and method for manufacturing the same |
| 01/06/2005 | US20050003575 Apparatus, systems and methods relating to the reconstruction of semiconductor wafers for wafer-level processing and reconstructed semiconductor wafers |
| 01/06/2005 | US20050003199 Resin composition, cured resin, sheet-like cured resin, laminated body, prepreg, electronic parts and multilayer boards |
| 01/06/2005 | US20050002448 Method and apparatus for non-conductively interconnecting integrated circuits |
| 01/06/2005 | US20050002191 Illumination light source |
| 01/06/2005 | US20050002167 Microelectronic package |
| 01/06/2005 | US20050001510 Uniform energy megasonic transducer using vessel as resonator |
| 01/06/2005 | US20050001492 Electronic package for electrical machine |
| 01/06/2005 | US20050001329 Semiconductor device and method for manufacturing the same |
| 01/06/2005 | US20050001327 Semiconductor device, method for manufacturing the same, circuit substrate and electronic device |
| 01/06/2005 | US20050001326 Semiconductor device, stacked semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument |
| 01/06/2005 | US20050001320 Semiconductor device, stacked semiconductor device, methods of manufacturing them, circuit board, and electronic instrument |
| 01/06/2005 | US20050001315 Method for assembling integral type electronic device, and integral type electronic device |
| 01/06/2005 | US20050001314 Semiconductor device |
| 01/06/2005 | US20050001312 Chip package with grease heat sink |
| 01/06/2005 | US20050001306 Stacked type semiconductor device |
| 01/06/2005 | US20050001305 Stack package of semiconductor device |
| 01/06/2005 | US20050001302 Semiconductor module |
| 01/06/2005 | US20050001301 Semiconductor device, electronic device, electronic equipment, and method of manufacturing semiconductor device |
| 01/06/2005 | US20050001300 Semiconductor package having multiple embedded chips |
| 01/06/2005 | US20050001298 Multiple chip semiconductor arrangement having electrical components in separating regions |
| 01/06/2005 | US20050001294 Leadless leadframe package substitute and stack package |
| 01/05/2005 | EP1494336A1 Rectifier, in particular suitable for an alternating current generator |
| 01/05/2005 | EP1494278A1 Electronic power module with rubber seal, and corresponding manufacturing method |
| 01/05/2005 | EP1494277A2 Module with a built-in semiconductor and method for producing the same |
| 01/05/2005 | EP1494263A2 Light sources for improving visual perceptions under mesopic lighting conditions |
| 01/05/2005 | EP1493188A2 Electronic component having at least one semiconductor chip and flip-chip contacts, and method for the production thereof |
| 01/05/2005 | EP1493187A2 Lighting device and method |
| 01/05/2005 | DE10342980B3 Semiconductor chip stack formation method for manufacture of 3D-packages with function testing of chips for removal or unacceptable chips and replacement by acceptable chips |
| 01/05/2005 | DE10326176A1 Leistungshalbleitermodul The power semiconductor module |
| 01/05/2005 | DE10324909A1 Gehäuse für ein strahlungsemittierendes Bauelement, Verfahren zu dessen Herstellung und strahlungsemittierendes Bauelement Housing for a radiation-emitting component, to processes for its preparation and radiation-emitting component |
| 01/05/2005 | CN2669376Y LED overlap transistor packaging structure |
| 01/05/2005 | CN2668992Y Pure-green-light solid luminous lamp |
| 01/05/2005 | CN1561545A Semiconductor with multiple rows of bond pads |
| 01/05/2005 | CN1560932A Highlight blazing electric tube |
| 01/05/2005 | CN1560924A Semiconductor lighting luminous body |
| 01/05/2005 | CN1183593C Semiconductor device |
| 01/04/2005 | US6839135 Optical device |
| 01/04/2005 | US6838896 Method and system for probing, testing, burn-in, repairing and programming of integrated circuits in a closed environment using a single apparatus |
| 01/04/2005 | US6838893 Probe card assembly |
| 01/04/2005 | US6838774 Interlocking conductor method for bonding wafers to produce stacked integrated circuits |
| 01/04/2005 | US6838768 Module assembly for stacked BGA packages |
| 01/04/2005 | US6838766 Semiconductor device |
| 01/04/2005 | US6838762 Water-level package with bump ring |
| 01/04/2005 | US6838761 Semiconductor multi-package module having wire bond interconnect between stacked packages and having electrical shield |
| 01/04/2005 | US6838754 Bonding chip to lead frame frames; reducing damage; sealed package |
| 01/04/2005 | US6838317 Techniques for joining an opto-electronic module to a semiconductor package |
| 01/04/2005 | US6838312 Semiconductor device having a primary chip with bumps in joined registration with bumps of a plurality of secondary chips |
| 01/04/2005 | US6838310 Integrated circuit with improved interconnect structure and process for making same |
| 01/04/2005 | US6836961 Ceramic packaging method employing flip-chip bonding |
| 12/30/2004 | US20040268286 Integrated circuit with interface tile for coupling to a stacked-die second integrated circuit |
| 12/30/2004 | US20040264837 Hybrid circuit substrate with optical and electrical interconnects, hybrid circuit module with optical and electrical interconnects and manufacturing methods thereof |
| 12/30/2004 | US20040264195 Led light source having a heat sink |
| 12/30/2004 | US20040264192 Light source apparatus, method of manufacture therefor, and projection-type display apparatus |
| 12/30/2004 | US20040264184 Full-color light emitting device with four leads |
| 12/30/2004 | US20040264182 Low voltage driven high brightness LED |
| 12/30/2004 | US20040264156 Electronic component module |
| 12/30/2004 | US20040264148 Method and system for fan fold packaging |
| 12/30/2004 | US20040264140 Power electronics component |
| 12/30/2004 | US20040263671 Solid-state imaging apparatus and camera using the same |
| 12/30/2004 | US20040263007 Thermal transfer container for semiconductor component |
| 12/30/2004 | US20040262786 Diode Stack |
| 12/30/2004 | US20040262782 Polymer encapsulated electrical devices |
| 12/30/2004 | US20040262777 Components, methods and assemblies for multi-chip packages |
| 12/30/2004 | US20040262775 Semiconductor device and method of manufacturing same |
| 12/30/2004 | US20040262774 Multi-chip packages having a plurality of flip chips and methods of manufacturing the same |
| 12/30/2004 | US20040262772 Methods for bonding wafers using a metal interlayer |
| 12/30/2004 | US20040262767 Semiconductor device |
| 12/30/2004 | US20040262747 Multichip module |
| 12/30/2004 | US20040262737 Semiconductor module |
| 12/30/2004 | US20040262735 Semiconductor device and production method thereof |
| 12/30/2004 | US20040262734 Stack type ball grid array package and method for manufacturing the same |
| 12/30/2004 | US20040262733 Scalable microelectronic package using conductive risers |
| 12/30/2004 | US20040262732 Semiconductor device and manufacturing method thereof |
| 12/30/2004 | US20040262729 Microelectronic package array |
| 12/30/2004 | US20040262728 Modular device assemblies |
| 12/30/2004 | US20040262727 Computer system implemented on flex tape |
| 12/30/2004 | US20040262716 Semiconductor package having built-in micro electric mechanical system and manufacturing method thereof |
| 12/30/2004 | US20040262644 Hybrid integrated circuit device |
| 12/30/2004 | US20040262617 White light emitting diode and method for manufacturing the same |
| 12/30/2004 | US20040261955 Modular shade system |
| 12/30/2004 | US20040261836 Solar cell module and solar cell module array |
| 12/30/2004 | US20040261834 Chain link metal interconnect structure |
| 12/30/2004 | DE10323007A1 Halbleiteranordnung Semiconductor device |
| 12/30/2004 | DE102004025153A1 Fahrzeugleuchte Vehicle light |
| 12/29/2004 | WO2004114433A2 A two stage energy storage device |
| 12/29/2004 | WO2004088727A8 Multi-chip ball grid array package and method of manufacture |
| 12/29/2004 | WO2004079823A3 Thermally enhanced electronic flip-chip packaging with external-connector-side die and method |
| 12/29/2004 | WO2004057674A3 Electrical connection of optoelectronic devices |
| 12/29/2004 | WO2004025708A3 Support plate for semiconductor components |
| 12/29/2004 | EP1492220A2 IGBT-module |
| 12/29/2004 | EP1492166A1 Semiconductor device, package structure thereof, and method for manufacturing the semiconductor device |