| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
|---|
| 01/20/2005 | US20050012206 Semiconductor unit with cooling system |
| 01/20/2005 | US20050012198 Semiconductor device |
| 01/20/2005 | US20050012196 Multiple die stack apparatus employing T-shaped interposer elements |
| 01/20/2005 | US20050012195 BGA package with stacked semiconductor chips and method of manufacturing the same |
| 01/20/2005 | US20050012192 Hybrid integrated circuit |
| 01/20/2005 | US20050012190 Modular power semiconductor module |
| 01/20/2005 | US20050012189 Integrated circuit package with a balanced-part structure |
| 01/20/2005 | US20050012117 Power MOSFET, power MOSFET packaged device, and method of manufacturing power MOSFET |
| 01/20/2005 | US20050012032 Camera module for compact electronic equipments |
| 01/20/2005 | US20050012021 Profiled photovoltaic roofing panel |
| 01/20/2005 | US20050011656 Packaging of semiconductor devices for increased reliability |
| 01/20/2005 | US20050011551 Thin film solar cell electrical contacts |
| 01/20/2005 | US20050011548 Photovoltaic converter |
| 01/20/2005 | DE10323842B3 Verfahren zum Herstellen einer Chipanordnung und Lack mit ferromagnetischen Partikeln A method of producing a chip arrangement and varnish with ferromagnetic particles |
| 01/19/2005 | EP1499168A2 Method and apparatus for manufacturing a system comprising a component placed at a predetermined place on the surface of a substrate |
| 01/19/2005 | EP1498949A2 Module with tailored interconnections between integrated circuit chips |
| 01/19/2005 | EP1498013A1 Flexible interconnect structures for electrical devices and light sources incorporating the same |
| 01/19/2005 | EP1497852A2 Method and apparatus for connecting vertically stacked integrated circuit chips |
| 01/19/2005 | EP1121840B1 Soldering of a semiconductor chip to a substrate |
| 01/19/2005 | EP0943158B1 Affinity based self-assembly systems and devices for photonic and electronic applications |
| 01/19/2005 | CN1568546A Semiconductor device and method of manufacturing the same |
| 01/19/2005 | CN1568545A Electronic device carrier adapted for transmitting high frequency signals |
| 01/19/2005 | CN1568543A Semiconductor component |
| 01/19/2005 | CN1566246A Adhesive for connecting anisotropic circuit, circuit board connection method and connector |
| 01/19/2005 | CN1185915C Flexible substrate, semiconductor device, camera device and X-ray camera system |
| 01/19/2005 | CN1185715C An integrated circuit and manufacturing method thereof |
| 01/19/2005 | CN1185709C Semiconductor device and mfg. method thereof |
| 01/19/2005 | CN1185708C Multi-chip semiconductor device and storage card |
| 01/19/2005 | CN1185706C 半导体器件 Semiconductor devices |
| 01/19/2005 | CN1185698C Semiconductor device and manufacture method thereof, circuit board and electronic apparatus |
| 01/19/2005 | CN1185695C Method for packaging memory and device for the same |
| 01/19/2005 | CN1185510C Passive radiation optical system module especially for use with light-emitting diodes |
| 01/18/2005 | US6845184 Multi-layer opto-electronic substrates with electrical and optical interconnections and methods for making |
| 01/18/2005 | US6845027 Semiconductor chip |
| 01/18/2005 | US6845017 Substrate-level DC bus design to reduce module inductance |
| 01/18/2005 | US6845012 Coolant cooled type semiconductor device |
| 01/18/2005 | US6844978 Bonding substrate containing optical elements; lithographical generation duplicating masters |
| 01/18/2005 | US6844624 Multichip module |
| 01/18/2005 | US6844619 Compact semiconductor device capable of mounting a plurality of semiconductor chips with high density and method of manufacturing the same |
| 01/18/2005 | US6844614 Semiconductor integrated circuit |
| 01/18/2005 | US6844606 Surface-mount package for an optical sensing device and method of manufacture |
| 01/18/2005 | US6844217 Die support structure |
| 01/18/2005 | US6843335 Power conversion apparatus and mobile object incorporating thereof |
| 01/13/2005 | WO2005004237A1 Method for interconnecting active and passive components, and a resulting thin heterogeneous component |
| 01/13/2005 | WO2005004236A1 Electronic power module comprising a rubber seal and corresponding production method |
| 01/13/2005 | US20050009329 Semiconductor chip production method, semiconductor device production method, semiconductor chip, and semiconductor device |
| 01/13/2005 | US20050009243 Semiconductor device and method of manufacturing the same, cirucit board, and electronic instrument |
| 01/13/2005 | US20050009237 Method of manufacturing semiconductor device and semiconductor device manufacturing apparatus used in it |
| 01/13/2005 | US20050009236 Method of fabrication of stacked semiconductor devices |
| 01/13/2005 | US20050009234 Stacked module systems and methods for CSP packages |
| 01/13/2005 | US20050008832 Connecting microelectronic circuit |
| 01/13/2005 | US20050007708 Controller and rectifier for an electrical machine, and electrical machine |
| 01/13/2005 | US20050006787 Substrate-less microelectronic package |
| 01/13/2005 | US20050006786 Semiconductor device and method of fabricating the same |
| 01/13/2005 | US20050006785 Manufacturing method for multichip module |
| 01/13/2005 | US20050006784 Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device |
| 01/13/2005 | US20050006758 Method for packaging electronic modules and multiple chip packaging |
| 01/13/2005 | US20050006752 Multi-layer interconnection circuit module and manufacturing method thereof |
| 01/13/2005 | US20050006748 Multiple chip semiconductor package |
| 01/13/2005 | US20050006746 Fabrication method for stacked multi-chip package |
| 01/13/2005 | US20050006745 Stacked-type semiconductor device |
| 01/13/2005 | US20050006743 In-line apparatus and method for manufacturing double-sided stacked multi-chip packages |
| 01/13/2005 | US20050006736 Selective consolidation processes for electrically connecting contacts of semiconductor device components |
| 01/13/2005 | US20050006730 Semiconductor component and method of manufacturing same |
| 01/13/2005 | US20050006658 Light emitting diode mounting structure |
| 01/13/2005 | US20050006142 Circuit board with in-built electronic component and method for manufacturing the same |
| 01/13/2005 | US20050006137 Electronic device carrier adapted for transmitting high frequency signals |
| 01/13/2005 | US20050005420 Circuit component, circuit component package, circuit component built-in module, circuit component package production and circuit component built-in module production |
| 01/13/2005 | DE202004016931U1 Solid state vehicle light used internally or externally, has light source constructed as series-connected chip-on-board light-emitting diode devices |
| 01/13/2005 | DE10334634B3 Lateral contacting method for semiconductor chip, by applying adhesive layer, pressing on particle of thermally fusible material, applying semiconductor chip and heating |
| 01/13/2005 | DE10326274A1 Paste composition for solar cell, comprises inorganic powder having melting, softening or decomposition temperature higher than melting point of aluminum and thermal expansion coefficient less than aluminum |
| 01/13/2005 | DE10257707A1 Verfahren zum Herstellen eines gestapelten Chip-Paketes A method of manufacturing a stacked chip package |
| 01/13/2005 | DE102004027960A1 Elektrische Leistungs-Halbleitervorrichtung Electrical power semiconductor device |
| 01/13/2005 | DE102004025616A1 Halbleiterbauteil mit Kühlsystem A semiconductor device comprising the cooling system |
| 01/13/2005 | DE102004012845A1 Verfahren zur Herstellung einer Halbleitervorrichtung, Halbleitervorrichtung, Schaltungssubstrat und elektronischer Apparat A process for producing a semiconductor device, semiconductor device, electronic circuit substrate and apparatus |
| 01/12/2005 | EP1496381A2 Mount assembly, optical transmission line and photoelectric circuit board |
| 01/12/2005 | CN1565055A Multiple die interconnect system |
| 01/12/2005 | CN1565053A Process to allow electrical and mechanical connection of an electrical device with a face equipped with contact pads |
| 01/12/2005 | CN1184685C Semconductor device and its mfg. method and electronic camera installation |
| 01/12/2005 | CN1184683C Semconductor and liquid crystal module of utilizing semiconductor |
| 01/12/2005 | CN1184581C Light emission and receiving equipment structure |
| 01/11/2005 | US6842346 Semiconductor device |
| 01/11/2005 | US6841931 LED lamp |
| 01/11/2005 | US6841884 Re-distribution wirings on dielectric layer connect plurality of conductive posts to electrode pads; sealing resin for chip mounting surface |
| 01/11/2005 | US6841883 Multi-dice chip scale semiconductor components and wafer level methods of fabrication |
| 01/11/2005 | US6841881 Semiconductor device and a method of manufacturing the same |
| 01/11/2005 | US6841870 Semiconductor device |
| 01/11/2005 | US6841869 Electronic package assembly |
| 01/11/2005 | US6841866 Power semiconductor device |
| 01/11/2005 | US6841849 Semiconductor device and method of manufacturing the same, circuit board and electronic instrument |
| 01/11/2005 | US6841815 Transimpedance amplifier assembly with separate ground leads and separate power leads for included circuits |
| 01/11/2005 | US6841799 Optoelectronic package |
| 01/11/2005 | US6841728 Solar cell stringing machine |
| 01/11/2005 | US6841469 Semiconductor device and method of manufacturing the same |
| 01/11/2005 | US6841454 Chip-like electronic components, a method of manufacturing the same, a pseudo wafer therefor and a method of manufacturing thereof |
| 01/11/2005 | US6841418 Multi-substrate microelectronic packages and methods for manufacture |
| 01/11/2005 | US6841417 Semiconductor device and semiconductor assembly apparatus for semiconductor device |
| 01/11/2005 | US6841022 Adhesive-coated electronic parts on a connection sheet |
| 01/11/2005 | US6840783 Press-fit bus bar distributing power |
| 01/06/2005 | WO2005001936A1 Rectifier for a vehicle alternator |