| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 02/03/2005 | DE102004029844A1 Semiconductor package for mobile apparatus e.g. cell phone, has selecting circuit sending disable control signal to power generator when ground voltage is connected to input of selecting circuit |
| 02/02/2005 | EP1503417A1 Stacked memory and manufacturing method thereof |
| 02/02/2005 | EP1503406A2 Back-side contact pads of a semiconductor chip |
| 02/02/2005 | EP1503139A2 LED light source assembly |
| 02/02/2005 | EP1502752A2 Light source unit using light emitting diodes |
| 02/02/2005 | CN2676413Y Semiconductor lighting illuminator |
| 02/02/2005 | CN2676412Y High voltage silicon stack assembly |
| 02/02/2005 | CN1575511A Method for contacting electrical contact surfaces of a substrate and device consisting of a substrate having electrical contact surfaces |
| 02/02/2005 | CN1575510A Adhesive wafers for die attach application |
| 02/02/2005 | CN1575108A Method of making mounting plates |
| 02/02/2005 | CN1575090A 混合集成电路装置 Hybrid integrated circuit device |
| 02/02/2005 | CN1574391A Power MOSFET, power MOSFET packaged device, and method of manufacturing power MOSFET |
| 02/02/2005 | CN1574349A Lsi package |
| 02/02/2005 | CN1574348A Semiconductor device and switching element |
| 02/02/2005 | CN1574346A Method of manufacturing a semiconductor device |
| 02/02/2005 | CN1574345A 半导体封装件 The semiconductor package |
| 02/02/2005 | CN1574344A Three-dimensionally mounted semiconductor module and three-dimensionally mounted semiconductor system |
| 02/02/2005 | CN1574343A 半导体模块 Semiconductor Modules |
| 02/02/2005 | CN1574338A 半导体器件 Semiconductor devices |
| 02/02/2005 | CN1574332A Electric power semiconductor device |
| 02/02/2005 | CN1574325A Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument |
| 02/02/2005 | CN1574320A Semiconductor package device and method for fabricating the same |
| 02/02/2005 | CN1574316A Semiconductor unit with cooling system |
| 02/02/2005 | CN1574309A Stacked-type semiconductor device |
| 02/02/2005 | CN1574302A 半导体器件 Semiconductor devices |
| 02/02/2005 | CN1574264A Semiconductor device and manufacturing method of the same |
| 02/02/2005 | CN1574212A Semiconductor device and its manufacturing method |
| 02/02/2005 | CN1573206A Vehicular lamp |
| 02/02/2005 | CN1187821C 电力电子装置 Power electronic devices |
| 02/01/2005 | US6850312 Apparatuses and methods for flexible displays |
| 02/01/2005 | US6849952 Semiconductor device and its manufacturing method |
| 02/01/2005 | US6849951 Bypass capacitor solution for integrated circuit dice |
| 02/01/2005 | US6849949 Thin stacked package |
| 02/01/2005 | US6849945 Multi-layered semiconductor device and method for producing the same |
| 02/01/2005 | US6849940 Semiconductors; heat sinks; printed circuits |
| 02/01/2005 | US6849932 Double-sided thermally enhanced IC chip package |
| 02/01/2005 | US6849876 Light emitting device |
| 02/01/2005 | US6849802 Semiconductor chip, chip stack package and manufacturing method |
| 02/01/2005 | US6849480 Surface mount IC stacking method and device |
| 02/01/2005 | US6848177 Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme |
| 02/01/2005 | CA2266712C Low resistance current transfer device for a circuit of a brushless exciter |
| 01/28/2005 | CA2472662A1 Led light source assembly |
| 01/27/2005 | WO2005008791A2 Semiconductor light emitting device, method of manufacturing the same, and lighting apparatus and display apparatus using the same |
| 01/27/2005 | WO2005008765A2 Semiconductor power module with strip conductors which are detached from a substrate as external connections |
| 01/27/2005 | WO2005008730A2 Low cost, high performance flip chip package structure |
| 01/27/2005 | WO2004102653A8 Semiconductor device and interposer |
| 01/27/2005 | WO2004080134A3 High frequency chip packages with connecting elements |
| 01/27/2005 | US20050019984 Multiple substrate microelectronic devices and methods of manufacture |
| 01/27/2005 | US20050019983 Method of manufacturing a stackable ball grid array |
| 01/27/2005 | US20050018955 Light-beam switching/adjusting apparatus and manufacturing method thereof |
| 01/27/2005 | US20050018505 Memory package |
| 01/27/2005 | US20050018412 Pitch change and chip scale stacking system |
| 01/27/2005 | US20050017740 Module part |
| 01/27/2005 | US20050017621 White light led with multicolor light-emitting layers of macroscopic structure widths, arranged on a light diffusing glass |
| 01/27/2005 | US20050017355 Water level processing method and structure to manufacture two kinds of bumps, gold and solder, on one wafer |
| 01/27/2005 | US20050017347 Circuit module and manufacturing method thereof |
| 01/27/2005 | US20050017346 Semiconductor device, package structure thereof, and method for manufacturing the semiconductor device |
| 01/27/2005 | US20050017344 Interconnecting component |
| 01/27/2005 | US20050017341 Semiconductor device voltage supply for a system with at least two, especially stacked, semiconductor devices |
| 01/27/2005 | US20050017340 Semiconductor device and fabrication method thereof |
| 01/27/2005 | US20050017339 Semiconductor device and switching element |
| 01/27/2005 | US20050017338 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument |
| 01/27/2005 | US20050017337 Stacking apparatus for integrated circuit assembly |
| 01/27/2005 | US20050017336 [multi-chip package] |
| 01/27/2005 | US20050017264 Module for high voltage power for converting a base of IGBT components |
| 01/27/2005 | US20050016581 Solar power generation system having cooling mechanism |
| 01/27/2005 | US20050016579 Solar power devices for providing power to handheld devices |
| 01/27/2005 | US20050016577 Process for preparing nano-porous metal oxide semiconductor layers |
| 01/27/2005 | DE10333328B3 Leistungshalbleitermodul in skalierbarer Aufbautechnik Power semiconductor module in a scalable design technology |
| 01/27/2005 | DE102004031954A1 Semiconductor package for use in electronic product, has substrate including inner lands connected to pads of semiconductor chip via window of substrate by electrical connection medium |
| 01/27/2005 | DE102004007978A1 Multichip-Modul Multichip module |
| 01/27/2005 | DE10141571B4 Verfahren zum Zusammenbau eines Halbleiterbauelements und damit hergestellte integrierte Schaltungsanordnung, die für dreidimensionale, mehrschichtige Schaltungen geeignet ist A method of assembling a semiconductor device and integrated circuit arrangement so manufactured, which is suitable for three-dimensional, multi-layer circuits |
| 01/26/2005 | EP1501127A2 Power semiconductor module with base plate having high bending stiffness |
| 01/26/2005 | EP1501126A1 Semiconductor chip having a cavity for stacked die application |
| 01/26/2005 | EP1501125A2 Power semiconductor module with scalable structural-design technology |
| 01/26/2005 | EP1500142A2 Component |
| 01/26/2005 | CN1572025A Semiconductor device and its manufacturing method |
| 01/26/2005 | CN1572024A Method and apparatus for die stacking |
| 01/26/2005 | CN1571621A Wiring circuit board, manufacturing method for the wiring circuit board, and circuit module |
| 01/26/2005 | CN1571159A Semiconductor device, system device using it, and manufacturing method of a semiconductor device |
| 01/26/2005 | CN1571157A Stack type double-chip packaging structure |
| 01/25/2005 | US6847575 Semiconductor device including multi-chip |
| 01/25/2005 | US6847275 High-frequency circuit board unit, high frequency module using the same unit, electronic apparatus using the same module, and manufacturing method for the high-frequency circuit board unit |
| 01/25/2005 | US6847220 Method for ball grid array chip packages having improved testing and stacking characteristics |
| 01/25/2005 | US6847112 Semiconductor device and manufacturing the same |
| 01/25/2005 | US6847109 Area array semiconductor package and 3-dimensional stack thereof |
| 01/25/2005 | US6847105 Bumping technology in stacked die configurations |
| 01/25/2005 | US6846987 Power electronics component |
| 01/25/2005 | US6846703 Three-dimensional device |
| 01/25/2005 | US6846699 Semiconductor device and method of manufacture thereof, circuit board, and electronic instrument |
| 01/25/2005 | US6846093 Modular mounting arrangement and method for light emitting diodes |
| 01/25/2005 | CA2350402C Ink tank and ink jet recording apparatus provided with the same |
| 01/20/2005 | WO2005006556A2 Integrated circuit with interface tile for coupling to a stacked -die second integrated circuit |
| 01/20/2005 | WO2005006438A1 Microelectronic package method and apparatus |
| 01/20/2005 | US20050014397 Tailored interconnect module |
| 01/20/2005 | US20050014311 Multichip semiconductor device, chip therefor and method of formation thereof |
| 01/20/2005 | US20050013118 Cooling body and rectifier module for an electrical machine |
| 01/20/2005 | US20050012457 Light-emitting semiconductor device packaged with light-emitting diode and current-driving integrated circuit |
| 01/20/2005 | US20050012226 Chip package structure |
| 01/20/2005 | US20050012215 Semiconductor arrangement |