| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 02/10/2005 | US20050029650 Method for fabricating semiconductor components with thinned substrate, back side contacts and circuit side contacts |
| 02/10/2005 | US20050029645 Stacked mass storage flash memory package |
| 02/10/2005 | US20050029644 [multi-chip package and manufacturing method thereof] |
| 02/10/2005 | US20050029633 Optical semiconductor device and method of manufacturing the same |
| 02/10/2005 | US20050029630 Manufacturing method for semiconductor device, semiconductor device, and electronic apparatus |
| 02/10/2005 | US20050029617 Semiconductor module |
| 02/10/2005 | US20050029550 Semiconductor die packages with recessed interconnecting structures |
| 02/10/2005 | US20050029535 Light emitting diodes packaged for high temperature operation |
| 02/10/2005 | US20050029529 Light-emitting diode array |
| 02/10/2005 | US20050028363 Contact structures and methods for making same |
| 02/10/2005 | DE10316357B4 Verfahren zur Überwachung von Leistungshalbleiterbauelementen The method for monitoring power semiconductor components |
| 02/09/2005 | EP1505858A2 Circuit module and manufacturing method thereof |
| 02/09/2005 | EP1505660A1 Illumination arrangement with reduced depth for a vehicle headlight |
| 02/09/2005 | EP1505659A1 Power source device |
| 02/09/2005 | EP1505645A2 Resin moulded electronic module |
| 02/09/2005 | EP1505336A2 Lighting assembly |
| 02/09/2005 | CN2678140Y LED luminous module |
| 02/09/2005 | CN2678139Y Light source structure of LED |
| 02/09/2005 | CN2678138Y LED light source structure |
| 02/09/2005 | CN2677755Y Integral lamp with metal radiator |
| 02/09/2005 | CN1579026A Radial power megasonic transducer |
| 02/09/2005 | CN1579020A Semiconductor device and producing method thereof |
| 02/09/2005 | CN1579015A 模块部件 Module Features |
| 02/09/2005 | CN1579004A Method of manufacturing modules with an integrated circuit |
| 02/09/2005 | CN1579002A Opto-electronic device integration |
| 02/09/2005 | CN1578587A Hybrid integrated circuit device |
| 02/09/2005 | CN1577901A Multi-color light emitting diode package |
| 02/09/2005 | CN1577844A 电源装置 Power supply unit |
| 02/09/2005 | CN1577841A Stacked chip semiconductor device and method for manufacturing the same |
| 02/09/2005 | CN1577840A Stack package of semiconductor device |
| 02/09/2005 | CN1577839A Hybrid integrated circuit |
| 02/09/2005 | CN1577826A Semiconductor device and mixed integrated circuit device |
| 02/09/2005 | CN1577820A Semiconductor package and producing method thereof |
| 02/09/2005 | CN1577819A Circuit board with in-built electronic component and method for manufacturing the same |
| 02/09/2005 | CN1577813A 电路模块及其制造方法 Circuit module and manufacturing method thereof |
| 02/09/2005 | CN1577812A Diode presenting high breakdown voltage |
| 02/09/2005 | CN1577810A Semiconductor chip side contacting method |
| 02/09/2005 | CN1577798A Method of manufacturing semiconductor device and semiconductor device manufacturing apparatus used in it |
| 02/09/2005 | CN1577779A Central welding pad memory body stacking encapsulating assembly and encapsulating process thereof |
| 02/09/2005 | CN1577777A Semiconductor device and method of fabricating the same, |
| 02/09/2005 | CN1577725A Semiconductor device and method of manufacturing the same, |
| 02/09/2005 | CN1188911C Security method and device for a chip stack with a multidimensional structure |
| 02/09/2005 | CN1188906C Manufacturing method of stack chip package |
| 02/09/2005 | CN1188817C LED display systrems and method for enhancing light intensity |
| 02/08/2005 | US6853665 Photodiode configuration having two photodiodes, a laser diode configuration having the photodiode configuration, and method for connecting the photodiode configuration to a substrate |
| 02/08/2005 | US6853085 Method and device for securing a multi-dimensionally constructed chip stack and chip configuration |
| 02/08/2005 | US6853064 Semiconductor component having stacked, encapsulated dice |
| 02/08/2005 | US6853063 Semiconductor device and communication terminal using thereof |
| 02/08/2005 | US6852621 Semiconductor device and manufacturing method therefor, circuit board, and electronic equipment |
| 02/08/2005 | US6852571 Method of manufacturing stacked semiconductor device |
| 02/08/2005 | US6852570 Method of manufacturing a stacked semiconductor device |
| 02/08/2005 | US6852553 Semiconductor device fabrication method and semiconductor device fabrication apparatus |
| 02/03/2005 | WO2005011342A2 Embedded directional impedance control channels for pc boards |
| 02/03/2005 | WO2005011099A2 Switching device, generator-motor apparatus using switching device, drive system including generator-motor apparatus, and computer-readable recording medium on which a program for directing computer to perform control of generator-motor apparatus is recorded |
| 02/03/2005 | WO2005011090A1 Electronic package for electrical machine |
| 02/03/2005 | WO2005010990A2 Memory stack using flexible circuit and low-profile contacts |
| 02/03/2005 | WO2005010976A1 A programmable multi-chip module |
| 02/03/2005 | WO2005010937A2 Packaging of semiconductor devices for incrased reliability |
| 02/03/2005 | WO2004109812A3 Housing for a radiation-emitting component, method for the production thereof, and radiation-emitting component |
| 02/03/2005 | US20050026414 Methods for consolidating previously unconsolidated conductive material to form conductive structures or contact pads or secure conductive structures to contact pads |
| 02/03/2005 | US20050026413 Method of fabricating cylindrical bonding structure |
| 02/03/2005 | US20050026347 Methods of forming semiconductor logic circuitry, and semiconductor logic circuit constructions |
| 02/03/2005 | US20050026339 Methods of forming semiconductor circuitry, and semiconductor circuit constructions |
| 02/03/2005 | US20050026335 Method of fabricating semiconductor device and semiconductor device |
| 02/03/2005 | US20050026328 Process for manufacturing semiconductor device |
| 02/03/2005 | US20050026325 Packaged microelectronic components |
| 02/03/2005 | US20050026314 Method of manufacturing semiconductor device |
| 02/03/2005 | US20050024958 Power supply device |
| 02/03/2005 | US20050024908 System and method for integrating a digital core with a switch mode power supply |
| 02/03/2005 | US20050024870 LED light source assembly |
| 02/03/2005 | US20050024868 Light-emitting unit, light-emitting unit assembly, and lighting apparatus produced using a plurality of light-emitting units |
| 02/03/2005 | US20050024838 Power supply packaging system |
| 02/03/2005 | US20050024834 Heatsinking electronic devices |
| 02/03/2005 | US20050024833 Rectifier bridge assembly |
| 02/03/2005 | US20050024805 Low-inductance circuit arrangement for power semiconductor modules |
| 02/03/2005 | US20050023675 Semiconductor device and manufacturing method of the same |
| 02/03/2005 | US20050023674 Multi-chip module having bonding wires and method of fabricating the same |
| 02/03/2005 | US20050023673 Transistor module |
| 02/03/2005 | US20050023668 Stacked memory and manufacturing method thereof |
| 02/03/2005 | US20050023666 Semiconductor device and method of fabricating the same, circuit board, and electronic instrument |
| 02/03/2005 | US20050023664 High density chip carrier with integrated passive devices |
| 02/03/2005 | US20050023662 Techniques for packaging a multiple device component |
| 02/03/2005 | US20050023659 Semiconductor chip package and stacked module having a functional part and packaging part arranged on a common plane |
| 02/03/2005 | US20050023658 Leadless type semiconductor package, and production process for manufacturing such leadless type semiconductor package |
| 02/03/2005 | US20050023657 Stacked chip-packaging structure |
| 02/03/2005 | US20050023656 Vertical system integration |
| 02/03/2005 | US20050023652 Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board |
| 02/03/2005 | US20050023575 ESD protection configuration and method for light emitting diodes |
| 02/03/2005 | US20050023572 Electronic device package |
| 02/03/2005 | US20050023562 Standoffs for centralizing internals in packaging process |
| 02/03/2005 | US20050023551 Light source unit |
| 02/03/2005 | US20050023550 Flip chip light emitting diode devices having thinned or removed substrates |
| 02/03/2005 | US20050023537 LED lamps |
| 02/03/2005 | US20050023489 Chip type photo coupler |
| 02/03/2005 | US20050023475 Guard ring for direct photo-to-electron conversion detector array |
| 02/03/2005 | US20050023474 Nuclear imaging using three-dimensional gamma particle interaction detection |
| 02/03/2005 | US20050023441 Optical semiconductor device and method of manufacturing the same |
| 02/03/2005 | US20050022860 Thin-film photovoltaic module |
| 02/03/2005 | DE102004033401A1 Mikroelektronikeinheit mit rohrförmigem Gehäuse Microelectronics unit with a tubular housing |
| 02/03/2005 | DE102004031920A1 Mehrchippackung und Herstellungsverfahren Multi-chip package and manufacturing processes |