| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 02/23/2005 | CN1190844C Method for mfg. optical illuminating device |
| 02/23/2005 | CN1190843C Semiconductor device and mfg. method thereof |
| 02/23/2005 | CN1190842C Semiconductor package with stack chip |
| 02/23/2005 | CN1190838C 功率半导体模块 Power semiconductor module |
| 02/23/2005 | CN1190621C Lighting apparatus |
| 02/22/2005 | US6858941 Multi-chip stack and method of fabrication utilizing self-aligning electrical contact array |
| 02/22/2005 | US6858938 Semiconductor device |
| 02/22/2005 | US6858932 Packaged semiconductor device and method of formation |
| 02/22/2005 | US6858930 Multi chip module |
| 02/22/2005 | US6858926 Stackable ceramic FBGA for high thermal applications |
| 02/22/2005 | US6858920 Semiconductor device with stacked semiconductor elements |
| 02/22/2005 | US6858892 Semiconductor device |
| 02/22/2005 | US6858872 Optical interconnection integrated circuit, method of manufacturing optical interconnection integrated circuit, electro-optical apparatus, and electronic apparatus |
| 02/22/2005 | US6858870 Multi-chip light emitting diode package |
| 02/22/2005 | US6858807 Substrate for receiving a circuit configuration and method for producing the substrate |
| 02/22/2005 | US6858795 Radiation shielding of three dimensional multi-chip modules |
| 02/22/2005 | US6858468 Techniques for joining an opto-electronic module to a semiconductor package |
| 02/22/2005 | US6857767 Lighting apparatus with enhanced capability of heat dissipation |
| 02/22/2005 | US6857470 Stacked chip package with heat transfer wires |
| 02/17/2005 | WO2005015646A1 Led illumination light source |
| 02/17/2005 | WO2004109801A8 Power semiconductor module |
| 02/17/2005 | WO2004100626A3 Radiocommunication module on a substrate having a surface area greater than that of the encapsulation case thereof, and corresponding radiocommunication device and platform |
| 02/17/2005 | WO2004034459A3 Method for producing a thinned down stack of chips |
| 02/17/2005 | WO2004008488A8 Ganged detector pixel, photon/pulse counting radiation imaging device |
| 02/17/2005 | US20050037537 Method for manufacturing semiconductor devices |
| 02/17/2005 | US20050036350 Memory module |
| 02/17/2005 | US20050036291 Semiconductor package with heat dissipating structure |
| 02/17/2005 | US20050035816 Printed circuit board for a three-phase power device having embedded directional impedance control channels |
| 02/17/2005 | US20050035689 Segmented uniform energy megasonic transducer |
| 02/17/2005 | US20050035467 Semiconductor package using flexible film and method of manufacturing the same |
| 02/17/2005 | US20050035461 Multiple stacked-chip packaging structure |
| 02/17/2005 | US20050035445 Power semiconductor module with deflection-resistant base plate |
| 02/17/2005 | US20050035441 Integrated circuit stack with partially etched lead frames |
| 02/17/2005 | US20050035440 Stacked chip assembly with stiffening layer |
| 02/17/2005 | US20050035439 Semiconductor module with scalable construction |
| 02/17/2005 | US20050035434 Module for EPAS/EHPAS applications |
| 02/17/2005 | US20050035358 Structure of light-emitting diode array module |
| 02/17/2005 | US20050035356 Opto-coupler |
| 02/17/2005 | US20050035347 Probe card assembly |
| 02/17/2005 | US20050035181 Package substrate and process thereof |
| 02/17/2005 | US20050034752 Solar concentrator array with grouped adjustable elements |
| 02/17/2005 | US20050034303 Process to allow electrical and mechanical connection of an electrical device with a face equipped with contact pads |
| 02/17/2005 | DE10345391B3 Multi-chip module for a semiconductor device comprises a rewiring arrangement formed as a contact device on the substrate and on a contact protrusion |
| 02/17/2005 | DE10334079A1 Transistormodul Transistor module |
| 02/17/2005 | DE10332829A1 Semiconductor stack e.g. for part-circuits integrated into semiconductor chips, with face-to-face technology, has at least one contact pad of bottom chip provided for direct connection to contact surface of top-chip |
| 02/17/2005 | DE10331574A1 Leistungshalbleitermodul The power semiconductor module |
| 02/17/2005 | DE102004036316A1 Schutzring für ein Detektorarray zur direkten Photo-Elektronenumwandlung Protection ring for a detector array for direct photo-electron conversion |
| 02/17/2005 | DE10159119B4 Umrichter in Druckkontaktierung Inverter in pressure contact |
| 02/16/2005 | EP1507291A2 Power module for solid state relay |
| 02/16/2005 | EP1506575A2 Power supply component assembly on a printed circuit and method for obtaining same |
| 02/16/2005 | CN2679851Y Directly projecting LED bulb |
| 02/16/2005 | CN2679483Y Curve LED combiend lamp and desk lamp made therefrom |
| 02/16/2005 | CN2679478Y Bulb with light modulation function |
| 02/16/2005 | CN1582502A Light receiving or emitting semiconductor apparatus |
| 02/16/2005 | CN1581524A Light-emitting diode lamp |
| 02/16/2005 | CN1581484A Semiconductor device |
| 02/16/2005 | CN1581483A Semiconductor device and its making method, circuit substrate and electronic machine |
| 02/16/2005 | CN1581482A Circuit moudel |
| 02/16/2005 | CN1581474A Leadless type semiconductor package, and production process for manufacturing such leadless type semiconductor package |
| 02/16/2005 | CN1579791A Light source unit |
| 02/16/2005 | CN1579328A Guard ring for direct photo-to-electron conversion detector array |
| 02/15/2005 | US6856715 Apparatus comprising electronic and/or optoelectronic circuitry and method for realizing said circuitry |
| 02/15/2005 | US6856235 Methods for manufacturing resistors using a sacrificial layer |
| 02/15/2005 | US6856213 High frequency composite switch module |
| 02/15/2005 | US6856087 Full-color display device |
| 02/15/2005 | US6856074 Piezoelectric ignition mechanism |
| 02/15/2005 | US6856027 Multi-chips stacked package |
| 02/15/2005 | US6856026 Semiconductor chip, wiring board and manufacturing process thereof as well as semiconductor device |
| 02/15/2005 | US6856025 Chip and wafer integration process using vertical connections |
| 02/15/2005 | US6856017 Device having resin package and method of producing the same |
| 02/15/2005 | US6856012 Contact system |
| 02/15/2005 | US6856010 Thin scale outline package |
| 02/15/2005 | US6856009 Techniques for packaging multiple device components |
| 02/15/2005 | US6856007 High-frequency chip packages |
| 02/15/2005 | US6855972 Composite integrated circuit and its fabrication method |
| 02/15/2005 | US6855577 Semiconductor devices having different package sizes made by using common parts |
| 02/15/2005 | US6855572 Castellation wafer level packaging of integrated circuit chips |
| 02/10/2005 | WO2005013660A1 Improved rectifier bridge assembly |
| 02/10/2005 | WO2005013380A1 Semiconductor led device |
| 02/10/2005 | WO2005013378A1 An improved thin-film photovoltaic module |
| 02/10/2005 | WO2005013366A1 Heatsinking electronic devices |
| 02/10/2005 | WO2005013365A2 Semiconductor light emitting device, light emitting module, and lighting apparatus |
| 02/10/2005 | WO2005013364A2 Electronic component and panel for producing the same |
| 02/10/2005 | WO2005013363A2 Circuit arrangement placed on a substrate and method for producing the same |
| 02/10/2005 | WO2005013361A1 High-heat-resistant semiconductor device |
| 02/10/2005 | WO2004100261A3 Semiconductor wafer, panel and electronic component comprising stacked semiconductor chips, and method for the production thereof |
| 02/10/2005 | WO2004070792A3 Thin multiple semiconductor die package |
| 02/10/2005 | US20050032349 Low fabrication cost, fine pitch and high reliability solder bump |
| 02/10/2005 | US20050032347 Method for contacting electrical contact surfaces of a substrate and device consisting of a substrate having electrical contact surfaces |
| 02/10/2005 | US20050032274 Methods for securing vertically mountable semiconductor devices in back-to back relation |
| 02/10/2005 | US20050030823 Electronic circuit device |
| 02/10/2005 | US20050030815 Semiconductor memory module |
| 02/10/2005 | US20050030762 Light-emitting diode lamp |
| 02/10/2005 | US20050030760 Illumination arrangement with reduced depth for a vehicle headlight |
| 02/10/2005 | US20050030717 Cooler for cooling electric part |
| 02/10/2005 | US20050030698 Electronic unit integrated into a flexible polymer body |
| 02/10/2005 | US20050030084 Semiconductor device |
| 02/10/2005 | US20050029674 Multi-chip module |
| 02/10/2005 | US20050029673 Multi-chip semiconductor device with specific chip arrangement |
| 02/10/2005 | US20050029651 Semiconductor apparatus and method of manufacturing the same |