Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
08/2014
08/13/2014CN203774290U Ic电源芯片 Ic power chip
08/13/2014CN203774281U 一种整体注塑封装的智能功率模块 Injection of a holistic package intelligent power module
08/13/2014CN103988303A 用于电机的功率模块 For motor power module
08/13/2014CN103988302A 电力变换装置 The power conversion apparatus
08/13/2014CN103988298A 半导体装置 Semiconductor device
08/13/2014CN103988297A 功率模块用基板、自带散热器的功率模块用基板、功率模块、助焊剂成分侵入防止层形成用浆料及接合体的接合方法 A power module substrate, the radiator comes power module substrate, a power module, a flux component to prevent intrusion of the slurry and the assembly method of joining layer
08/13/2014CN103985809A Led照明大芯片 Led lighting big chip
08/13/2014CN103985705A 芯片发光面积利用率高的交流高压的发光芯片 Chip light emitting area of ​​high utilization of AC high voltage light-emitting chips
08/13/2014CN103985704A 一种采用对称型并联的电力电子模块 A symmetrical parallel power electronic modules
08/13/2014CN103985703A 功率晶体管布置以及具有该布置的封装体 Power transistor arrangement and the arrangement of having the package
08/13/2014CN103985702A 电容器结构 Capacitor structure
08/13/2014CN103985693A 无刷直流电机集成驱动电路的封装结构及其封装方法 Package and packaging method integrated brushless DC motor drive circuit
08/13/2014CN103985692A Ac-dc电源电路的封装结构及其封装方法 Package and packaging method Ac-dc power supply circuit
08/13/2014CN103985648A 半导体的晶圆级封装方法和半导体封装件 The semiconductor wafer-level packaging method and a semiconductor package
08/13/2014CN103985642A 晶圆级封装方法及封装结构 Wafer-level packaging method and package structure
08/13/2014CN102237354B 电路基板 Circuit board
08/12/2014US8805916 Digital signal processing circuitry with redundancy and bidirectional data paths
08/12/2014US8805132 Integrated circuit package connected to a data transmission medium
08/12/2014US8803598 Solid-state imaging device
08/12/2014US8803597 Semiconductor integraged circuit having compatible mode selection circuit
08/12/2014US8803422 Light emitting device in which traces of light emitting elements merge into a single trace and lighting apparatus including the same
08/12/2014US8803334 Semiconductor package including a semiconductor chip with a through silicon via
08/12/2014US8803180 Micro-bead blasting process for removing a silicone flash layer
08/12/2014US8802497 Forming semiconductor chip connections
08/12/2014US8801279 Semiconductor device with stacked structure having through electrode, semiconductor memory device, semiconductor memory system, and operating method thereof
08/07/2014WO2014120883A1 Multi-die wirebond packages with elongated windows
08/07/2014WO2014120484A1 Top package of a package-on-package for memory dies
08/07/2014WO2014120483A1 ULTRA THIN PoP PACKAGE
08/07/2014WO2014074933A3 Microelectronic assembly with thermally and electrically conductive underfill
08/07/2014US20140220737 Flip-chip hybridization of microelectronic components using suspended fusible resistive connection elements
08/07/2014US20140218098 Rf switches having increased voltage swing uniformity
08/07/2014US20140217617 Multi-die wirebond packages with elongated windows
08/07/2014US20140217616 Stack package and method of manufacturing stack package
08/07/2014US20140217587 Wafer Leveled Chip Packaging Structure and Method Thereof
08/07/2014US20140217586 Package-on-package device
08/07/2014US20140217585 3d integrated circuit package with through-mold first level interconnects
08/07/2014US20140217569 Semiconductor device and method of manufacturing the same
08/07/2014US20140217459 Substrate for light emitting element and light emitting device
08/07/2014US20140217431 Display device, method for manufacturing the same, and electronic device
08/07/2014US20140217429 Light emitting diode display panel
08/07/2014US20140217426 Semiconductor integrated circuit device, electronic apparatus, and display apparatus
08/07/2014DE112011105802T5 Leistungsmodul, elektrischer Leistungsumwandler und Elektrofahrzeug Power module, electric power converters and electric vehicle
08/07/2014DE102014201227A1 Halbleitervorrichtung und verfahren zum herstellen derselben A semiconductor device and method of manufacturing the same
08/07/2014DE102014101261A1 Leistungstransistoranordnung und Verfahren zu deren Herstellung Output transistor arrangement and methods for their preparation
08/07/2014DE102013219959A1 Halbleitervorrichtung und Verfahren zum Herstellen derselben A semiconductor device and method of manufacturing the same
08/07/2014DE102013201775A1 Beleuchtungsmodul und Verfahren zur Herstellung eines Beleuchtungsmoduls Lighting module and method of manufacturing a illumination module
08/07/2014DE102008035911B4 Verfahren zum Herstellen eines integrierten Schaltungsmoduls A method of manufacturing an integrated circuit module
08/07/2014DE102004021862B4 Stromsenor Current Senor
08/06/2014EP2763170A1 Lighting device
08/06/2014EP2763166A1 Heat dissipation structure, power module, method for manufacturing heat dissipation structure and method for manufacturing power module
08/06/2014EP2763165A1 Power module
08/06/2014EP2763160A1 Semiconductor device
08/06/2014EP2761654A1 Clamping mechanism and method for applying rated force to power conversion apparatus
08/06/2014EP2761653A1 Reconstituted wafer package with high voltage discrete active dice and integrated field plate for high temperature leakage current stability
08/06/2014EP2761056A2 Layered composite of a substrate film and of a layer assembly comprising a sinterable layer made of at least one metal powder and a solder layer
08/06/2014CN203760513U Led显示屏器件及led显示模组 Led display devices and led display module
08/06/2014CN203760512U 一种led显示屏器件及led显示模组 One kind of led display devices and led display module
08/06/2014CN203760509U 一种360度发光的柔性led发光条 One kind of 360-degree light-emitting flexible led light bar
08/06/2014CN203760473U 一种系统级led封装器件 A system-level devices led package
08/06/2014CN203760472U 一种系统级led封装器件 A system-level devices led package
08/06/2014CN203760471U 一种led的组件 One kind of led components
08/06/2014CN203760470U 一种交流供电的led器件 An AC-powered devices led
08/06/2014CN203760469U 一种led组件 One kind of led module
08/06/2014CN203760468U 嵌入裸芯片背光源结构 Embed die backlight structure
08/06/2014CN203760467U 一种可调色温的白光led光源 An adjustable color temperature of white led light
08/06/2014CN203760466U 一种高导热高光输出的led封装基板 Led package substrate a high light output of a high thermal
08/06/2014CN203760465U 一种新型功率半导体模块 A novel power semiconductor module
08/06/2014CN203760456U 无引线球脚表贴式高密度厚膜混合集成电路 Leadless surface mount foot ball high density thick film hybrid integrated circuits
08/06/2014CN203760455U 功率驱动芯片及其封装组件 Power driver chip and package assembly
08/06/2014CN203760449U 一种容量为16M×16bit的立体封装NOR FLASH存储器 One kind of capacity is 16M × 16bit stereo package NOR FLASH memory
08/06/2014CN103974585A 半导体模块装置和用于制造半导体模块装置的方法 The method of manufacturing a semiconductor device module device and a semiconductor module for
08/06/2014CN103974485A 发光模块 Emitting module
08/06/2014CN103973131A 半导体系统 Semiconductor Systems
08/06/2014CN103972380A 一种led电路板 One kind of led board
08/06/2014CN103972374A 多垂直led封装结构 More vertical structure led package
08/06/2014CN103972369A 一种led灯条及其制造方法 A lamp led strip and its manufacturing method
08/06/2014CN103972358A 双面发光的led灯板结构及其制造方法 Sided glowing led light board structure and manufacturing method
08/06/2014CN103972354A 多个蓝光发光二极管的白光封装 A plurality of blue LED white light package
08/06/2014CN103972224A 具有有源内插器的集成电路封装 Integrated circuit package having an active interpolator
08/06/2014CN103972223A Led多杯集成一体化cob光源及其封装方法 Led light more cups for Integration cob and packaging method
08/06/2014CN103972222A Led光源封装方法、led光源封装结构及光源模块 Led light source encapsulation method, led light source module package structure and
08/06/2014CN103972221A Led光源封装结构及led光源封装方法 Led light led light package structure and encapsulation method
08/06/2014CN103972220A 光色可调的双杯贴片型led及其制造工艺 Dual cup SMD led light color tunable and manufacturing process
08/06/2014CN103972219A 灯单元 Light unit
08/06/2014CN103972218A 集成无源器件扇出型晶圆级封装结构及制作方法 Integrated passives fan-out wafer level package structure and method of making
08/06/2014CN103972202A 电路装置及pcb板 Circuit device and pcb board
08/06/2014CN103972193A 功率晶体管装置和用于制造功率晶体管装置的方法 Power transistor device and a method of manufacturing apparatus for power transistors
08/06/2014CN103972140A 封装方法及封装半导体器件 Packaging method and packaging a semiconductor device
08/06/2014CN102479776B 一种基于铕配合物的红色发光器件 Red light-emitting devices based on europium complexes
08/06/2014CN102468409B 结合热电装置的发光二极管组件及其制造方法 A light emitting diode assembly and its manufacturing method of the thermoelectric device in conjunction
08/06/2014CN102044512B 集成电路及三维堆叠的多重芯片模块 Three-dimensional integrated circuits and multi-chip modules stacked
08/06/2014CN102017135B 带有在多个接触平面中的元器件的基板电路模块 A substrate having a plurality of circuit modules in the contact plane components
08/06/2014CN101572406B 瞬态电压抑制器及方法 Transient voltage suppressor and methods
08/05/2014US8796861 Semiconductor package having support member
08/05/2014US8796852 3D integrated circuit structure and method for manufacturing the same
08/05/2014US8796847 Package substrate having main dummy pattern located in path of stress
08/05/2014US8796844 Package structure
08/05/2014US8796827 Semiconductor device including a DC-DC converter
08/05/2014US8796740 Using a single mask for various design configurations
08/05/2014US8796713 Light emitting diode package structure and manufacturing method thereof
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