Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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03/03/2005 | US20050046036 Semiconductor device, semiconductor module and method of manufacturing semiconductor device |
03/03/2005 | US20050046035 Semiconductor device |
03/03/2005 | US20050046034 Apparatus and method for high density multi-chip structures |
03/03/2005 | US20050046017 System and method using self-assembled nano structures in the design and fabrication of an integrated circuit micro-cooler |
03/03/2005 | US20050046006 Unit semiconductor chip and multi chip package with center bonding pads and methods for manufacturing the same |
03/03/2005 | US20050046003 Stacked-chip semiconductor package and fabrication method thereof |
03/03/2005 | US20050046002 Chip stack package and manufacturing method thereof |
03/03/2005 | US20050046001 High-frequency chip packages |
03/03/2005 | US20050046000 Invertible microfeature device packages and associated methods |
03/03/2005 | US20050045999 Semiconductor device |
03/03/2005 | US20050045897 Light emitting apparatus |
03/03/2005 | US20050045378 Stacked microfeature devices and associated methods |
03/03/2005 | US20050045369 Circuit component built-in module and method for manufacturing the same |
03/03/2005 | DE202004018930U1 Semiconductor housing arrangement e.g. for semiconductor or LED, includes outer frame device formed from opaque material and positioned on substrate |
03/03/2005 | DE19518753B4 Halbleitervorrichtung und Verfahren zu ihrer Herstellung Semiconductor device and process for their preparation |
03/03/2005 | DE10361014A1 Semiconductor component with high frequency (HF) circuit with active circuit components integrated in first semiconductor chip, while at least part of passive circuit components are formed in second semiconductor chip by silicon processing |
03/03/2005 | DE10335153A1 Schaltungsanordnung auf einem Substrat und Verfahren zum Herstellen der Schaltungsanordnung auf dem Substrat A circuit arrangement on a substrate and methods for producing the circuitry on the substrate |
03/03/2005 | DE10335077A1 LED-Modul LED module |
03/03/2005 | DE10329571A1 Gleichrichtereinrichtung, insbesondere für einen Drehstromgenerator Rectifier device, particularly for an alternator |
03/03/2005 | DE10251530B4 Stapelanordnung eines Speichermoduls Stack arrangement of a memory module |
03/03/2005 | DE102004037085A1 Drahtlose Halbleiterpackung und Herstellungsverfahren zum fertigen einer solchen drahtlosen Halbleiterpackung Wireless semiconductor package and fabrication method of fabricating a semiconductor package such wireless |
03/03/2005 | DE102004036295A1 Fabrication of flip-chip light emitting diode device by fabricating light emitting diode devices on epitaxial wafer, dicing the epitaxial wafer, flip chip bonding the device die to mount, and reducing thickness of growth substrate |
03/03/2005 | DE102004029507A1 Kunststoffgehäuse und Halbleiterbaustein mit Verwendung eines Kunststoffgehäuses Plastic housing and semiconductor device with use of a plastic housing |
03/03/2005 | CA2752624A1 Pv wind performance enhancing methods and apparatus |
03/02/2005 | EP1511086A1 LIGHT−RECEIVING PANEL OR LIGHT−EMITTING PANEL, AND MANUFACTURING METHOD THEREOF |
03/02/2005 | EP1511078A2 Multi-chip press-connected type semiconductor device |
03/02/2005 | EP1510109A1 A controllable light emitting diode |
03/02/2005 | CN2682587Y Composite colored light type LED |
03/02/2005 | CN1588658A Light-emitting diode light source module with support piece |
03/02/2005 | CN1588653A LED multi color line light source and its producing process |
03/02/2005 | CN1191641C LED luminous device |
03/02/2005 | CN1191633C 半导体集成电路 The semiconductor integrated circuit |
03/02/2005 | CN1191632C Optical illuminating device, its manufacturing methd and its illuminator used the same |
03/02/2005 | CN1191626C Data storage processing apparatus, and method for fabricating |
03/01/2005 | US6862191 Volumetrically efficient electronic circuit module |
03/01/2005 | US6862123 Optical scanning device, image forming apparatus, and optical scanning method |
03/01/2005 | US6862036 Communication devices incorporating reduced area imaging devices |
03/01/2005 | US6861761 Multi-chip stack flip-chip package |
03/01/2005 | US6861741 Circuit configuration |
03/01/2005 | US6861738 Laminated-chip semiconductor device |
03/01/2005 | US6861737 Semiconductor device packages having semiconductor chips attached to circuit boards, and stack packages using the same |
03/01/2005 | US6861730 Semiconductor device with semiconductor chip formed by using wide gap semiconductor as base material |
03/01/2005 | US6861677 Package of lightemitting diode with protective element |
03/01/2005 | US6861675 Optically coupled semiconductor device and method for manufacturing the same |
03/01/2005 | US6861674 Electroluminescent device |
03/01/2005 | US6861366 Packaged semiconductor device having stacked die |
03/01/2005 | US6861288 Stacked semiconductor packages and method for the fabrication thereof |
03/01/2005 | US6861287 Multiple chip stack structure and cooling system |
03/01/2005 | US6861284 Semiconductor device and production method thereof |
03/01/2005 | US6861283 Package for integrated circuit with thermal vias and method thereof |
03/01/2005 | US6860652 Package for housing an optoelectronic assembly |
03/01/2005 | US6860621 LED module and methods for producing and using the module |
02/24/2005 | WO2005018290A2 Electronic module comprising stacked components which are solidly connected to one another, and corresponding component, method, assembly means and assembly machine |
02/24/2005 | WO2005018001A1 Semiconductor device |
02/24/2005 | WO2005018000A1 Stackable layers containing ball grid array packages |
02/24/2005 | WO2005017999A1 Semiconductor device and method for making the same |
02/24/2005 | WO2005017970A2 Module for epas/ehpas applications |
02/24/2005 | WO2005001927A3 Stackable integrated circuit package and method therefor |
02/24/2005 | WO2004097838A3 Memory-circuit arrangement and method for the production thereof |
02/24/2005 | WO2004008553A8 Optoelectronic component comprising an electroconductive organic material, and method for producing said component |
02/24/2005 | US20050042821 Methods of forming semiconductor circuitry, and semiconductor circuit constructions |
02/24/2005 | US20050042803 Semiconductor device and method for production thereof |
02/24/2005 | US20050042786 Process for making contact with and housing integrated circuits |
02/24/2005 | US20050042784 Device transfer method and panel |
02/24/2005 | US20050041434 Light Source and vehicle lamp |
02/24/2005 | US20050041404 Integrated circuit stacking system and method |
02/24/2005 | US20050041403 Integrated circuit stacking system and method |
02/24/2005 | US20050041402 Integrated circuit stacking system and method |
02/24/2005 | US20050041399 Volumetrically efficient electronic circuit module |
02/24/2005 | US20050041369 Capacitor module and semiconductor |
02/24/2005 | US20050041010 Image display device and light emission device |
02/24/2005 | US20050040541 Flip-chip type semiconductor device, production process for manufacturing such flip-chip type semiconductor device, and production process for manufacturing electronic product using such flip-chip type semiconductor device |
02/24/2005 | US20050040529 Ball grid array package, stacked semiconductor package and method for manufacturing the same |
02/24/2005 | US20050040522 High-frequency semiconductor device |
02/24/2005 | US20050040518 indium-containing solder joint has a much higher thermal conductivity than conductive lubricants |
02/24/2005 | US20050040515 Coolant cooled type semiconductor device |
02/24/2005 | US20050040512 Circuit device |
02/24/2005 | US20050040511 Back-to-back semiconductor device assemblies |
02/24/2005 | US20050040509 Semiconductor device |
02/24/2005 | US20050040508 Area array type package stack and manufacturing method thereof |
02/24/2005 | US20050040422 Semiconductor light-emitting device and method for manufacturing the device |
02/24/2005 | US20050040421 Light-emitting semiconductor device |
02/24/2005 | US20050039950 High speed circuitized substrate with reduced thru-hole stub, method for fabrication and information handling system utilizing same |
02/24/2005 | US20050039946 Electronic circuit unit and method of manufacturing same |
02/24/2005 | DE10308926B4 Halbleiterchipanordnung und Verfahren zu ihrer Herstellung A semiconductor chip assembly and process for their preparation |
02/24/2005 | DE10006505B4 Leistungshalbleiter-Modul aus einer Vielzahl von parallel zueinander geschalteten IGBT-Chips Power semiconductor module consisting of a plurality of parallel-connected IGBT chips |
02/23/2005 | EP1508942A1 Electrical connection device between two boards and method of use in a microelectronic component |
02/23/2005 | EP1508915A2 Process and electronic assembly for removing heat from a circuit device |
02/23/2005 | EP1508891A1 Plasma display device |
02/23/2005 | EP1508168A1 Semiconductor component |
02/23/2005 | EP1508167A2 High-frequency power semiconductor module with a hollow housing and method for the production thereof |
02/23/2005 | EP1508166A2 Electronic component comprising external surface contacts and a method for producing the same |
02/23/2005 | EP1508157A2 High efficiency solid-state light source and methods of use and manufacture |
02/23/2005 | CN2681356Y High power LED package assembly |
02/23/2005 | CN1586022A Multichip module |
02/23/2005 | CN1586006A Led-luminous panel and carrier plate |
02/23/2005 | CN1585142A AC and DC power supply two-purpose bridge illuminating LED and producing method thereof |
02/23/2005 | CN1585125A 电路装置 Circuit device |
02/23/2005 | CN1585123A Flip-chip type semiconductor device, production process for manufacturing such flip-chip type semiconductor device, and production process for manufacturing electronic product using such flip-chip typ |
02/23/2005 | CN1583465A Light source device of vehicle head lamp and vehicle head lamp |