Patents
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
03/2005
03/03/2005US20050046036 Semiconductor device, semiconductor module and method of manufacturing semiconductor device
03/03/2005US20050046035 Semiconductor device
03/03/2005US20050046034 Apparatus and method for high density multi-chip structures
03/03/2005US20050046017 System and method using self-assembled nano structures in the design and fabrication of an integrated circuit micro-cooler
03/03/2005US20050046006 Unit semiconductor chip and multi chip package with center bonding pads and methods for manufacturing the same
03/03/2005US20050046003 Stacked-chip semiconductor package and fabrication method thereof
03/03/2005US20050046002 Chip stack package and manufacturing method thereof
03/03/2005US20050046001 High-frequency chip packages
03/03/2005US20050046000 Invertible microfeature device packages and associated methods
03/03/2005US20050045999 Semiconductor device
03/03/2005US20050045897 Light emitting apparatus
03/03/2005US20050045378 Stacked microfeature devices and associated methods
03/03/2005US20050045369 Circuit component built-in module and method for manufacturing the same
03/03/2005DE202004018930U1 Semiconductor housing arrangement e.g. for semiconductor or LED, includes outer frame device formed from opaque material and positioned on substrate
03/03/2005DE19518753B4 Halbleitervorrichtung und Verfahren zu ihrer Herstellung Semiconductor device and process for their preparation
03/03/2005DE10361014A1 Semiconductor component with high frequency (HF) circuit with active circuit components integrated in first semiconductor chip, while at least part of passive circuit components are formed in second semiconductor chip by silicon processing
03/03/2005DE10335153A1 Schaltungsanordnung auf einem Substrat und Verfahren zum Herstellen der Schaltungsanordnung auf dem Substrat A circuit arrangement on a substrate and methods for producing the circuitry on the substrate
03/03/2005DE10335077A1 LED-Modul LED module
03/03/2005DE10329571A1 Gleichrichtereinrichtung, insbesondere für einen Drehstromgenerator Rectifier device, particularly for an alternator
03/03/2005DE10251530B4 Stapelanordnung eines Speichermoduls Stack arrangement of a memory module
03/03/2005DE102004037085A1 Drahtlose Halbleiterpackung und Herstellungsverfahren zum fertigen einer solchen drahtlosen Halbleiterpackung Wireless semiconductor package and fabrication method of fabricating a semiconductor package such wireless
03/03/2005DE102004036295A1 Fabrication of flip-chip light emitting diode device by fabricating light emitting diode devices on epitaxial wafer, dicing the epitaxial wafer, flip chip bonding the device die to mount, and reducing thickness of growth substrate
03/03/2005DE102004029507A1 Kunststoffgehäuse und Halbleiterbaustein mit Verwendung eines Kunststoffgehäuses Plastic housing and semiconductor device with use of a plastic housing
03/03/2005CA2752624A1 Pv wind performance enhancing methods and apparatus
03/02/2005EP1511086A1 LIGHT−RECEIVING PANEL OR LIGHT−EMITTING PANEL, AND MANUFACTURING METHOD THEREOF
03/02/2005EP1511078A2 Multi-chip press-connected type semiconductor device
03/02/2005EP1510109A1 A controllable light emitting diode
03/02/2005CN2682587Y Composite colored light type LED
03/02/2005CN1588658A Light-emitting diode light source module with support piece
03/02/2005CN1588653A LED multi color line light source and its producing process
03/02/2005CN1191641C LED luminous device
03/02/2005CN1191633C 半导体集成电路 The semiconductor integrated circuit
03/02/2005CN1191632C Optical illuminating device, its manufacturing methd and its illuminator used the same
03/02/2005CN1191626C Data storage processing apparatus, and method for fabricating
03/01/2005US6862191 Volumetrically efficient electronic circuit module
03/01/2005US6862123 Optical scanning device, image forming apparatus, and optical scanning method
03/01/2005US6862036 Communication devices incorporating reduced area imaging devices
03/01/2005US6861761 Multi-chip stack flip-chip package
03/01/2005US6861741 Circuit configuration
03/01/2005US6861738 Laminated-chip semiconductor device
03/01/2005US6861737 Semiconductor device packages having semiconductor chips attached to circuit boards, and stack packages using the same
03/01/2005US6861730 Semiconductor device with semiconductor chip formed by using wide gap semiconductor as base material
03/01/2005US6861677 Package of lightemitting diode with protective element
03/01/2005US6861675 Optically coupled semiconductor device and method for manufacturing the same
03/01/2005US6861674 Electroluminescent device
03/01/2005US6861366 Packaged semiconductor device having stacked die
03/01/2005US6861288 Stacked semiconductor packages and method for the fabrication thereof
03/01/2005US6861287 Multiple chip stack structure and cooling system
03/01/2005US6861284 Semiconductor device and production method thereof
03/01/2005US6861283 Package for integrated circuit with thermal vias and method thereof
03/01/2005US6860652 Package for housing an optoelectronic assembly
03/01/2005US6860621 LED module and methods for producing and using the module
02/2005
02/24/2005WO2005018290A2 Electronic module comprising stacked components which are solidly connected to one another, and corresponding component, method, assembly means and assembly machine
02/24/2005WO2005018001A1 Semiconductor device
02/24/2005WO2005018000A1 Stackable layers containing ball grid array packages
02/24/2005WO2005017999A1 Semiconductor device and method for making the same
02/24/2005WO2005017970A2 Module for epas/ehpas applications
02/24/2005WO2005001927A3 Stackable integrated circuit package and method therefor
02/24/2005WO2004097838A3 Memory-circuit arrangement and method for the production thereof
02/24/2005WO2004008553A8 Optoelectronic component comprising an electroconductive organic material, and method for producing said component
02/24/2005US20050042821 Methods of forming semiconductor circuitry, and semiconductor circuit constructions
02/24/2005US20050042803 Semiconductor device and method for production thereof
02/24/2005US20050042786 Process for making contact with and housing integrated circuits
02/24/2005US20050042784 Device transfer method and panel
02/24/2005US20050041434 Light Source and vehicle lamp
02/24/2005US20050041404 Integrated circuit stacking system and method
02/24/2005US20050041403 Integrated circuit stacking system and method
02/24/2005US20050041402 Integrated circuit stacking system and method
02/24/2005US20050041399 Volumetrically efficient electronic circuit module
02/24/2005US20050041369 Capacitor module and semiconductor
02/24/2005US20050041010 Image display device and light emission device
02/24/2005US20050040541 Flip-chip type semiconductor device, production process for manufacturing such flip-chip type semiconductor device, and production process for manufacturing electronic product using such flip-chip type semiconductor device
02/24/2005US20050040529 Ball grid array package, stacked semiconductor package and method for manufacturing the same
02/24/2005US20050040522 High-frequency semiconductor device
02/24/2005US20050040518 indium-containing solder joint has a much higher thermal conductivity than conductive lubricants
02/24/2005US20050040515 Coolant cooled type semiconductor device
02/24/2005US20050040512 Circuit device
02/24/2005US20050040511 Back-to-back semiconductor device assemblies
02/24/2005US20050040509 Semiconductor device
02/24/2005US20050040508 Area array type package stack and manufacturing method thereof
02/24/2005US20050040422 Semiconductor light-emitting device and method for manufacturing the device
02/24/2005US20050040421 Light-emitting semiconductor device
02/24/2005US20050039950 High speed circuitized substrate with reduced thru-hole stub, method for fabrication and information handling system utilizing same
02/24/2005US20050039946 Electronic circuit unit and method of manufacturing same
02/24/2005DE10308926B4 Halbleiterchipanordnung und Verfahren zu ihrer Herstellung A semiconductor chip assembly and process for their preparation
02/24/2005DE10006505B4 Leistungshalbleiter-Modul aus einer Vielzahl von parallel zueinander geschalteten IGBT-Chips Power semiconductor module consisting of a plurality of parallel-connected IGBT chips
02/23/2005EP1508942A1 Electrical connection device between two boards and method of use in a microelectronic component
02/23/2005EP1508915A2 Process and electronic assembly for removing heat from a circuit device
02/23/2005EP1508891A1 Plasma display device
02/23/2005EP1508168A1 Semiconductor component
02/23/2005EP1508167A2 High-frequency power semiconductor module with a hollow housing and method for the production thereof
02/23/2005EP1508166A2 Electronic component comprising external surface contacts and a method for producing the same
02/23/2005EP1508157A2 High efficiency solid-state light source and methods of use and manufacture
02/23/2005CN2681356Y High power LED package assembly
02/23/2005CN1586022A Multichip module
02/23/2005CN1586006A Led-luminous panel and carrier plate
02/23/2005CN1585142A AC and DC power supply two-purpose bridge illuminating LED and producing method thereof
02/23/2005CN1585125A 电路装置 Circuit device
02/23/2005CN1585123A Flip-chip type semiconductor device, production process for manufacturing such flip-chip type semiconductor device, and production process for manufacturing electronic product using such flip-chip typ
02/23/2005CN1583465A Light source device of vehicle head lamp and vehicle head lamp