Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
03/2005
03/16/2005CN1596473A Multi-chip module semiconductor devices
03/16/2005CN1596472A High power semiconductor module
03/16/2005CN1596469A Receptacle for a programmable, electronic processing device
03/16/2005CN1595672A Semiconductor device and method of manufacturing the same
03/16/2005CN1595666A Encapsulant layer for solar battery assembly and solar battery assembly
03/16/2005CN1595644A Inverter device and method of manufacturing the device thereof, and electric automobile incorporating the inverter device thereof
03/16/2005CN1595606A Apparatus used for manufacturing semiconductor device, method of manufacturing the semiconductor devices, and semiconductor device manufactured by the apparatus and method
03/16/2005CN1595442A Memory card
03/16/2005CN1193437C LED module for signaling devices
03/16/2005CN1193424C 半导体装置 Semiconductor device
03/16/2005CN1193375C Non-volatile semiconductor memory and system
03/16/2005CN1193253C Platform and optical module, and producing method and optical transmission device
03/16/2005CN1192885C Ink jet recorder and method for collecting ink information therein
03/15/2005US6867972 Power component assembly for mechatronic integration of power components
03/15/2005US6867517 Rectifier for alternator having rectifier element covered with rectifier terminal
03/15/2005US6867501 Semiconductor device and method for manufacturing same
03/15/2005US6867500 Multi-chip module and methods
03/15/2005US6867494 Semiconductor module
03/15/2005US6867493 Structure and method for fabrication of a leadless multi-die carrier
03/15/2005US6867486 Stack chip module with electrical connection and adhesion of chips through a bump for improved heat release capacity
03/15/2005US6867484 Semiconductor device adhered well to a heat sink, reducible in size and allowing an easy modification of the design of an external terminal.
03/15/2005US6867478 Semiconductor device having improved alignment of an electrode terminal on a semiconductor chip and a conductor coupled to the electrode terminal
03/15/2005US6867111 Method of manufacturing modules with an integrated circuit
03/15/2005US6867073 Single mask via method and device
03/15/2005US6867066 Method for production of a semiconductor device with package that includes an insulator frame on a metal member
03/10/2005WO2005022965A2 Expansion constrained die stack
03/10/2005WO2005022631A1 Semiconductor package and manufacturing method thereof
03/10/2005WO2005022591A2 Reversible leadless package and methods of making and using same
03/10/2005WO2005022588A2 Semiconductor component comprising a rewiring layer, and method for the production thereof
03/10/2005WO2005022030A2 Color-mixing lighting system
03/10/2005WO2004088727B1 Multi-chip ball grid array package and method of manufacture
03/10/2005WO2004081306A3 Modular shade system with solar tracking panels
03/10/2005WO2004070839A3 Light emitting apparatus comprising semiconductor light emitting devices
03/10/2005US20050054147 Semiconductor component circuit with a reduced oscillation tendency
03/10/2005US20050054141 Thin semiconductor package having stackable lead frame and method of manufacturing the same
03/10/2005US20050054140 Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured thereby
03/10/2005US20050052924 Memory card
03/10/2005US20050052878 Lighting device and lighting fixture for a vehicle
03/10/2005US20050052830 Electronic module, panel having electronic modules which are to be divided up, and process for the production thereof
03/10/2005US20050052378 LED module
03/10/2005US20050051908 Diode exhibiting a high breakdown voltage
03/10/2005US20050051903 Stackable electronic assembly
03/10/2005US20050051895 BGA package having semiconductor chip with edge-bonding metal patterns formed thereon and method of manufacturing the same
03/10/2005US20050051889 Integrated circuit packaging architecture
03/10/2005US20050051884 Multiple cavity/compartment package
03/10/2005US20050051883 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
03/10/2005US20050051882 Stacked chip package having upper chip provided with trenches and method of manufacturing the same
03/10/2005US20050051874 Power semiconductor device
03/10/2005US20050051841 Stress-controlled dielectric integrated circuit
03/10/2005US20050051204 Encapsulant layer for photovoltaic module, photovoltaic module and method for manufacturing regenerated photovoltaic cell and regenerated transparent front face substrate
03/10/2005US20050050659 Electric toothbrush comprising an electrically powered element
03/10/2005CA2536799A1 Semiconductor package and method of manufacturing the same
03/09/2005EP1513195A1 Semiconductor device and its manufacturing method
03/09/2005EP1513043A2 Memory card
03/09/2005EP1512210A1 Regulator and rectifier for an electric machine and electric machine
03/09/2005EP1512182A1 Led array
03/09/2005EP1512176A1 Die connected with integrated circuit component
03/09/2005EP0950263B1 A high power prematched mmic transistor with improved ground potential continuity
03/09/2005CN2684375Y 芯片封装结构 Chip package
03/09/2005CN1592971A Matrix-addressable apparatus with one or more memory devices
03/09/2005CN1592968A Module part
03/09/2005CN1592965A Chip and wafer integration process using vertical connections
03/09/2005CN1591921A Lighting device and lighting fixture for a vehicle
03/09/2005CN1591920A Light semiconductor device and optical signal input and output device
03/09/2005CN1591914A Lighting device of LED element
03/09/2005CN1591885A Manufacturing method of solid-state image sensing device
03/09/2005CN1591863A Semiconductor device, semiconductor module and method of manufacturing semiconductor device
03/09/2005CN1591862A Bridging multi-chip Packaging structure
03/09/2005CN1591861A Circuit component built-in module and method for manufacturing the same
03/09/2005CN1591839A BGA package having semiconductor chip with edge-bonding metal patterns formed thereon and method of manufacturing the same
03/09/2005CN1192441C Semiconductor light-emitting device
03/09/2005CN1192181C Luminaire with LEDS
03/08/2005US6865084 Thermally enhanced semiconductor package with EMI shielding
03/08/2005US6864627 Image display device and light emission device
03/08/2005US6864588 MCM package with bridge connection
03/08/2005US6864574 Semiconductor package
03/08/2005US6864570 Method and apparatus for fabricating self-assembling microstructures
03/08/2005US6864569 Stackable module
03/08/2005US6864566 Duel die package
03/08/2005US6864509 Packaging optically coupled integrated circuits using flip-chip methods
03/08/2005US6864172 Manufacturing method of semiconductor device
03/08/2005US6864166 Method of manufacturing wire bonded microelectronic device assemblies
03/08/2005US6864122 Multi-chip module having content addressable memory
03/08/2005US6863584 Image display unit and production method thereof
03/03/2005WO2005020651A1 Method for manufacturing an electronic module, and an electronic module
03/03/2005WO2005020288A2 Multiple cavity/compartment package
03/03/2005WO2005020281A2 Process and electronic assembly for removing heat from a circuit device
03/03/2005WO2004105134A8 An integrated circuit package
03/03/2005WO2004028748A3 Clamping assembly for high-voltage solid state devices
03/03/2005US20050048698 Semiconductor device, method for manufacturing the same, circuit board, and electronic apparatus
03/03/2005US20050048695 Super high density module with integrated wafer level packages
03/03/2005US20050048692 Manufacturing method of solid-state image sensing device
03/03/2005US20050047248 Memory module
03/03/2005US20050047186 Vertical laminated electrical switch circuit
03/03/2005US20050047131 Illumination apparatus
03/03/2005US20050047094 Heat sink structure with embedded electronic components for semiconductor package
03/03/2005US20050046041 Integrated circuit device with embedded passive component by flip-chip connection and method for manufacturing the same
03/03/2005US20050046040 Flip chip stacked package
03/03/2005US20050046039 Flip-chip package
03/03/2005US20050046038 Multi-dice chip scale semiconductor components
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