Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
03/2005
03/29/2005US6873361 Image sensor having a plurality of chips
03/29/2005US6873092 Display unit
03/29/2005US6873054 Semiconductor device and a method of manufacturing the same, a circuit board and an electronic apparatus
03/29/2005US6873045 Semiconductor module and power conversion device
03/29/2005US6873042 Plurality of power elements with gate interconnections having equal lengths
03/29/2005US6873037 Vertical surface mount package utilizing a back-to-back semiconductor device module
03/29/2005US6873036 Die stacking scheme
03/29/2005US6873035 Semiconductor device having capacitors for reducing power source noise
03/29/2005US6873034 Solid-state imaging device, method for producing same, and mask
03/29/2005US6872635 Device transferring method, and device arraying method and image display unit fabricating method using the same
03/29/2005US6872594 Method of fabricating an electronic component
03/29/2005US6872585 LED device and manufacturing method thereof
03/29/2005CA2304670C Wafer level integration of multiple optical elements
03/24/2005WO2005027602A1 Method for manufacturing an electronic module
03/24/2005WO2005027225A1 Stackable electronic assembly
03/24/2005WO2005027223A1 Semiconductor module including circuit device and insulating film, method for manufacturing same, and application of same
03/24/2005WO2005027222A2 Assembly of an electrical component comprising an electrical insulation film on a substrate and method for producing said assembly
03/24/2005WO2005013364A3 Electronic component and panel for producing the same
03/24/2005WO2004109771A3 Stackable semiconductor device and method of manufacturing the same
03/24/2005WO2004093190A3 Multichip module comprising a plurality of semiconductor chips and printed circuit board comprising a plurality of components
03/24/2005US20050066246 Lab-on-chip system and method and apparatus for manufacturing and operating same
03/24/2005US20050064732 Circuit carrier and production thereof
03/24/2005US20050064631 Multi-chip semiconductor package and fabrication method thereof
03/24/2005US20050064625 Method for mounting passive components on wafer
03/24/2005US20050064612 Method of manufacturing a semiconductor device and a fabrication apparatus for a semiconductor device
03/24/2005US20050063183 Modular mounting arrangement and method for light emitting diodes
03/24/2005US20050062396 Multi-hooded pixel
03/24/2005US20050062166 Single chip and stack-type chip semiconductor package and method of manufacturing the same
03/24/2005US20050062144 Memory expansion and chip scale stacking system and method
03/24/2005US20050062141 Electronic package having a folded flexible substrate and method of manufacturing the same
03/24/2005US20050062126 Receptacle for a programmable, electronic processing device
03/24/2005US20050062059 Light emission diode (LED)
03/24/2005US20050062056 Optoelectronic device packaging with hermetically sealed cavity and integrated optical element
03/24/2005US20050061360 Photovoltaic solar cell module assembly, wiring system and photovoltaic power system
03/23/2005CN2687772Y Colour stereoscopic luminous module
03/23/2005CN1599963A 电致发光器件 Electroluminescent devices
03/23/2005CN1599158A Optoelectronic device packaging with hermetically sealed cavity and integrated optical element
03/23/2005CN1599066A Luminous device
03/23/2005CN1599063A Semiconductor device having a pair of heat sinks and method for manufacturing the same
03/23/2005CN1599054A No-lead ultrathin semiconductor bridge rectifier and its manufacturing method
03/23/2005CN1598903A Light emission device and manufacturing method thereof
03/23/2005CN1194408C Method of forming stacked-die intrgrated circuit chip package on wafer level
03/23/2005CN1194377C Method for increasing passpertage of A/D conversion chip and product thereof
03/22/2005US6870738 Power semiconductor module
03/22/2005US6870271 Integrated circuit assembly module that supports capacitive communication between semiconductor dies
03/22/2005US6870270 Method and structure for interfacing electronic devices
03/22/2005US6870269 Assemblies including stacked semiconductor devices separated a distance defined by adhesive material interposed therebetween, packages including the assemblies, and methods
03/22/2005US6870260 Semiconductor module
03/22/2005US6870253 Power semiconductor device
03/22/2005US6870249 Semiconductor device and manufacturing method thereof
03/22/2005US6870248 Semiconductor chip with external connecting terminal
03/22/2005US6870195 Array of discretely formed optical signal emitters for multi-channel communication
03/22/2005US6870088 Solar battery cell and manufacturing method thereof
03/22/2005US6869828 Assemblies including stacked semiconductor devices separated a distance defined by adhesive material interposed therebetween, packages including the assemblies, and methods
03/22/2005US6869827 Semiconductor/printed circuit board assembly, and computer system
03/22/2005US6869826 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
03/22/2005US6869812 High power AllnGaN based multi-chip light emitting diode
03/22/2005CA2462762A1 Light emission diode (led)
03/17/2005WO2005024951A1 Sphere-supported thin film phosphor electroluminescent devices
03/17/2005WO2005024946A1 Semiconductor device and method for manufacturing same
03/17/2005WO2005024945A1 Integrated circuit component and mounting method
03/17/2005WO2005024898A2 Integrated lamp with feedback and wireless control
03/17/2005WO2005023146A2 Toothbrush with severable electrical connections
03/17/2005WO2005023145A2 Electric toothbrush comprising an electrically powered element
03/17/2005WO2005023144A2 Electric toothbrushes and replaceable components
03/17/2005WO2005023143A2 Illuminated electric toothbrushes and methods of use
03/17/2005WO2005023131A2 Illuminated electric toothbrushes
03/17/2005WO2004100226A3 Method and apparatus for led panel lamp systems
03/17/2005WO2004090737A3 Sense amplifying latch with low swing feedback
03/17/2005WO2004016055A8 An electronic product, a body and a method of manufacturing
03/17/2005US20050059230 Method for the lateral contacting of a semiconductor chip
03/17/2005US20050059217 Methods of forming backside connections on a wafer stack
03/17/2005US20050059175 Dynamic integrated circuit clusters, modules including same and methods of fabricating
03/17/2005US20050057939 Light emission device and manufacturing method thereof
03/17/2005US20050057911 Memory expansion and integrated circuit stacking system and method
03/17/2005US20050057901 Inverter device and method of manufacturing the device thereof, and electric automobile incorporating the inverter device thereof
03/17/2005US20050057641 Combined semiconductor device, LED print head, and image forming apparatus
03/17/2005US20050056945 Dynamic integrated circuit clusters, modules including same and methods of fabricating
03/17/2005US20050056944 Super-thin high speed flip chip package
03/17/2005US20050056931 High frequency circuit block unit, method for producing same, high frequency module device and method for producing same
03/17/2005US20050056927 Semiconductor device having a pair of heat sinks and method for manufacturing the same
03/17/2005US20050056923 Apparatus and method for stacking integrated circuits
03/17/2005US20050056922 Expansion constrained die stack
03/17/2005US20050056921 Stacked module systems and methods
03/17/2005US20050056916 Circuit device and manufacturing method of circuit device
03/17/2005US20050056903 Semiconductor package and method of manufacturing same
03/17/2005US20050056871 Semiconductor dice with edge cavities
03/17/2005US20050056852 Semiconductor device and method of manufacturing the same
03/17/2005US20050056312 Bifacial structure for tandem solar cells
03/17/2005DE19650148B4 Halbleitervorrichtung und zugehöriges Herstellungsverfahren A semiconductor device and manufacturing method thereof
03/17/2005DE10337640A1 Power semiconductor module for fitting on a heat sink has a casing, power semiconductor components and an insulating substrate with metal layers on both sides
03/17/2005DE10334575A1 Elektronisches Bauteil und Nutzen zur Herstellung desselben Electronic component and benefits of manufacturing the same
03/17/2005CA2537476A1 Sphere-supported thin film phosphor electroluminescent devices
03/17/2005CA2537288A1 Electric toothbrushes and replaceable components
03/16/2005EP1515368A2 Light equipment, lighting fixture for a vehicle and light emitting device for the same
03/16/2005EP1515367A2 Semiconductor device and method of manufacturing the same
03/16/2005EP1514459A1 Metal-ceramic substrate for electric circuits or modules, method for producing one such substrate and module comprising one such substrate
03/16/2005EP1514453A2 Multiple led display producing multiple colors
03/16/2005EP1514307A1 Electronics circuit manufacture
03/16/2005CN1596478A Luminescent material, especially for LED application
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