| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 04/13/2005 | CN1197443C Assembly of an electronic component with spring packaging |
| 04/13/2005 | CN1197236C Piezoelectric device |
| 04/13/2005 | CN1197156C 半导体设备 Semiconductor Equipment |
| 04/13/2005 | CN1197153C Semiconductor device |
| 04/12/2005 | US6880144 High speed low power bitline |
| 04/12/2005 | US6879493 Module component and method of manufacturing the same |
| 04/12/2005 | US6879491 Gate driver multi-chip module |
| 04/12/2005 | US6879488 Radio frequency module |
| 04/12/2005 | US6879037 Semiconductor device and a method of manufacturing the same |
| 04/12/2005 | US6879036 Semiconductor memory device and method of manufacturing semiconductor device with chip on chip structure |
| 04/12/2005 | US6879034 Semiconductor package including low temperature co-fired ceramic substrate |
| 04/12/2005 | US6879031 Multi-chips package |
| 04/12/2005 | US6878643 Electronic unit integrated into a flexible polymer body |
| 04/12/2005 | US6878638 Multi-level integrated circuit for wide-gap substrate bonding |
| 04/12/2005 | US6878573 Method of manufacturing a semiconductor device and semiconductor device |
| 04/12/2005 | US6878571 Panel stacking of BGA devices to form three-dimensional modules |
| 04/12/2005 | US6878570 Thin stacked package and manufacturing method thereof |
| 04/12/2005 | US6878564 Method of manufacturing a light emitting semiconductor package |
| 04/07/2005 | WO2005031883A1 Linear light source and production method therefor and surface emission device |
| 04/07/2005 | WO2005031865A1 Electronic package having a folded flexible substrate and method of manufacturing the same |
| 04/07/2005 | US20050074971 Semiconductor device and method for fabricating the same |
| 04/07/2005 | US20050074243 Optical module |
| 04/07/2005 | US20050073846 Lightemitting device and method of manufacturing the same |
| 04/07/2005 | US20050073840 Methods and apparatus for an LED light engine |
| 04/07/2005 | US20050073054 Integrated circuit incorporating flip chip and wire bonding |
| 04/07/2005 | US20050073045 Wireless coupling of stacked dies within system in package |
| 04/07/2005 | US20050072458 Solar cell device |
| 04/07/2005 | US20050072456 Integrated photovoltaic roofing system |
| 04/07/2005 | US20050071989 Apparatus used for manufacturing semiconductor device, method of manufacturing the semiconductor devices, and semiconductor device manufactured by the apparatus and method |
| 04/06/2005 | CN2691056Y Package structure with power chip |
| 04/06/2005 | CN1605130A Optoelectronic component |
| 04/06/2005 | CN1604721A Module and method of manufacturing module |
| 04/06/2005 | CN1604323A Circuit device and method for manufacturing same |
| 04/06/2005 | CN1604322A 半导体器件 Semiconductor devices |
| 04/06/2005 | CN1604321A Semiconductor device containing stacked semiconductor chips and manufacturing method thereof |
| 04/06/2005 | CN1604320A Semiconductor device containing stacked semiconductor chips and manufacturing method thereof |
| 04/06/2005 | CN1604319A Interlinkage of chip core device and its making method |
| 04/06/2005 | CN1604310A Semiconductor device and method for manufacturing same |
| 04/06/2005 | CN1604309A Method for producing a multichip module and multichip module |
| 04/06/2005 | CN1196389C Soldering of semiconductor chip to substrate |
| 04/06/2005 | CN1196195C Power semiconductor module with closed submodules |
| 04/06/2005 | CN1196192C Method of mfg. carrying band and carrying band type semiconductor device |
| 04/06/2005 | CN1196191C Method for adjusting structures on semiconductor substrate |
| 04/05/2005 | US6876846 High frequency module |
| 04/05/2005 | US6876554 Printing wiring board and method of producing the same and capacitor to be contained in printed wiring board |
| 04/05/2005 | US6876149 Double-face LED device for an electronic instrument |
| 04/05/2005 | US6876088 Flex-based IC package construction employing a balanced lamination |
| 04/05/2005 | US6876074 Stack package using flexible double wiring substrate |
| 04/05/2005 | US6876006 Radiation source |
| 04/05/2005 | US6875914 Photovoltaic roofing structure |
| 04/05/2005 | US6875638 Manufacturing method of a semiconductor device incorporating a passive element and a redistribution board |
| 04/05/2005 | US6874910 Light source device using LED, and method of producing same |
| 03/31/2005 | WO2005029594A1 A structure of light emitting diode |
| 03/31/2005 | WO2005029185A2 Led lighting source and led lighting apparatus |
| 03/31/2005 | WO2005013365A3 Semiconductor light emitting device, light emitting module, and lighting apparatus |
| 03/31/2005 | WO2004102632A3 High power allngan based mulit-chip light emitting diode |
| 03/31/2005 | WO2004100259A3 Semi-conductor component and method for the production of a semi-conductor component |
| 03/31/2005 | WO2004025694A8 .electromagnetic radiation sensing device with integrated housing including two superimposed sensors |
| 03/31/2005 | US20050070050 Method of mounting wafer on printed wiring substrate |
| 03/31/2005 | US20050068820 Bus structure for power switching circuits |
| 03/31/2005 | US20050068748 Thin film circuit board device and method for manufacturing the same |
| 03/31/2005 | US20050068735 Module for solid state relay for engine cooling fan control |
| 03/31/2005 | US20050067944 Light emitting array with improved characteristics, optical writing unit, and image forming apparatus |
| 03/31/2005 | US20050067717 Substrate having built-in semiconductor apparatus and manufacturing method thereof |
| 03/31/2005 | US20050067715 Electronic parts built-in substrate and method of manufacturing the same |
| 03/31/2005 | US20050067711 Providing a via with an increased via contact area |
| 03/31/2005 | US20050067706 Semiconductor device and production method thereof |
| 03/31/2005 | US20050067694 Spacerless die stacking |
| 03/31/2005 | US20050067686 Semiconductor device containing stacked semiconductor chips and manufacturing method thereof |
| 03/31/2005 | US20050067684 Methods for assembling semiconductor devices in superimposed relation with adhesive material defining the distance adjacent semiconductor devices are spaced apart from one another |
| 03/31/2005 | US20050067683 Memory expansion and chip scale stacking system and method |
| 03/31/2005 | US20050067682 Semiconductor device containing stacked semiconductor chips and manufacturing method thereof |
| 03/31/2005 | US20050067680 Castellated chip-scale packages and methods for fabricating the same |
| 03/31/2005 | US20050067666 Device for electrical connection between two wafers and fabrication process of a microelectronic component comprising such a device |
| 03/31/2005 | US20050067622 Semiconductor device and method of its manufacture |
| 03/31/2005 | US20050067186 Hybrid integrated circuit device and method of manufacturing the same |
| 03/31/2005 | US20050067177 Module and method of manufacturing module |
| 03/31/2005 | US20050067006 Wire interconnects for fabricating interconnected photovoltaic cells |
| 03/31/2005 | DE69728648T2 Halbleitervorrichtung mit hochfrequenz-bipolar-transistor auf einem isolierenden substrat A semiconductor device having high-frequency bipolar transistor on an insulating substrate |
| 03/31/2005 | DE10339890A1 Packaged semiconductor component with ball grid array connections below, has second connection surface on top to permit connection for automatic testing. |
| 03/31/2005 | DE10339762A1 Halbleiterbauteil mit einer Umverdrahtungslage und Verfahren zur Herstellung desselben Of the same semiconductor device with a rewiring and methods for preparing |
| 03/31/2005 | DE102004042042A1 Memory module has secondary memory chips mounted over one of primary memory chips electrically connected to conductive pattern, so that primary memory chip mounted below secondary memory chip is disabled |
| 03/31/2005 | DE10164800B4 Verfahren zur Herstellung eines elektronischen Bauelements mit mehreren übereinander gestapelten und miteinander kontaktierten Chips A method of manufacturing an electronic component having a plurality of stacked and bonded chips contacted |
| 03/31/2005 | DE10022268B4 Halbleiterbauelement mit zwei Halbleiterkörpern in einem gemeinsamen Gehäuse Semiconductor component having two semiconductor bodies in a common housing |
| 03/30/2005 | EP1519641A2 Module and method of manufacturing module |
| 03/30/2005 | EP1519415A2 Electronic parts built-in substrate and method of manufacturing the same |
| 03/30/2005 | EP1519414A1 Multilayer wiring circuit module and method for fabricating the same |
| 03/30/2005 | EP1519412A2 Method of mounting wafer on printed wiring substrate |
| 03/30/2005 | EP1518267A2 Electronic component with a housing packaging |
| 03/30/2005 | EP1323336B1 Enhanced trim resolution voltage-controlled dimming led driver |
| 03/30/2005 | CN2689457Y LED luminescent device for signal light |
| 03/30/2005 | CN1602548A Semiconductor package device and method of formation and testing |
| 03/30/2005 | CN1602144A Method of mounting wafer on printed wiring substrate |
| 03/30/2005 | CN1602139A Hybrid integrated circuit device and method of manufacturing the same |
| 03/30/2005 | CN1601772A Modular structure of array LED and its packing method |
| 03/30/2005 | CN1601768A LED structure |
| 03/30/2005 | CN1601728A Semiconductor device |
| 03/30/2005 | CN1601727A Intermediate chip module, semiconductor element, circuit substrate and electronic equipment |
| 03/30/2005 | CN1195035C Adhesive for connecting anisotropic circuit, circuit board connection method and connector |
| 03/29/2005 | US6873380 Providing optical elements over emissive displays |