Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
04/2005
04/21/2005WO2004086497A3 Method for producing chip stacks
04/21/2005WO2004064139A3 Semiconductor chip stack and method for passivating a semiconductor chip stack
04/21/2005WO2004032571A3 Light source module comprising light emitting diodes and method for production thereof
04/21/2005WO2004017434A3 Laminated polymer with integrated lighting, sensors and electronics
04/21/2005US20050085034 Encapsulated stack of dice and support therefor
04/21/2005US20050085018 Electroosmotic pumps using porous frits for cooling integrated circuit stacks
04/21/2005US20050085015 Method of using foamed insulators in three dimensional multichip structures
04/21/2005US20050085014 Semiconductor substrate for build-up packages
04/21/2005US20050084992 Method for the production of light-guiding led bodies in two chronologically separate stages
04/21/2005US20050083663 Electronic device and method for manufacturing the same
04/21/2005US20050083150 Multichip module
04/21/2005US20050082974 White light emitting diode
04/21/2005US20050082930 Three-phase ac generator for vehicle
04/21/2005US20050082690 Method for producing semiconductor device and semiconductor device
04/21/2005US20050082689 Resin-sealed semiconductor device
04/21/2005US20050082684 Semiconductor device and method for manufacturing the same
04/21/2005US20050082683 Semiconductor device and a method of manufacturing the same
04/21/2005US20050082679 Semiconductor component and production method suitable therefor
04/21/2005US20050082673 Semiconductor apparatus, led head, and image forming apparatus
04/21/2005US20050082664 Stacked semiconductor device and semiconductor chip control method
04/21/2005US20050082663 Semiconductor device and semiconductor module
04/21/2005US20050082658 Simplified stacked chip assemblies
04/21/2005US20050082657 Compact semiconductor device capable of mounting a plurality of semiconductor chips with high density and method of manufacturing the same
04/21/2005US20050082656 Stacked package module
04/21/2005US20050082643 Semiconductor element, semiconductor device, method for manufacturing semiconductor element, method for manufacturing semiconductor device, and electronic apparatus
04/21/2005US20050082641 Flexible and elastic dielectric integrated circuit
04/21/2005US20050082626 Membrane 3D IC fabrication
04/21/2005US20050082560 Optical semiconductor device
04/21/2005US20050081913 Apparatus comprising electronic and/or optoelectronic circuitry and method for realizing said circuitry
04/21/2005US20050081909 Concentrating solar roofing shingle
04/21/2005DE202005001255U1 Mounting structure of photoelectric semiconductor wafer for manufacture of light-emitting diode, has electrically conductive material on front of wafer for establishing connection to photoelectric semiconductor
04/21/2005DE10136395B4 Durch einen Mikrocontroller, einen Mikroprozessor, oder einen Signalprozessor gebildete programmgesteuerte Einheit Formed by a microcontroller, microprocessor, or a signal processor programmable unit
04/20/2005EP1524893A1 Electronic control unit, in particular for motor vehicles, with improved heat dissipation system
04/20/2005EP1524705A2 Flip chip type led lighting device manufacturing method
04/20/2005EP1524704A2 Light emission device and manufacturing method thereof
04/20/2005EP1524698A2 Photoelectric converter
04/20/2005EP1524695A2 Affinity based self-assembly systems and devices for photonic and electronic applications
04/20/2005EP1523799A1 Cooling body and rectifier module for an electrical machine
04/20/2005EP1523749A2 Surface-mountable component and method for the production thereof
04/20/2005CN1608400A Chip scale stacking system and method
04/20/2005CN1608324A Method for the production of light-guiding led bodies in two chronologically separate stages
04/20/2005CN1608321A Memory device packaging including stacked passive devices and method for making the same
04/20/2005CN1608223A Light-beam switching/adjusting apparatus and manufacturing method thereof
04/20/2005CN1607676A Sealing of large area display device
04/20/2005CN1198335C 半导体装置 Semiconductor device
04/20/2005CN1198332C Wiring beard, semiconductor device, and method of mfg. wiring board
04/20/2005CN1198078C Mixed integrated efficient full-colour LED lamp
04/19/2005US6882546 Multiple die interconnect system
04/19/2005US6882538 Intelligent power module
04/19/2005US6882232 Surface-mount crystal oscillator
04/19/2005US6882087 Uniform energy megasonic transducer using vessel as resonator
04/19/2005US6882069 Vehicle AC generator with rectifier diode package disposed between cooling plates
04/19/2005US6882056 Multi-chip package type semiconductor device
04/19/2005US6882047 Semiconductor package including a plurality of semiconductor chips therein
04/19/2005US6882046 Single package containing multiple integrated circuit devices
04/19/2005US6882044 High speed electronic interconnection using a detachable substrate
04/19/2005US6882030 Integrated circuit structures with a conductor formed in a through hole in a semiconductor substrate and protruding from a surface of the substrate
04/19/2005US6881611 Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the device
04/19/2005US6881599 Transferring semiconductor crystal from a substrate to a resin
04/19/2005US6881071 Power semiconductor module with pressure contact means
04/19/2005US6880962 LED light source mimicking a filamented lamp
04/14/2005WO2005034523A1 2d/3d data projector
04/14/2005WO2005034238A1 Electrical shielding in stacked dies by using conductive die attach adhesive
04/14/2005WO2005034198A2 Methods and apparatus for an led light engine
04/14/2005WO2004107461B1 Light emitting diode package and light emitting diode system having at least two heat sinks
04/14/2005US20050079685 Deposition of diffusion barrier
04/14/2005US20050078890 Easy-to-unseal packaging bag
04/14/2005US20050078436 Method for stacking chips within a multichip module package
04/14/2005US20050078104 Tiled electronic display structure
04/14/2005US20050077632 Method for producing a multichip module and multichip module
04/14/2005US20050077621 Vertically stacked pre-packaged integrated circuit chips
04/14/2005US20050077614 Semiconductor device heat sink package and method
04/14/2005US20050077613 Integrated circuit package
04/14/2005US20050077608 Semiconductor device and its manufacturing method
04/14/2005US20050077607 Small memory card
04/14/2005US20050077600 Semiconductor device
04/14/2005US20050077546 Structure and method for forming a capacitively coupled chip-to-chip signaling interface
04/14/2005US20050077451 Optical device and production method thereof
04/14/2005US20050076948 Roof cover type solar cell module
04/14/2005US20050076947 Sun followoing method in solar system
04/14/2005US20050076945 Solar battery and manufacturing method thereof
04/14/2005DE20122323U1 Trägersubstrat für elektronische Bauteile Substrate for electronic components
04/14/2005DE10342295A1 Anordnung eines elektrischen Bauelements mit einer elektrischen Isolationsfolie auf einem Substrat und Verfahren zum Herstellen der Anordnung Arrangement of an electrical component with an electrical insulation film on a substrate and method of manufacturing the arrangement
04/14/2005DE102004014864A1 Schutzkreis zum Schutz vor elektrostatischen Entladungen und Verfahren zur Herstellung von Licht emittierenden Dioden Protection circuit to protect against electrostatic discharges and method for the production of light-emitting diodes
04/13/2005EP1523042A2 Optical device and production method thereof
04/13/2005EP1523041A1 Light emitting diode assembly having high-performance heat dissipation means
04/13/2005EP1523040A2 Flip chip heat sink package and method
04/13/2005EP1523039A1 Chip card and fabrication method
04/13/2005EP1523036A2 Semiconductor device heat sink package and method
04/13/2005EP1522957A1 Electronic device, rubber product, and methods for manufacturing the same
04/13/2005EP1522138A2 Active rectifier module for three-phase generators of vehicles
04/13/2005CN2692832Y Chip packaging structural member
04/13/2005CN2692478Y LED safety fuse lamp
04/13/2005CN1606809A Tooth profiled photovoltaic roofing panel
04/13/2005CN1606160A Semiconductor device and method for making same, circuit base plate and electronic device
04/13/2005CN1606159A Optical device and production method thereof
04/13/2005CN1606158A CMOS device type image sensor module
04/13/2005CN1606154A Semiconductor device and method for making same
04/13/2005CN1606037A Electronic device, rubber product, and methods for manufacturing the same
04/13/2005CN1605790A LED light apparatus and method therefor
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