| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
|---|
| 05/05/2005 | US20050093142 Passive element chip and manufacturing method thereof, and highly integrated module and manufacturing method thereof |
| 05/05/2005 | US20050093137 Semiconductor apparatus |
| 05/05/2005 | US20050093126 Filp-chip sub-assembly, methods of making same and device including same |
| 05/05/2005 | US20050093123 Power semiconductor device and power semiconductor module |
| 05/05/2005 | US20050093122 Modular power semiconductor module |
| 05/05/2005 | US20050093117 thickness and cost reduction |
| 05/05/2005 | US20050093095 Semiconductor device and method of fabricating the same |
| 05/05/2005 | US20050092240 Gas for plasma reaction, process for producing the same, and use |
| 05/05/2005 | US20050091979 Concentrating solar energy receiver |
| 05/05/2005 | US20050091842 Manufacturing method of lead frame for optical coupling device as well as optical coupling device using this lead frame |
| 05/04/2005 | EP1528596A1 Holder for at least one stack of semiconductor as well as electric system provided with the same |
| 05/04/2005 | EP1528593A1 Semiconductor device and method for manufacturing the same |
| 05/04/2005 | EP1527480A2 Semiconductor device and method of manufacturing the same |
| 05/04/2005 | EP1527249A2 Laminated glass and structural glass with integrated lighting, sensors and electronics |
| 05/04/2005 | EP1474959B1 Method for embedding a component in a base and forming a contact |
| 05/04/2005 | CN2697828Y LED integrated module with constant current function |
| 05/04/2005 | CN1613150A Lower profile package with power supply in package |
| 05/04/2005 | CN1613148A Semiconductor device with co-packaged die |
| 05/04/2005 | CN1613143A Gas for plasma reaction, process for producing the same, and use |
| 05/04/2005 | CN1612362A Manufacturing method of lead frame and optical coupling device using this lead frame |
| 05/04/2005 | CN1612346A Multi-chip package type memory system |
| 05/04/2005 | CN1612340A Multi-chip packages having a plurality of flip chips and methods of manufacturing the same |
| 05/04/2005 | CN1612337A 存储器系统和存储器模块 Memory systems and memory modules |
| 05/04/2005 | CN1612309A Semiconductor device and method and apparatus for making same |
| 05/03/2005 | US6888240 High performance, low cost microelectronic circuit package with interposer |
| 05/03/2005 | US6888227 Apparatus for routing signals |
| 05/03/2005 | US6888169 High speed optical subassembly with ceramic carrier |
| 05/03/2005 | US6888141 Radiation sensor with photo-thermal gain |
| 05/03/2005 | US6888064 Modular packaging arrangements and methods |
| 05/03/2005 | US6887769 Dielectric recess for wafer-to-wafer and die-to-die metal bonding and method of fabricating the same |
| 05/03/2005 | US6887753 Methods of forming semiconductor circuitry, and semiconductor circuit constructions |
| 05/03/2005 | US6886962 Shielded reflective light-emitting diode |
| 04/28/2005 | WO2005039262A1 Method of producing module with embedded component and module with embedded component |
| 04/28/2005 | WO2005038935A1 Light-emitting device |
| 04/28/2005 | WO2005038919A1 Power semiconductor module, and power converter and mobile unit using the same |
| 04/28/2005 | WO2005038918A1 Power semiconductor module, power converter employing it and mobile unit |
| 04/28/2005 | WO2005038917A1 Package structure and packaging method of semiconductor device |
| 04/28/2005 | WO2005038910A2 Three-dimensional integrated circuit with integrated heat sinks |
| 04/28/2005 | WO2005023143A8 Illuminated electric toothbrushes and methods of use |
| 04/28/2005 | WO2005011342A3 Embedded directional impedance control channels for pc boards |
| 04/28/2005 | US20050091440 Memory system and memory module |
| 04/28/2005 | US20050090091 Method of forming multi-piled bump |
| 04/28/2005 | US20050090083 Advanced barrier linear formation for vias |
| 04/28/2005 | US20050090050 Stacked semiconductor packages |
| 04/28/2005 | US20050090042 Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme |
| 04/28/2005 | US20050088900 Stacked multi-component integrated circuit microprocessor |
| 04/28/2005 | US20050088824 Heat sink with integrated electronics |
| 04/28/2005 | US20050087882 Multi function package |
| 04/28/2005 | US20050087881 Electronic device |
| 04/28/2005 | US20050087865 Multi-chip press-connected type semiconductor device |
| 04/28/2005 | US20050087855 Microelectronic component and assembly having leads with offset portions |
| 04/28/2005 | US20050087854 Power module flip chip package |
| 04/28/2005 | US20050087853 Semiconductor device and method of manufacturing the same |
| 04/28/2005 | US20050087852 Chip package structure and process for fabricating the same |
| 04/28/2005 | US20050087849 Electronic substrate, power module and motor driver |
| 04/28/2005 | US20050087750 LED array |
| 04/28/2005 | US20050087747 Optoelectronic semiconductor device and light signal input/output device |
| 04/28/2005 | US20050087743 Semiconductor device, LED print head and image-forming apparatus using same, and method of manufacturing semiconductor device |
| 04/28/2005 | US20050087608 Semiconductor device and manufacturing method thereof, a pet substrate and manufacturing method thereof |
| 04/28/2005 | US20050087438 Method and apparatus for combining multiple integrated circuits |
| 04/28/2005 | US20050087223 Solar cell array |
| 04/27/2005 | EP1526581A2 Light source and vehicle lamp |
| 04/27/2005 | EP1526574A2 Semiconductor device, light emitting diode print head and image-forming apparatus using same, and method of manufacturing semiconductor device |
| 04/27/2005 | EP1526573A2 Inverter device and method of manufacturing the device thereof, and electric automobile incorporating the inverter device thereof |
| 04/27/2005 | EP1526057A2 LED signal light for railway vehicles |
| 04/27/2005 | EP1525621A2 Trench-gate semiconductor device, corresponding module and apparatus, and method of operating the device |
| 04/27/2005 | EP1228535A4 Face-to-face chips |
| 04/27/2005 | CN2696134Y Color temp adjustable white-light LED |
| 04/27/2005 | CN2696131Y LED matrix module reflection cover |
| 04/27/2005 | CN2696130Y High-voltage silicon pile |
| 04/27/2005 | CN2695779Y Popular lighting LED bulb |
| 04/27/2005 | CN1610137A White light emitting diode |
| 04/27/2005 | CN1610134A Illuminating device |
| 04/27/2005 | CN1610133A Optical semiconductor device |
| 04/27/2005 | CN1610109A Stacked semiconductor device and semiconductor chip control method |
| 04/27/2005 | CN1610108A Semiconductor device and semiconductor assembly |
| 04/27/2005 | CN1610083A Method for producing semiconductor and semiconductor device |
| 04/27/2005 | CN1199271C Constructed integrated circuit with balance structure |
| 04/27/2005 | CN1199270C Stacked semiconductor device |
| 04/27/2005 | CN1199269C Semiconductor device, method and device for producing same |
| 04/27/2005 | CN1199268C 半导体装置及其制造方法 Semiconductor device and manufacturing method |
| 04/26/2005 | US6886076 Semiconductor integrated circuit device having connection pads for superposing expansion memory |
| 04/26/2005 | US6885562 Circuit package and method for making the same |
| 04/26/2005 | US6885561 Multiple chip module with integrated RF capabilities |
| 04/26/2005 | US6885278 Microconverter and laminated magnetic-core inductor |
| 04/26/2005 | US6885106 Stacked microelectronic assemblies and methods of making same |
| 04/26/2005 | US6885099 Multichip module, manufacturing method thereof, multichip unit and manufacturing method thereof |
| 04/26/2005 | US6885097 Semiconductor device |
| 04/26/2005 | US6885096 Semiconductor device having at least three power terminals superposed on each other |
| 04/26/2005 | US6885093 Stacked die semiconductor device |
| 04/26/2005 | US6885035 Multi-chip semiconductor LED assembly |
| 04/26/2005 | US6885002 IRFPA ROIC with dual TDM reset integrators and sub-frame averaging functions per unit cell |
| 04/26/2005 | US6884938 Compact circuit module |
| 04/26/2005 | US6884658 Die stacking scheme |
| 04/26/2005 | US6884657 Angularly offset stacked die multichip device and method of manufacture |
| 04/26/2005 | US6884654 Method of forming a stack of packaged memory dice |
| 04/26/2005 | US6884653 Folded interposer |
| 04/26/2005 | US6883933 Lighting apparatus whose light emitting elements are hard to be taken off |
| 04/21/2005 | WO2005036610A2 Multi-surface contact ic packaging structures and assemblies |
| 04/21/2005 | WO2005036567A2 Stand-alone organic-based passive devices |