Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
05/2005
05/19/2005US20050104149 Semiconductor component and sensor component for data transmission devices
05/19/2005US20050104073 Solid-state display with improved color-mixing
05/19/2005US20050104027 Three-dimensional integrated circuit with integrated heat sinks
05/19/2005US20050103376 Solar cell module and manufacturing method therefor
05/19/2005DE10346474A1 Halbleiterbauteil und Sensorbauteil mit Datenübertragungsvorrichtungen Semiconductor device and sensor component with data transmission devices
05/19/2005DE10297633T5 Solarzellenaufreihungsmaschine Solarzellenaufreihungsmaschine
05/18/2005EP1531498A2 Solar cell module and manufacturing method therefor
05/18/2005EP1531494A2 Double-sided multi-chip circuit component
05/18/2005CN2701075Y Separate pushing type double rectifier bridge
05/18/2005CN2700708Y Wireless remote control LED bulb
05/18/2005CN1617356A Solar cell module and manufacturing method therefor
05/18/2005CN1617339A Semiconductor device
05/18/2005CN1617315A Semiconductor package piece
05/17/2005US6894901 Light source comprising a large number of light-emitting diodes
05/17/2005US6894396 Semiconductor device with capacitor
05/17/2005US6894395 System on a chip device including a re-wiring layer formed between groups of electronic devices
05/17/2005US6894392 Scaleable integrated data processing device
05/17/2005US6894381 Electronic device having a stack of semiconductor chips and method for the production thereof
05/17/2005US6894380 Packaged stacked semiconductor die and method of preparing same
05/17/2005US6894378 Electronic component with stacked semiconductor chips
05/17/2005US6894375 Semiconductor device, semiconductor module and hard disk
05/17/2005US6894373 Semiconductor chip wire bonded to substrate; encapsulation with resin; striped pattern
05/17/2005US6894368 Microelectronic device fabricating method, method of forming a pair of conductive device components of different base widths from a common deposited conductive layer, and integrated circuitry
05/17/2005US6894315 Structure of light-emitting diode array module
05/17/2005US6893899 Contact member stacking system and method
05/17/2005US6893898 Semiconductor device and a method of manufacturing the same
05/17/2005US6893897 Stacked package for integrated circuits
05/17/2005US6893169 Optical semiconductor package and process for fabricating the same
05/12/2005WO2005043631A2 Semiconductor light emitting device, lighting module, lighting apparatus, and manufacturing method of semiconductor light emitting device
05/12/2005WO2005043622A1 Semiconductor device and process for fabricating the same
05/12/2005WO2005043584A2 Single mask via method and device
05/12/2005WO2005023146A3 Toothbrush with severable electrical connections
05/12/2005WO2005023145A3 Electric toothbrush comprising an electrically powered element
05/12/2005WO2005023144A3 Electric toothbrushes and replaceable components
05/12/2005WO2005023131A3 Illuminated electric toothbrushes
05/12/2005WO2005008791A3 Semiconductor light emitting device, method of manufacturing the same, and lighting apparatus and display apparatus using the same
05/12/2005WO2004077548A3 Connection technology for power semiconductors
05/12/2005US20050101116 Integrated circuit device and the manufacturing method thereof
05/12/2005US20050101060 Electronic device, rubber product, and methods for manufacturing the same
05/12/2005US20050101056 Semiconductor chip, chip stack package and manufacturing method
05/12/2005US20050101037 Test system with interconnect having conductive members and contacts on opposing sides
05/12/2005US20050100294 Techniques for joining an opto-electronic module to a semiconductor package
05/12/2005US20050099834 Stacked memory, memory module and memory system
05/12/2005US20050099808 Light-emitting device
05/12/2005US20050098891 Semiconductor device and method of manufacturing the same
05/12/2005US20050098885 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
05/12/2005US20050098883 Interconnection for chip sandwich arrangements, and method for the production thereof
05/12/2005US20050098879 Semiconductor package having ultra-thin thickness and method of manufacturing the same
05/12/2005US20050098876 Semiconductor device with semiconductor chip formed by using wide gap semiconductor as base material
05/12/2005US20050098873 Stacked module systems and methods
05/12/2005US20050098871 Semiconductor device with semiconductor chip and rewiring layer and method for producing the same
05/12/2005US20050098869 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
05/12/2005US20050098868 Multi-chips module assembly package
05/12/2005US20050098732 Flat-panel detector utilizing electrically interconnecting tiled photosensor arrays
05/12/2005US20050098612 Design of an insulated cavity
05/12/2005DE19747105B4 Bauelement mit gestapelten Halbleiterchips Device with stacked semiconductor chips
05/12/2005CA2543100A1 Single mask via method and device
05/11/2005EP1530235A2 Semiconductor apparatus
05/11/2005EP1530234A2 Heat sinkable power device package
05/11/2005EP1529419A1 An electronic product, a body and a method of manufacturing
05/11/2005EP1529311A1 Functional coating of an scfm preform
05/11/2005CN2699478Y Stack type multi-wafer packaging structure
05/11/2005CN1614780A Piled double-face electrode package and multi-chip assembly
05/11/2005CN1614773A Semiconductor apparatus
05/11/2005CN1614770A Chip module with high radiating performance and its substrate
05/11/2005CN1614713A Stacked memory, memory module and memory system
05/11/2005CN1201635C Organic electro-illuminating apparatus and electronic machine
05/11/2005CN1201161C Probe card for probing wafers with raised contact elements
05/10/2005US6891729 Memory module
05/10/2005US6891706 Protected exciter for an electrical power generator and associated methods
05/10/2005US6891396 Repeatable block producing a non-uniform routing architecture in a field programmable gate array having segmented tracks
05/10/2005US6891387 System for probing, testing, burn-in, repairing and programming of integrated circuits
05/10/2005US6891276 Having terminals that protrude downwardly from bottom surface of insulative housing and leads that protrude laterally from side surfaces; terminals and leads are connected together and to chip pads in one-to-one relation; simplified testing
05/10/2005US6891273 Semiconductor package and fabrication method thereof
05/10/2005US6891248 Semiconductor component with on board capacitor
05/10/2005US6891200 Light-emitting unit, light-emitting unit assembly, and lighting apparatus produced using a plurality of light-emitting units
05/10/2005US6891190 Organic semiconductor device and method
05/10/2005US6890834 Electronic device and method for manufacturing the same
05/10/2005US6890798 Stacked chip packaging
05/10/2005US6889428 Clamper covers the conductive foil to cover the exposed parts of the surface, and a plating liquid is injected into the interior of the clamper for forming the plated film on the surface of the masked conductive foil
05/10/2005CA2152356C Pixel, video display screen and power delivery
05/06/2005WO2005041312A1 Light receiving or light emitting modular sheet and process for producing the same
05/06/2005WO2005041297A1 Electroosmotic pumps using porous frits for cooling integrated circuit stacks
05/06/2005WO2005041295A2 Semiconductor module provided with contacts extending through the housing
05/06/2005WO2005041257A2 Wireless coupling of stacked dies within system in package
05/06/2005WO2005041256A2 An integrated circuit micro-cooler using self-assembled nano structures
05/06/2005WO2005010990A3 Memory stack using flexible circuit and low-profile contacts
05/05/2005US20050095733 Method for generating chip stacks
05/05/2005US20050094433 Stacked semiconductor device including improved lead frame arrangement
05/05/2005US20050094417 LED light source mimicking a filamented lamp
05/05/2005US20050093427 Full-color light-emitting diode (LED) formed by overlaying red, green, and blue LED diode dies
05/05/2005US20050093181 Heat sinkable package
05/05/2005US20050093177 Semiconductor package, method for manufacturing the same and lead frame for use in the same
05/05/2005US20050093173 Semiconductor package having dicrete non-active electrical components incorporated into the package
05/05/2005US20050093167 Semiconductor chip and semiconductor device
05/05/2005US20050093153 BGA package with component protection on bottom
05/05/2005US20050093152 Multi-surface contact IC packaging structures and assemblies
05/05/2005US20050093145 Asic-embedded switchable antenna arrays
05/05/2005US20050093144 Multi-chip module
05/05/2005US20050093143 Semiconductor package for memory chips
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