Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
05/2005
05/31/2005US6898850 Method of manufacturing circuit board and communication appliance
05/31/2005US6898845 Method for manufacturing hybrid electronic circuits for active implantable medical devices
05/26/2005WO2005048348A1 Electronic packaging materials for use with low-k dielectric-containing semiconductor devices
05/26/2005WO2005048347A2 Power module
05/26/2005WO2005048345A1 Package system for modular superstructures and method for producing package systems
05/26/2005WO2005047859A2 Flat-panel detector utilizing electrically interconnecting tiled photosensor arrays
05/26/2005WO2005036567A9 Stand-alone organic-based passive devices
05/26/2005WO2005010937A3 Packaging of semiconductor devices for incrased reliability
05/26/2005WO2004034434A9 Components, methods and assemblies for multi-chip packages
05/26/2005US20050114814 Multiple voltage integrated circuit and design method therefor
05/26/2005US20050114613 Multi-chip package type memory system
05/26/2005US20050112932 Semiconductor device including primary and secondary side circuits on first and second substrates with capacitive insulation
05/26/2005US20050112842 Integrating passive components on spacer in stacked dies
05/26/2005US20050112803 Semiconductor device and its manufacturing method, and semiconductor device manufacturing system
05/26/2005US20050112798 Electronics circuit manufacture
05/26/2005US20050111157 Decoupling circuit for co-packaged semiconductor devices
05/26/2005US20050110166 Semiconductor device, electronic device, electronic apparatus, method of manufacturing semiconductor device, and method of manufacturing electronic device
05/26/2005US20050110162 Electronic component having at least one semiconductor chip and flip-chip contacts, and method for producing the same
05/26/2005US20050110159 Stacked integrated circuit device including multiple substrates and method of manufacturing the same
05/26/2005US20050110158 Semiconductor device and method of manufacturing the same, circuit board, and electronic apparatus
05/26/2005US20050110155 Semiconductor device and method of manufacturing the same, circuit board and electronic device
05/26/2005US20050110154 Semiconductor device
05/26/2005US20050110135 Module assembly and method for stacked BGA packages
05/26/2005US20050110134 Electronic circuit unit with semiconductor components disposed on both surfaces of board
05/26/2005US20050110131 Vertical wafer stacking using an interposer
05/26/2005US20050110128 Highly reliable stack type semiconductor package
05/26/2005US20050110127 Semiconductor device
05/26/2005US20050110126 Chip adhesive
05/26/2005US20050110125 Overlap stacking of center bus bonded memory chips for double density and method of manufacturing the same
05/26/2005US20050110121 Lead frame, resin-encapsulated semiconductor device, and method of producing the same
05/26/2005US20050110036 LED package
05/26/2005US20050109946 Detector for a tomography unit
05/26/2005US20050109384 Modular shade system with solar tracking panels
05/25/2005EP1534054A2 Laminated circuit board and its manufacturing method, and manufacturing method for module using the laminated circuit board and its manufacturing apparatus
05/25/2005EP1533839A2 Semiconductor device with a gel-filled case
05/25/2005EP1474828B1 Housing for a power semiconductor module which is resistant to high voltages
05/25/2005DE10238812B4 Halbleiterspeichervorrichtung mit veränderbarer Kontaktbelegung und entsprechende Halbleitervorrichtung Semiconductor memory device with variable contact assignment and corresponding semiconductor device
05/25/2005DE102004048529A1 Electronic device for driving brushless motor, has semiconductor chip with one contact side bonded to metallic conductor portion through solid soldering agent layer whose softening temperature is used as device operating temperature
05/25/2005CN1620225A Laminated circuit board and its manufacturing method, and manufacturing method for module using the laminated circuit board and its manufacturing apparatus
05/25/2005CN1619846A Power type high brightness white light combined semiconductor LED chip and technique of batch production
05/25/2005CN1619825A Packaging structure of image sensing component element and its chip packaging method
05/25/2005CN1619813A Light source structure of luminous diode
05/25/2005CN1619812A Stacked semiconductor device
05/25/2005CN1619811A 半导体器件 Semiconductor devices
05/25/2005CN1619810A Luminous diode light source structure
05/25/2005CN1619796A Semiconductor device
05/25/2005CN1203542C Power semiconductor device
05/25/2005CN1203486C Semiconductor memory chip module
05/24/2005US6897855 Tiled electronic display structure
05/24/2005US6897565 Stacked packages
05/24/2005US6897558 Power electronic component module and method for assembling same
05/24/2005US6897553 Apparatus for forming a stack of packaged memory dice
05/24/2005US6897552 Semiconductor device wherein chips are stacked to have a fine pitch structure
05/24/2005US6897486 LED package die having a small footprint
05/24/2005US6897485 Device for optical and/or electrical data transmission and/or processing
05/24/2005US6897430 Semiconductor device, optoelectronic board, and production methods therefor
05/24/2005US6897125 Methods of forming backside connections on a wafer stack
05/24/2005US6897096 Method of packaging semiconductor dice employing at least one redistribution layer
05/24/2005US6897091 Semiconductor device and manufacturing method thereof
05/24/2005US6897088 Method for connecting circuit devices
05/24/2005US6895664 Method of making an optical coupling device
05/24/2005CA2258049C Illuminator assembly incorporating light emitting diodes
05/19/2005WO2005046020A2 Electric motor and method for producing said motor
05/19/2005WO2005045934A2 Method and device for connecting chips
05/19/2005WO2005045933A1 Method and apparatus for combining multiple integrated circuits
05/19/2005WO2005045928A1 Dc-dc converter implemented in a land grid array package
05/19/2005WO2005045903A2 Method for making a flat-top pad
05/19/2005WO2005045902A2 Semiconductor device and manufacturing method thereof
05/19/2005WO2004100343A3 Light emitting diodes packaged for high temperature operation
05/19/2005WO2004095537A3 Semiconductor multipackage module including processor and memory package assemblies
05/19/2005WO2004061952A3 Method of forming a multi-layer semiconductor structure having a seamless bonding interface
05/19/2005US20050107542 Film adhesives containing maleimide compounds and methods for use thereof
05/19/2005US20050106834 Method and apparatus for filling vias
05/19/2005US20050106780 Semiconductor/printed circuit board assembly, and computer system
05/19/2005US20050106779 Techniques for packaging multiple device components
05/19/2005US20050105691 Segmented collimator assembly
05/19/2005US20050105225 Microtransformer for system-on-chip power supply
05/19/2005US20050104515 LED lamp
05/19/2005US20050104228 Microelectronic devices, methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices
05/19/2005US20050104219 Intermediate chip module, semiconductor device, circuit board, and electronic device
05/19/2005US20050104213 Electric connection terminal and method of manufacturing the same, semiconductor device and method of mounting the same
05/19/2005US20050104211 Semiconductor device having semiconductor chips mounted on package substrate
05/19/2005US20050104209 Semiconductor chip package having decoupling capacitor and manufacturing method thereof
05/19/2005US20050104206 Mounting structure in integrated circuit module
05/19/2005US20050104205 Substrate for electrical device and methods of manufacturing the same
05/19/2005US20050104204 Wafer-level package and its manufacturing method
05/19/2005US20050104203 Duplexer
05/19/2005US20050104202 Semiconductor device
05/19/2005US20050104198 Circuit device and manufacturing method thereof
05/19/2005US20050104196 Semiconductor package
05/19/2005US20050104194 Heat sink is disposed above the chip for improving heat dissipation, especially for stack type chip package structure; semiconductor electronic devices; solving heat generation problem
05/19/2005US20050104189 Semiconductor device
05/19/2005US20050104187 Redistribution of substrate interconnects
05/19/2005US20050104184 Semiconductor chip package and method
05/19/2005US20050104183 Multi-chip module
05/19/2005US20050104182 Stacked BGA packages
05/19/2005US20050104181 Wafer level stack structure for system-in-package and method thereof
05/19/2005US20050104171 Microelectronic devices having conductive complementary structures and methods of manufacturing microelectronic devices having conductive complementary structures
05/19/2005US20050104170 Resin encapsulating body that seals the die pad section, and the first and second semiconductor chips; suppress deterioration of semiconductor chips due to stress
05/19/2005US20050104166 Semiconductor device and manufacturing method thereof
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