Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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06/09/2005 | US20050121777 Semiconductor device |
06/09/2005 | US20050121773 Method of manufacturing semiconductor device |
06/09/2005 | US20050121769 Stacked integrated circuit packages and methods of making the packages |
06/09/2005 | US20050121764 Stackable integrated circuit packaging |
06/09/2005 | US20050121761 Semiconductor device and method for fabricating the same |
06/09/2005 | US20050121758 Thin package for stacking integrated circuits |
06/09/2005 | US20050121711 Chip and wafer integration process using vertical connections |
06/09/2005 | US20050121701 Semiconductor device |
06/09/2005 | US20050121686 Semiconductor light emitting devices and submounts and methods for forming the same |
06/09/2005 | US20050121683 Light receiving or emitting semiconductor apparatus |
06/09/2005 | US20050121662 Surface emitting device, manufacturing method thereof and projection display device using the same |
06/09/2005 | US20050121173 Stacked type cooler |
06/08/2005 | EP1538669A2 Thin package for stacking integrated circuits |
06/08/2005 | EP1538668A2 Organic electroluminescence device and driving apparatus thereof |
06/08/2005 | EP1537483A1 A memory circuit comprising a non-volatile ram and a ram |
06/08/2005 | CN1625927A Method for embedding a component in a base and forming a contact |
06/08/2005 | CN1625812A Panel for light receiving or light-emitting and its manufacturing method |
06/08/2005 | CN1625807A Split-gate power module and method for suppressing oscillation therein |
06/08/2005 | CN1625805A Board for mounting semiconductor chip and manufacturing method and semiconductor module |
06/08/2005 | CN1625316A Organic electroluminescent device and driving apparatus |
06/08/2005 | CN1624919A Wafer-level electronic modules with integral connector contacts and methods of fabricating the same |
06/08/2005 | CN1624915A LED luminous module |
06/08/2005 | CN1624914A Paired transistor and manufacturing method thereof |
06/08/2005 | CN1624899A Method and structure for contraction of transistor number distribution |
06/08/2005 | CN1624889A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
06/08/2005 | CN1624888A Fan out type wafer level package structure and method of the same |
06/07/2005 | US6903932 Covering element for subassemblies |
06/07/2005 | US6903472 Rectifying apparatus having wind blocking member |
06/07/2005 | US6903465 Packaging of semiconductor dice to facilitate vertical mounting on a printed circuit board |
06/07/2005 | US6903458 Carrier for integrated chip is embedded into substrate so that stresses due to thermal expansion are uniformly distributed over interface between substrate and carrier |
06/07/2005 | US6903457 Power semiconductor device |
06/07/2005 | US6903455 Side braze packages |
06/07/2005 | US6903443 Semiconductor component and interconnect having conductive members and contacts on opposing sides |
06/07/2005 | US6903442 Semiconductor component having backside pin contacts |
06/07/2005 | US6903382 Light emitting diode mounting structure |
06/07/2005 | US6903326 OPTO-electronic assembly having detectors for converting optical signals |
06/07/2005 | US6902953 Methods of forming semiconductor stacked die devices |
06/07/2005 | US6902951 Electronic device configured as a multichip module, leadframe, panel with leadframe positions, and method for producing the electronic device |
06/07/2005 | CA2357628C Oscillator and electronic apparatus using the same |
06/02/2005 | WO2005022591A9 Reversible leadless package and methods of making and using same |
06/02/2005 | WO2004114433A3 A two stage energy storage device |
06/02/2005 | WO2004100265A3 Light-emitting diode system |
06/02/2005 | WO2004100222A3 Electronically tunable rf chip packages |
06/02/2005 | WO2004097947A3 Light emitting diodes and the manufacture thereof |
06/02/2005 | WO2004071141A3 Metal base wiring board for retaining light emitting elements, light emitting source, lighting apparatus, and display apparatus |
06/02/2005 | US20050118748 Methods of reducing bleed-out of underfill and adhesive materials |
06/02/2005 | US20050117835 Techniques for joining an opto-electronic module to a semiconductor package |
06/02/2005 | US20050117351 Hybrid illuminator |
06/02/2005 | US20050117334 Light emitting device |
06/02/2005 | US20050117315 Method of manufacturing an electronic device |
06/02/2005 | US20050117312 Laminated circuit board and its manufacturing method, and manufacturing method for module using the laminated circuit board and its manufacturing apparatus |
06/02/2005 | US20050117303 Heat radiation device for memory module |
06/02/2005 | US20050116659 Organic electroluminescent device and driving apparatus |
06/02/2005 | US20050116358 Stacked microelectronic assemblies with central contacts |
06/02/2005 | US20050116353 Semiconductor device and fabrication method thereof |
06/02/2005 | US20050116331 Stacked chip semiconductor device |
06/02/2005 | US20050116330 Semiconductor module and method for mounting the same |
06/02/2005 | US20050116322 Efficient heat dissipation, reliable electrical connection; small conductive pattern interval; leads serving as terminals |
06/02/2005 | US20050116235 Illumination assembly |
06/02/2005 | US20050116145 Optical semiconductor element and electronic device using the optical semiconductor element |
06/02/2005 | US20050115603 Solar cell module edge face sealing member and solar cell module employing same |
06/02/2005 | US20050115062 Chip assembling structure and socket |
06/02/2005 | DE202005004273U1 Illumination device for computer, has base plate, light elements and sockets on base plates that hold light elements of light emitting diodes |
06/02/2005 | DE10353139A1 Packagesystem für modulare Systemaufbauten Package System for modular system structures |
06/02/2005 | DE10352079A1 Elektromotor, sowie Verfahren zur Herstellung eines solchen Electric motor, as well as methods for producing such |
06/02/2005 | DE10350913A1 Light-emitting diode arrangement for a rotating warning light comprises a spatial arrangement of diodes, a support having rigid assembly regions and connecting regions arranged between the assembly regions, and a flexible circuit board |
06/02/2005 | DE10349839A1 Electrical structural element including a conductive plate with at least one light emitting diode and enclosed by transparent synthetic plastic housing useful in electrical technology |
06/02/2005 | DE10348620A1 Halbleitermodul mit Gehäusedurchkontakten Semiconductor module with a housing contacts |
06/02/2005 | DE102004053680A1 Hybridbeleuchtungskörper Hybrid Lighting |
06/02/2005 | DE102004049197A1 Solarbatterie und Herstellverfahren für eine solche Solar battery and manufacturing method for such |
06/01/2005 | EP1536470A2 Luminescence cell, luminescence device with luminescence cell, luminescence unit, luminescence device with luminescence unit, frame for luminescence device, and method for manufacturing luminescence cell |
06/01/2005 | EP1535331A2 Chip stack with intermediate cavity |
06/01/2005 | EP1535327A1 Method and apparatus for electronically aligning capacitively coupled chip pads |
06/01/2005 | EP1534992A2 Electronic assembly/system with reduced cost, mass, and volume and increased efficiency and power density |
06/01/2005 | EP1421618B1 Power electronics component |
06/01/2005 | CN2703330Y Whole-colour diode exciter lamp |
06/01/2005 | CN1622730A Luminous module |
06/01/2005 | CN1622351A Manufacturing method of light-emitting device with crystal coated light emitting diode |
06/01/2005 | CN1622343A Solar cell module edge face sealing member and solar cell module employing same |
06/01/2005 | CN1622328A Semiconductor device and fabrication method thereof |
06/01/2005 | CN1622327A Optical semiconductor element and electronic device using the optical semiconductor element |
06/01/2005 | CN1622326A Offset-bonded, multi-chip semiconductor device |
06/01/2005 | CN1204793C A printed circuit board assembly with improved bypass decoupling for BGA packages |
06/01/2005 | CN1204665C Semiconductor laser device |
06/01/2005 | CN1204623C Semiconductor device |
06/01/2005 | CN1204610C Method for manufacturing parts after installation of electronic element and manufacturing device thereof |
05/31/2005 | US6901092 Package structure for a hybrid optical module and method of producing the same |
05/31/2005 | US6900986 Power module |
05/31/2005 | US6900708 Integrated passive devices fabricated utilizing multi-layer, organic laminates |
05/31/2005 | US6900551 Semiconductor device with alternate bonding wire arrangement |
05/31/2005 | US6900549 Semiconductor assembly without adhesive fillets |
05/31/2005 | US6900537 High power silicon carbide and silicon semiconductor device package |
05/31/2005 | US6900530 Stacked IC |
05/31/2005 | US6900529 Electronic module having a three dimensional array of carrier-mounted integrated circuit packages |
05/31/2005 | US6900528 Stacked mass storage flash memory package |
05/31/2005 | US6900390 Flexible microstrip signal and power bus cable |
05/31/2005 | US6900076 Methods for manufacturing semiconductor chips, methods for manufacturing semiconductor devices, semiconductor chips, semiconductor devices, connection substrates and electronic devices |
05/31/2005 | US6900074 Method of manufacturing a semiconductor device having plural semiconductor chips, wherein electrodes of the semiconductor chips are electrically connected together via wiring substrates of the semiconductor chips |
05/31/2005 | US6899534 Mold assembly for a package stack via bottom-leaded plastic (blp) packaging |
05/31/2005 | US6899435 Illumination apparatus and image projection apparatus using the illumination apparatus |