| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 06/23/2005 | US20050133895 Flip-chip mounting of a semiconductor chip on a substrate for sealing by a resin for injection molding; reducing the internal pressure of the die cavity; changing the substrate clamping pressure is changed from a low pressure to a high pressure to fill the gap between chip and substrate; efficiency |
| 06/23/2005 | US20050133892 Semiconductor device and method for the fabrication thereof |
| 06/23/2005 | US20050133800 Solid state lighting device |
| 06/23/2005 | US20050133686 LED illumination system having an intensity monitoring system |
| 06/23/2005 | US20050133082 Integrated solar energy roofing construction panel |
| 06/23/2005 | DE10352671A1 Leistungsmodul Power module |
| 06/23/2005 | DE102004052227A1 Speichersystem und Speichermodul Storage system, and storage modulus |
| 06/23/2005 | DE102004042670A1 Microoptical component for microoptical radiator, receiver systems has monolithic or hybrid planar arrangement of radiation, receiver assemblies, optical functional element on substrate, areas for forming incoherent optical radiation |
| 06/22/2005 | EP1544915A2 Electronic module heat sink mounting arrangement |
| 06/22/2005 | EP1544908A1 Process for mounting a semiconductor device |
| 06/22/2005 | EP1544671A2 Illumination apparatus with movable LEDs and image projection apparatus using the same |
| 06/22/2005 | EP1543555A1 Press pack power semiconductor module |
| 06/22/2005 | CN1630945A Semiconductor device package and lead frame with die overhanging lead frame pad |
| 06/22/2005 | CN1630810A Optical sensor |
| 06/22/2005 | CN1630107A Light-emitting device |
| 06/22/2005 | CN1630076A Electric circuit module |
| 06/22/2005 | CN1630051A Semiconductor device producing method, semiconductor device, circuit substrate, and electronic device |
| 06/22/2005 | CN1630050A Process for mounting a semiconductor device |
| 06/22/2005 | CN1629698A LED illumination system having an intensity monitoring system |
| 06/22/2005 | CN1629536A Method and apparatus for producing untainted white light using off-white light emitting diodes |
| 06/22/2005 | CN1207947C Printed circuit board assembly |
| 06/22/2005 | CN1207785C Semiconductor device, method of manufacturing electronic device, electronic device and portable information terminal |
| 06/22/2005 | CN1207784C Cross stack type dual-chip packaging device and its preparing process |
| 06/22/2005 | CN1207783C 电子模块 Electronic Modules |
| 06/22/2005 | CN1207768C Semiconductor device with silicon structure on insulator, and method for manufacturing same |
| 06/21/2005 | US6909649 Semiconductor device and semiconductor integrated circuit |
| 06/21/2005 | US6909377 Illumination device with light emitting diodes (LEDs), method of illumination and method for image recording with such an LED illumination device |
| 06/21/2005 | US6909303 Multichip module and testing method thereof |
| 06/21/2005 | US6909234 Package structure of a composite LED |
| 06/21/2005 | US6909182 Spherical semiconductor device and method for fabricating the same |
| 06/21/2005 | US6909173 Flexible substrate, semiconductor device, imaging device, radiation imaging device and radiation imaging system |
| 06/21/2005 | US6909172 Semiconductor device with conduction test terminals |
| 06/21/2005 | US6908794 Method of making a semiconductor package device that includes a conductive trace with recessed and non-recessed portions |
| 06/21/2005 | US6908792 Chip stack with differing chip package types |
| 06/21/2005 | US6908785 Multi-chip package (MCP) with a conductive bar and method for manufacturing the same |
| 06/21/2005 | US6908565 Etch thinning techniques for wafer-to-wafer vertical stacks |
| 06/21/2005 | US6908561 Applying adhesion promoter to aluminum or to etched and cleaned copper and/or titanium portions of substrate, curing, applying and curing silicone polyimide epoxy varnish and layer of adhesion promoter, laminating polyimide dielectric |
| 06/21/2005 | US6908314 Tailored interconnect module |
| 06/16/2005 | WO2005055317A1 Packaged electronic element and method of producing electronic element package |
| 06/16/2005 | WO2005055288A2 Method and device for the alternating contacting of two wafers |
| 06/16/2005 | WO2005041295A3 Semiconductor module provided with contacts extending through the housing |
| 06/16/2005 | WO2004105119A3 Method for the production of a chip arrangement and varnish comprising magnetically conductive particles for electrically contacting the chip |
| 06/16/2005 | US20050130497 Stress dispersing lead and stress dispersing method of lead |
| 06/16/2005 | US20050130351 Methods for maskless lithography |
| 06/16/2005 | US20050130349 Electronic parts built-in substrate and method of manufacturing the same |
| 06/16/2005 | US20050130345 Castellation wafer level packaging of integrated circuit chips |
| 06/16/2005 | US20050128853 Semiconductor device including multi-chip |
| 06/16/2005 | US20050128767 Light source structure of light emitting diode |
| 06/16/2005 | US20050128706 Power module with heat exchange |
| 06/16/2005 | US20050127816 Light emitting device and method of manufacturing the same |
| 06/16/2005 | US20050127531 Method for ball grid array chip packages having improved testing and stacking characteristics |
| 06/16/2005 | US20050127526 Semi conductor device |
| 06/16/2005 | US20050127503 Power semiconductor module and method for producing it |
| 06/16/2005 | US20050127494 Semiconductor package |
| 06/16/2005 | US20050127491 Stacked die semiconductor device |
| 06/16/2005 | US20050127485 Light-emitting diode package structure |
| 06/16/2005 | US20050127478 Microelectronic devices and methods for filling vias in microelectronic devices |
| 06/16/2005 | US20050127379 Light emitting or light receiving semiconductor module and method for manufacturing same |
| 06/16/2005 | US20050127377 Optoelectronic component |
| 06/16/2005 | US20050126622 Solar cell module and method of producing the same |
| 06/16/2005 | US20050126621 PV wind performance enhancing methods and apparatus |
| 06/16/2005 | DE202005004751U1 Torch using a number of LED elements has a front plate having lenses that focus the light into a sharp bundle |
| 06/16/2005 | DE19926746B4 Mehrfachanordnung von mit LEDs bestückten Leiterplatten und Steckverbinder für die Verbindung von Leiterplatten Multiple arrangement of printed circuit boards equipped with LEDs and connectors for the connection of printed circuit boards |
| 06/16/2005 | DE10352946A1 Halbleiterbauteil mit Halbleiterchip und Umverdrahtungslage sowie Verfahren zur Herstellung desselben Of the same semiconductor device with the semiconductor chip and rewiring and methods for preparing |
| 06/16/2005 | DE10249854B4 Leistungshalbleiter-Baugruppe The power semiconductor module |
| 06/15/2005 | EP1542519A1 Method for manufacturing board with built-in device and board with built-in device, and method for manufacturing printed wiring board and printed wiring board |
| 06/15/2005 | EP1540769A1 Dielectric interconnect frame incorporating emi shield and hydrogen absorber for tile t/r modules |
| 06/15/2005 | EP1540739A2 .electromagnetic radiation sensing device with integrated housing including two superimposed sensors |
| 06/15/2005 | EP1540730A2 Ganged detector pixel, photon/pulse counting radiation imaging device |
| 06/15/2005 | EP1540729A1 Method of manufacturing a wafer assembly |
| 06/15/2005 | EP0896738B1 INTEGRATED dE-E DETECTOR TELESCOPE |
| 06/15/2005 | CN1628390A Light-emitting device and its prodn. method |
| 06/15/2005 | CN1627516A Test module and test method in use for electrical erasable memory built in chip |
| 06/15/2005 | CN1627480A Making method of semiconductor device |
| 06/15/2005 | CN1206732C Multiple chip module with integrated RF capabilities |
| 06/14/2005 | US6907198 Wavelength division multiplexed optical interconnection device |
| 06/14/2005 | US6906416 Semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA) package |
| 06/14/2005 | US6906415 Semiconductor device assemblies and packages including multiple semiconductor devices and methods |
| 06/14/2005 | US6906409 Multichip semiconductor package |
| 06/14/2005 | US6906408 Assemblies and packages including die-to-die connections |
| 06/14/2005 | US6906407 Field programmable gate array assembly |
| 06/14/2005 | US6906406 Multiple dice package |
| 06/14/2005 | US6906404 Power module with voltage overshoot limiting |
| 06/14/2005 | US6905913 Semiconductor device and method of manufacturing same |
| 06/14/2005 | US6905912 Semiconductor device and method for fabricating the same |
| 06/14/2005 | US6905911 Semiconductor device, method for manufacturing an electronic equipment, electronic equipment, and portable information terminal |
| 06/09/2005 | WO2005053025A1 Semiconductor integrated circuit device |
| 06/09/2005 | WO2005053024A1 Multi-chip type semiconductor device |
| 06/09/2005 | WO2005052999A2 Decoupling circuit for co-packaged semiconductor devices |
| 06/09/2005 | WO2005034198A3 Methods and apparatus for an led light engine |
| 06/09/2005 | US20050125760 Data processing in digital systems |
| 06/09/2005 | US20050124186 Electronic device having adapter and connection method thereof |
| 06/09/2005 | US20050124148 Method for embedding a component in a base and forming a contact |
| 06/09/2005 | US20050124093 Fan out type wafer level package structure and method of the same |
| 06/09/2005 | US20050122557 Optical scanning device, image forming apparatus, and optical scanning method |
| 06/09/2005 | US20050122031 Light-emitting device comprising led chip and method for manufacturing this device |
| 06/09/2005 | US20050121805 Semiconductor device and a method of manufacturing the same |
| 06/09/2005 | US20050121802 Offset-bonded, multi-chip semiconductor device |
| 06/09/2005 | US20050121801 Component |
| 06/09/2005 | US20050121799 Semiconductor device manufacturing method and semiconductor device manufactured thereby |