Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
08/2014
08/27/2014EP2769253A1 Molded glass lid for wafer level packaging of opto-electronic assemblies
08/26/2014US8817486 Semiconductor package having multi pitch ball land
08/26/2014US8816890 Integrated circuit device with programmable blocks and analog circuit control
08/26/2014US8816719 Re-programmable antifuse FPGA utilizing resistive CeRAM elements
08/26/2014US8816509 Semiconductor package including underfill layers
08/26/2014US8816501 IC device including package structure and method of forming the same
08/26/2014US8816485 Methods and materials useful for chip stacking, chip and wafer bonding
08/26/2014US8816453 MEMS component and a semiconductor component in a common housing having at least one access opening
08/26/2014US8816364 Display apparatus
08/26/2014US8816280 Infrared sensor
08/26/2014US8815653 Packaging and connecting electrostatic transducer arrays
08/26/2014US8815645 Multi-chip stacking method to reduce voids between stacked chips
08/26/2014US8815643 Method of fabricating semiconductor die with through-hole via on saw streets and through-hole via in active area of die
08/26/2014US8815642 Laser-assisted cleaving of a reconstituted wafer for stacked die assemblies
08/26/2014US8814406 Optoelectronic headlight, method for production of an optoelectronic headlight and a luminescence diode chip
08/26/2014US8814054 Inclusion of chip elements in a sheathed wire
08/26/2014US8813354 Method of manufacturing an electromagnetic shielding structure
08/21/2014WO2014127032A1 Semiconductor device having stacked memory elements and method of stacking memory elements on a semiconductor device
08/21/2014WO2014126818A1 Dual substrate, power distribution and thermal solution for direct stacked integrated devices
08/21/2014WO2014126575A1 Multi-chip module with a compressible structure for maintaining alignment between chips in the module
08/21/2014WO2014125317A1 Integrated circuit with integrated current sensor
08/21/2014WO2013186119A8 Semiconductor light source with a first and a second led chip and a first and a second fluorescent substance
08/21/2014US20140232962 Display device
08/21/2014US20140231993 Package-on-package structures
08/21/2014US20140231989 Semiconductor Device and Method of Embedding Bumps Formed on Semiconductor Die into Penetrable Adhesive Layer to Reduce Die Shifting During Encapsulation
08/21/2014US20140231935 Multi-axial acceleration sensor and method of manufacturing the same
08/21/2014US20140231837 LED Module
08/21/2014US20140231834 Transparent led layer between phosphor layer and light exit surface of lamp
08/21/2014US20140231678 Near infrared light source in bulk silicon
08/21/2014US20140230878 Method for electrically connecting several solar cells and photovoltaic module
08/21/2014DE112012004963T5 Elektronisches Modul Electronic module
08/21/2014DE112012004593T5 Leistungswandler Power converter
08/21/2014DE112011105693T5 Halbleitervorrichtung Semiconductor device
08/21/2014DE112005003614B4 Halbleiterbaugruppe für ein Schaltnetzteil und Verfahren zu dessen Montage A semiconductor assembly for a switching power supply and process for its mounting
08/21/2014DE112005001962B4 Systeme und Verfahren zum Anbringen von Chips in gestapelten Chipbausteinen Systems and methods for mounting of chips in stacked chip modules
08/21/2014DE102014102006A1 Halbleitermodule und Verfahren zu deren Bildung Semiconductor modules and methods for their formation
08/21/2014DE102014101818A1 Optische Vorrichtung als Mehrchip-Wafer-Level-Package (WLP) An optical device as a multi-chip wafer level package (WLP)
08/21/2014DE102014001217A1 Package für Hochleistungs-Halbleitervorrichtungen Package for high power semiconductor devices
08/21/2014DE102013201952A1 Halbleiter-Leuchtmodul mit lichtdurchlässiger Vergussmasse Semiconductor light-emitting module with translucent potting compound
08/21/2014DE102013101732A1 Sensorsystem Sensor system
08/21/2014DE102013101532A1 Optoelektronisches Halbleiterbauteil An optoelectronic semiconductor device
08/21/2014DE102013101530A1 Optoelektronisches Halbleiterbauteil An optoelectronic semiconductor device
08/20/2014EP2768037A1 Light-emission device, and illumination device using same
08/20/2014EP2766931A1 Stub minimization for wirebond assemblies without windows
08/20/2014EP2766930A1 Switching element unit
08/20/2014DE202014103047U1 Beleuchtungsvorrichtung zur Erzeugung von weißem Licht Lighting device for generating of white light
08/19/2014US8811031 Multichip module and method for manufacturing the same
08/19/2014US8810310 Vertically stacked fin transistors and methods of fabricating and operating the same
08/19/2014US8810124 AC light emitting device with long-persistent phosphor and light emitting device module having the same
08/19/2014US8810043 Semiconductor device
08/19/2014US8810038 Semiconductor device and wiring board
08/19/2014US8810013 Integrated power converter package with die stacking
08/19/2014US8809983 Semiconductor device, manufacturing method therefor, and electronic apparatus
08/19/2014US8809951 Chip packages having dual DMOS devices with power management integrated circuits
08/19/2014US8809896 Light emitting device and image display unit
08/19/2014US8809116 Method for wafer level packaging of electronic devices
08/19/2014US8809082 Method for producing lamps
08/19/2014US8809081 Electronic device and method of manufacturing an electronic device
08/19/2014CA2715344C Semiconductor element module and method for manufacturing the same
08/14/2014WO2014123734A1 Interlocking light sheet tiles
08/14/2014WO2014122061A1 Optoelectronic lighting module, optoelectronic lighting device, and motor vehicle headlamp
08/14/2014US20140225282 System in package (sip) with dual laminate interposers
08/14/2014US20140225281 Semiconductor Package Including Multiple Chips and Separate Groups of Leads
08/14/2014US20140225218 Ion reduced, ion cut-formed three-dimensional (3d) integrated circuits (ic) (3dics), and related methods and systems
08/14/2014US20140225212 Optical sensor chip device and corresponding production method
08/14/2014US20140225134 Light emitting device package
08/14/2014US20140225133 Light-emitting device having transparent package and manufacturing method
08/14/2014DE102014202264A1 Belichtungsvorrichtungen Exposure devices
08/14/2014DE102014101591A1 Leistungstransistoranordnung und damit versehene Baugruppe Power transistor device and thus provided assembly
08/14/2014DE102013226544A1 Halbleitervorrichtung Semiconductor device
08/14/2014DE102013202170A1 Optische Sensorchipvorrichtung und entsprechendes Herstellungsverfahren Optical sensor chip device and corresponding manufacturing method
08/14/2014DE102013101262A1 Optoelektronisches Leuchtmodul, optoelektronische Leuchtvorrichtung und Kfz-Scheinwerfer Optoelectronic light module, optoelectronic lighting device and vehicle headlights
08/14/2014DE102013101260A1 Vorrichtung mit zumindest einem optoelektronischen Halbleiterbauelement A device with at least one optoelectronic semiconductor component
08/14/2014DE102007002807B4 Chipanordnung Chip system
08/13/2014EP2765602A1 Semiconductor system
08/13/2014EP2765601A1 Semiconductor device and method of manufacture thereof
08/13/2014EP2765600A1 Semiconductor device
08/13/2014EP2764549A2 Stub minimization using duplicate sets of terminals for wirebond assemblies without windows
08/13/2014EP2764548A1 Memory modules in packages
08/13/2014EP2764547A1 Stub minimization using duplicate sets of terminals for wirebond assemblies without windows
08/13/2014EP2764546A2 Stub minimization for multi-die wirebond assemblies with orthogonal windows
08/13/2014EP2764545A1 Stub minimization for wirebond assemblies without windows
08/13/2014EP2764544A1 Stub minimization for multi-die wirebond assemblies with parallel windows
08/13/2014EP2764543A2 Stub minimization for multi-die wirebond assemblies with parallel windows
08/13/2014EP2764542A2 Stub minimization for assemblies without wirebonds to package substrate
08/13/2014EP2764541A1 Stub minimization for assemblies without wirebonds to package substrate
08/13/2014EP2764539A1 Determining spacing of semiconductor dies using a spatially varying charge distribution
08/13/2014EP2764513A2 Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate
08/13/2014EP2764512A2 Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate
08/13/2014CN203775045U 一种智能半导体功率模块 An intelligent semiconductor power module
08/13/2014CN203774326U 一种具有无线通信功能的动态存储bga封装模块 Dynamic storage bga package module having a wireless communication function
08/13/2014CN203774325U 一种led灯组件 One kind of led lamp assembly
08/13/2014CN203774324U 一种磨砂表面装贴型led One kind of matte surface mount type led
08/13/2014CN203774323U Led组件的芯片电极连接结构 Chip connection structure of the electrode assembly Led
08/13/2014CN203774322U 多晶片发光二极管封装结构 Multi-chip light emitting diode package structure
08/13/2014CN203774321U 一种用于sot23半导体的双二极管封装结构 Dual diode package structure for a semiconductor sot23
08/13/2014CN203774320U 一种多场效晶体管集成模块 A multi-field effect transistor integrated module
08/13/2014CN203774319U 堆叠式封装结构 Stacked package structure
08/13/2014CN203774310U 电子器件 Electronic devices
08/13/2014CN203774293U 一种集成电路的3d封装结构 An integrated circuit packaging structure of 3d
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