| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 07/07/2005 | DE102004055215A1 Versetzt gebondete Mehrchip-Halbleitervorrichtung Offset bonded multi-chip semiconductor device |
| 07/07/2005 | DE102004049249A1 Wafer-level electronic module, has monolithic substrate with redistribution structure for providing connector contact coupled to integrated circuit dice, where structure provides electronic device coupled to circuit dice |
| 07/07/2005 | DE102004015929A1 Electronic component, typically memory module, containing semiconductor element on main face of circuit board, and heat convecting element extending along entire semiconductor element and thermally coupled to circuit board |
| 07/07/2005 | CA2547832A1 Semiconductor light emitting devices and submounts and methods for forming the same |
| 07/06/2005 | EP1550361A1 Electronic substrate of a three-dimensional electronic module |
| 07/06/2005 | EP1550023A2 A scalable computer system having surface-mounted capacitive couplers for intercommunication |
| 07/06/2005 | EP1155445B1 Method for producing electrically conductive connections |
| 07/06/2005 | CN2708255Y Integrated remote metering terminal |
| 07/06/2005 | CN2708097Y Condensing semiconductor lamp |
| 07/06/2005 | CN1636280A Multichip led package with in-package quantitative and spectral sensing capability and digital signal output |
| 07/06/2005 | CN1636277A 功率半导体模块 Power Semiconductor Modules |
| 07/06/2005 | CN1209948C Integrated module board with embedded IC chip and passive element and its production method |
| 07/06/2005 | CN1209802C Method for producing electronic device and electronic device |
| 07/05/2005 | US6914325 Power semiconductor module |
| 07/05/2005 | US6914324 Memory expansion and chip scale stacking system and method |
| 07/05/2005 | US6914262 White light emitting diode and method for manufacturing the same |
| 07/05/2005 | US6914259 Multi-chip module, semiconductor chip, and interchip connection test method for multi-chip module |
| 07/05/2005 | US6913949 Stacked packages |
| 07/05/2005 | US6913468 Methods of removably mounting electronic components to a circuit board, and sockets formed by the methods |
| 06/30/2005 | WO2005059998A1 Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavities |
| 06/30/2005 | WO2005059997A1 Various structure/height bumps for wafer level-chip scale package |
| 06/30/2005 | WO2005059993A2 Packaging substrates for integrated circuits and soldering methods |
| 06/30/2005 | WO2005059967A2 Multiple chip package module having inverted package stacked over die |
| 06/30/2005 | WO2005059549A1 Method for bonding plastic micro chip |
| 06/30/2005 | WO2005024898A3 Integrated lamp with feedback and wireless control |
| 06/30/2005 | US20050142954 Modular sockets using flexible interconnects |
| 06/30/2005 | US20050142696 Method of backside grinding a bumped wafer |
| 06/30/2005 | US20050142694 Stacking memory chips using flat lead-frame with breakaway insertion pins and pin-to-pin bridges |
| 06/30/2005 | US20050141828 Package for housing an optoelectronic assembly |
| 06/30/2005 | US20050141318 Dual chip package |
| 06/30/2005 | US20050140470 High frequency module |
| 06/30/2005 | US20050140286 Luminescence cell, luminescence device with luminescence cell, luminescence unit, luminescence device with luminescence unit, frame for luminescence device, and method for manufacturing luminescence cell |
| 06/30/2005 | US20050140023 Method of manufacturing a semiconductor device |
| 06/30/2005 | US20050140022 Multi-chip package structure |
| 06/30/2005 | US20050140021 Semiconductor device and manufacturing method thereof |
| 06/30/2005 | US20050140008 Electronic circuit unit and method of fabricating the same |
| 06/30/2005 | US20050140000 Method of manufacturing a semiconductor device and semiconductor device |
| 06/30/2005 | US20050139985 Semiconductor chip package and multichip package |
| 06/30/2005 | US20050139980 High density integrated circuit module |
| 06/30/2005 | US20050139979 Multi-chip package structure |
| 06/30/2005 | US20050139978 Semiconductor device having layered chips |
| 06/30/2005 | US20050139977 Semiconductor integrated circuit device |
| 06/30/2005 | US20050139955 Radio frequency integrated circuit, and method for manufacturing the same |
| 06/30/2005 | US20050139954 Radio frequency semiconductor device and method of manufacturing the same |
| 06/30/2005 | US20050139307 Mounting device and method thereof |
| 06/30/2005 | US20050138799 Method of manufacturing a metal-ceramic circuit board |
| 06/30/2005 | DE4401178B4 Vorrichtung zum Schalten bspw. hoher Spannungen bzw. Ströme Device for switching eg. High voltages and currents |
| 06/30/2005 | DE10355925A1 Leistungshalbleitermodul und Verfahren seiner Herstellung The power semiconductor module and its production method |
| 06/30/2005 | DE10354497A1 Detektor für ein Tomografie-Gerät Detector for a tomography device |
| 06/30/2005 | DE102004049868A1 Halbleitervorrichtung in Stapelanordnung und Steuerverfahren für Halbleiterchips Semiconductor device stack assembly and control method for semiconductor chips |
| 06/30/2005 | DE102004033057A1 Wafer-Level-Package-Struktur vom Fan-Out-Typ und Verfahren zur Herstellung derselben Wafer-level package structure of the fan-out type and method of making same |
| 06/30/2005 | DE102004023110A1 Licht emittierende Vorrichtung Light emitting device |
| 06/29/2005 | EP1549119A2 Electronic circuit unit and method of fabricating the same |
| 06/29/2005 | EP1548850A1 White light emitting device |
| 06/29/2005 | EP1548846A2 Solar celll module edge face sealing member and solar cell module employing same |
| 06/29/2005 | EP1548833A1 Ferroelectric memory and its manufacturing method |
| 06/29/2005 | EP1548829A2 Power semiconductor module and method for its manufacture |
| 06/29/2005 | EP1547166A2 Light source module and method for production thereof |
| 06/29/2005 | EP1547161A1 Packaging structure for imaging detectors |
| 06/29/2005 | EP1547149A2 Device for producing a bundled light flux |
| 06/29/2005 | EP1547141A2 Semiconductor multi-package module having wire bond interconnection between stacked packages |
| 06/29/2005 | EP1547131A1 Large-diameter sic wafer and manufacturing method thereof |
| 06/29/2005 | EP1547129A2 Methods and systems for processing a substrate using a dynamic liquid meniscus |
| 06/29/2005 | EP1546796A1 Illumination device for backlighting an image reproduction device |
| 06/29/2005 | EP1317801B1 Thick film millimeter wave transceiver module |
| 06/29/2005 | CN1633705A Semiconductor device and method of manufacturing the same |
| 06/29/2005 | CN1633704A 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof |
| 06/29/2005 | CN1633162A Image pickup model |
| 06/29/2005 | CN1632950A 半导体封装构造 Semiconductor package |
| 06/28/2005 | US6911844 Electronic circuit apparatus and integrated circuit device |
| 06/28/2005 | US6911750 Electronic package for electrical machine |
| 06/28/2005 | US6911729 Tape carrier semiconductor device |
| 06/28/2005 | US6911724 Integrated chip package having intermediate substrate with capacitor |
| 06/28/2005 | US6911723 Multiple die stack apparatus employing T-shaped interposer elements |
| 06/28/2005 | US6911721 Semiconductor device, method for manufacturing semiconductor device and electronic equipment |
| 06/28/2005 | US6911392 Process for making contact with and housing integrated circuits |
| 06/28/2005 | US6910636 IC card and manufacturing method thereof |
| 06/28/2005 | US6910268 An interconnect system employing a vertical signal path along an edge of an integrated circuit (IC) chip |
| 06/28/2005 | CA2144323C Methods and apparatus for producing integrated circuit devices |
| 06/23/2005 | WO2005057672A2 Surface mount light emitting chip package |
| 06/23/2005 | WO2005057653A1 High density integrated circuit package s and method of making same |
| 06/23/2005 | WO2005057637A2 Method for the molecular bonding of microelectronic components to a polymer film |
| 06/23/2005 | WO2004079792A3 Electrical bus with associated porous metal heat sink and method of manufacturing same |
| 06/23/2005 | WO2004061953A3 Method of forming a multi-layer semiconductor structure incorporating a processing handle member |
| 06/23/2005 | US20050136635 Attachment of integrated circuit structures and other substrates to substrates with vias |
| 06/23/2005 | US20050136634 Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavities |
| 06/23/2005 | US20050136568 Manufacturing method of semiconductor device, semiconductor device, circuit substrate and electronic equipment |
| 06/23/2005 | US20050135441 LED illumination system having an intensity monitoring system |
| 06/23/2005 | US20050135094 Method and apparatus for producing untainted white light using off-white light emitting diodes |
| 06/23/2005 | US20050135067 Semiconductor module with vertically mounted semiconductor chip packages |
| 06/23/2005 | US20050135065 Electric circuit module |
| 06/23/2005 | US20050135041 Integrating passive components on spacer in stacked dies |
| 06/23/2005 | US20050134420 Microconverter and laminated magnetic-core inductor |
| 06/23/2005 | US20050133933 Various structure/height bumps for wafer level-chip scale package |
| 06/23/2005 | US20050133932 Semiconductor module with a semiconductor stack, and methods for its production |
| 06/23/2005 | US20050133930 Packaging substrates for integrated circuits and soldering methods |
| 06/23/2005 | US20050133929 Flexible package with rigid substrate segments for high density integrated circuit systems |
| 06/23/2005 | US20050133916 Multiple chip package module having inverted package stacked over die |
| 06/23/2005 | US20050133899 System and method for increasing the number of IO-s on a ball grid package by wire bond stacking of same size packages through apertures |
| 06/23/2005 | US20050133897 A chip is embedded in the first package body so the back surface is exposed through the bottom surface of the first package body with outer leads extending; flexible connection substrate is interposed between the first package and the second package and the leads electrically connected; efficiency |