| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 07/14/2005 | US20050153522 Wafer level chip stack method |
| 07/14/2005 | US20050153479 Method of manufacturing a semiconductor device |
| 07/14/2005 | US20050152169 Stacked IC device having functions for selecting and counting IC chips |
| 07/14/2005 | US20050152146 High efficiency solid-state light source and methods of use and manufacture |
| 07/14/2005 | US20050151599 Module for radio-frequency applications |
| 07/14/2005 | US20050151267 Semiconductor device and manufacturing method for the same |
| 07/14/2005 | US20050151252 Semiconductor device having capacitors for reducing power source noise |
| 07/14/2005 | US20050151245 Power supply component assembly on a printed circuit and method for obtaining same |
| 07/14/2005 | US20050151240 Radio frequency module |
| 07/14/2005 | US20050151237 Multi-chip assembly and method for driving the same |
| 07/14/2005 | US20050151235 Semiconductor device and manufacturing method for the same |
| 07/14/2005 | US20050151229 Electronic device having wiring substrate and lead frame |
| 07/14/2005 | US20050151228 Semiconductor chip and manufacturing method for the same, and semiconductor device |
| 07/14/2005 | US20050151217 Integrated circuit device packaging structure and packaging method |
| 07/14/2005 | US20050151216 Integrated circuit device packaging structure and packaging method |
| 07/14/2005 | US20050151167 Semiconductor apparatus and a production method thereof |
| 07/14/2005 | US20050151161 Electronic assembly |
| 07/14/2005 | US20050151143 Light emitting device |
| 07/14/2005 | US20050151086 Imaging device |
| 07/14/2005 | US20050151062 Semiconductor device, optoelectronic board, and production methods therefor |
| 07/14/2005 | US20050150813 Foldover packages and manufacturing and test methods therefor |
| 07/14/2005 | US20050150542 Stable Three-Terminal and Four-Terminal Solar Cells and Solar Cell Panels Using Thin-Film Silicon Technology |
| 07/14/2005 | DE102004059353A1 Halbleiter-Leistungsmodul Semiconductor power module |
| 07/14/2005 | DE102004057499A1 Ein Verfahren und eine Vorrichtung zum Erzeugen von unverfärbtem, weissem Licht unter Verwendung von gebrochen weissen Lichtemittierungsdioden A method and apparatus for generating unstained white light using off-white Lichtemittierungsdioden |
| 07/13/2005 | EP1553687A2 Semiconductor apparatus and a production method thereof |
| 07/13/2005 | EP1553641A1 Light-emitting device having light-emitting elements |
| 07/13/2005 | EP1553638A1 Light receiving or light emitting device and its production method |
| 07/13/2005 | EP1553630A1 Modular board device and high frequency module and method for producing them |
| 07/13/2005 | EP1553629A2 Electrically conductive adhesive sheet, method of manufacturing the same, and electric power conversion equipment |
| 07/13/2005 | EP1552565A2 Laminated polymer with integrated lighting, sensors and electronics |
| 07/13/2005 | EP1552560A1 A lamp and method of producing a lamp |
| 07/13/2005 | EP1552343A1 High-density interconnection of temperature sensitive electronic devices |
| 07/13/2005 | CN1639837A Optical chip packaging via through hole |
| 07/13/2005 | CN1639538A Measurement method for determining a surface profile |
| 07/13/2005 | CN1638152A LSI package, interposer, interface module and signal processing LSI monitoring circuit |
| 07/13/2005 | CN1638124A Radio frequency semiconductor device and method of manufacturing the same |
| 07/13/2005 | CN1638123A Semiconductor apparatus and a production method thereof |
| 07/13/2005 | CN1638122A Method of manufacturing a semiconductor device |
| 07/13/2005 | CN1638121A 半导体集成电路装置 The semiconductor integrated circuit device |
| 07/13/2005 | CN1638120A Semiconductor-mounted device and method for producing same |
| 07/13/2005 | CN1638119A 电力半导体装置 Power semiconductor devices |
| 07/13/2005 | CN1638118A Semiconductor apparatus |
| 07/13/2005 | CN1638117A High frequency module |
| 07/13/2005 | CN1638116A Semiconductor power module |
| 07/13/2005 | CN1638110A Semiconductor device having layered chips |
| 07/13/2005 | CN1638104A Hybrid integrated circuit device and manufacturing method of the same |
| 07/13/2005 | CN1638078A Electronic element, method for producing electronic element and electronic apparatus |
| 07/13/2005 | CN1638076A Semiconductor chip and manufacturing method for the same, and semiconductor device |
| 07/13/2005 | CN1638071A Manufacturing method of a semiconductor device |
| 07/13/2005 | CN1638020A Manufacturing method of semiconductor device, semiconductor device, circuit substrate and electronic equipment |
| 07/13/2005 | CN1210796C Power transistor module, power amplifier and method in fabrication thereof |
| 07/13/2005 | CN1210792C Semiconductor device and making method thereof |
| 07/13/2005 | CN1210789C Semiconductor packaging element with heat sink structure |
| 07/12/2005 | US6917998 Reusable complex multi-bus system hardware prototype system |
| 07/12/2005 | US6917526 Electronic component module |
| 07/12/2005 | US6917219 Multi-chip programmable logic device having configurable logic circuitry and configuration data storage on different dice |
| 07/12/2005 | US6917143 Lighting apparatus with enhanced capability of removing heat |
| 07/12/2005 | US6917100 Circuit module having interleaved groups of circuit chips |
| 07/12/2005 | US6917063 Ferroelectric memory and method of fabricating the same |
| 07/12/2005 | US6916725 Method for manufacturing semiconductor device, and method for manufacturing semiconductor module |
| 07/12/2005 | US6916719 Method and apparatus for non-conductively interconnecting integrated circuits |
| 07/12/2005 | US6916689 Plastic chip-scale package having integrated passive components |
| 07/12/2005 | US6916686 Method of manufacturing a semiconductor device |
| 07/12/2005 | US6916682 Semiconductor package device for use with multiple integrated circuits in a stacked configuration and method of formation and testing |
| 07/07/2005 | WO2005062393A2 Semiconductor light emitting devices and submounts and methods for forming the same |
| 07/07/2005 | WO2005062389A2 Semiconductor light emitting device, lighting module, lighting apparatus, display element, and manufacturing method for semiconductor light emitting device |
| 07/07/2005 | WO2005062382A2 Light emitting diode based illumination assembly |
| 07/07/2005 | WO2005060681A2 Integrated solar energy roofing construction panel |
| 07/07/2005 | WO2005006556A3 Integrated circuit with interface tile for coupling to a stacked -die second integrated circuit |
| 07/07/2005 | WO2004107440B1 Electronic parts, module, module assembling method, identification method, and environment setting method |
| 07/07/2005 | WO2004077525A3 Ball grid array with bumps |
| 07/07/2005 | WO2004057677A3 Integrated circuit structure comprising an optoelectronic part which is covered with a lid through which light can pass |
| 07/07/2005 | US20050148237 Electronic circuit device |
| 07/07/2005 | US20050148175 Semiconductor device and manufacturing method thereof |
| 07/07/2005 | US20050148113 Semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA) package |
| 07/07/2005 | US20050148106 Method of transferring a device, a method of producing a device holding substrate, and a device holding substrate |
| 07/07/2005 | US20050147839 metallic alloy foil for electroconductive, thermoconductive paths in a direction along the plane of the sheet; use in vehicle, convert direct current power supplied from a battery to alternate current power, then supply to the motor engine; lead-free |
| 07/07/2005 | US20050146870 Elongated flexible lighting equipment and fabricating method of same |
| 07/07/2005 | US20050146270 Stacked light emitting diode |
| 07/07/2005 | US20050146236 Rectifier of ac generator for vehicle and method for manufacturing the same |
| 07/07/2005 | US20050146056 Thinned without cracking or chipping while dicing |
| 07/07/2005 | US20050146055 Preventing cracking and/or chipping both at time of dicing and during handling; using resin protective film on active surface |
| 07/07/2005 | US20050146053 Wafer stacking with anisotropic conductive adhesive |
| 07/07/2005 | US20050146052 Semiconductor device and semiconductor module |
| 07/07/2005 | US20050146049 RF and MMIC stackable micro-modules |
| 07/07/2005 | US20050146032 Producing without cracking or chipping; sealing sidewall with protective resin then simultaneously grinding and polishing inactive surface on opposite side |
| 07/07/2005 | US20050146031 Low profile stacking system and method |
| 07/07/2005 | US20050146027 Power semiconductor device |
| 07/07/2005 | US20050146026 Semiconductor-mounted device and method for producing same |
| 07/07/2005 | US20050146018 Package circuit board and package including a package circuit board and method thereof |
| 07/07/2005 | US20050146017 Power supply connection structure to a semiconductor device |
| 07/07/2005 | US20050146011 Pitch change and chip scale stacking system and method |
| 07/07/2005 | US20050146010 Stackable ceramic FBGA for high thermal applications |
| 07/07/2005 | US20050146009 Multi-chip module and methods |
| 07/07/2005 | US20050146008 Semiconductor device |
| 07/07/2005 | US20050146005 Semiconductor device and manufacturing method thereof |
| 07/07/2005 | US20050146004 Semiconductor sensor device and method of producing the same |
| 07/07/2005 | US20050145858 LED package die having a small footprint |
| 07/07/2005 | DE10361521A1 Method of alternate contacting of two wafers especially a semiconductor and a functional component wafer uses selected laser wavelength to fuse contact metallization only |
| 07/07/2005 | DE10355586A1 Improved chip-on-chip structure includes intervening layers of bonding agent with two photoimide layers |