Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
07/2005
07/28/2005DE10360708A1 Halbleitermodul mit einem Halbleiterstapel und Verfahren zur Herstellung desselben The same semiconductor module with a semiconductor stack and processes for preparing
07/28/2005DE10360573A1 Power semiconductor module for electric motor control comprises at least two pairs of semiconductor elements and heat store combinations that are separate from one another
07/27/2005EP1557890A1 White-light LED and method for regulating the generated light color of the white-light LED
07/27/2005EP1556895A2 Semiconductor stacked multi-package module having inverted second package
07/27/2005CN1647284A Solar power devices for providing power to handheld devices
07/27/2005CN1647277A Stacked die semiconductor device
07/27/2005CN1647269A Method of manufacturing an electronic device
07/27/2005CN1645610A Stacked layered type semiconductor memory device
07/27/2005CN1645600A 混合集成电路装置及其制造方法 Hybrid integrated circuit device and manufacturing method thereof
07/27/2005CN1645579A Method of manufacturing hybrid integrated circuit device
07/27/2005CN1645511A Stacked layered type semiconductor memory device
07/27/2005CN1212676C Light source device using LED and method of producing same
07/26/2005US6922018 High intensity light source arrangement
07/26/2005US6921980 Integrated semiconductor circuit including electronic component connected between different component connection portions
07/26/2005US6921979 Semiconductor device having a bond pad and method therefor
07/26/2005US6921969 Semiconductor module and method of producing a semiconductor module
07/26/2005US6921968 Stacked flip chip package
07/26/2005US6921675 Device transfer method and panel
07/26/2005US6921183 Concave cup printed circuit board for light emitting diode and method for producing the same
07/26/2005US6921018 Multi-chip stack and method of fabrication utilizing self-aligning electrical contact array
07/26/2005US6921016 Semiconductor device and method of manufacturing the same, circuit board, and electronic equipment
07/21/2005WO2005067359A1 Ceramic multilayer substrate
07/21/2005WO2005067062A1 Substrate with light input, substrate with light output, substrate with light input/output, and semiconductor integrated circuit with optical element
07/21/2005WO2005067061A1 Semiconductor integrated circuit with optical element
07/21/2005WO2005067046A1 Stacked device and method for stacking integrated circuit devices
07/21/2005WO2005067044A1 A method for connecting a die assembly to a substrate in an integrated circuit and a semiconductor device comprising a die assembly
07/21/2005WO2005065336A2 High-frequency chip packages
07/21/2005WO2005065064A2 Power potential-free module having a high insulation voltage
07/21/2005WO2005045903A3 Method for making a flat-top pad
07/21/2005WO2004077578A3 Lighting module based on light-emitting diodes and method for the production thereof
07/21/2005US20050158989 Method of forming wiring and method of manufacturing image display system by using the same
07/21/2005US20050158912 Low profile multi-IC chip package connector
07/21/2005US20050158904 Device transferring method
07/21/2005US20050158896 Device transferring method
07/21/2005US20050158895 Device transferring method
07/21/2005US20050158893 Using protective cups to fabricate light emitting semiconductor packages
07/21/2005US20050157557 Fabrication and assembly structures and methods for memory devices
07/21/2005US20050157515 Light emitting diode light source
07/21/2005US20050157478 Printed circuit board and method for manufacturing printed circuit board
07/21/2005US20050157477 Electronic device and production method thereof
07/21/2005US20050156616 Integrated circuit device
07/21/2005US20050156495 Display unit
07/21/2005US20050156323 Semiconductor apparatus
07/21/2005US20050156322 Thin semiconductor package including stacked dies
07/21/2005US20050156321 Process for producing a semiconductor device
07/21/2005US20050156308 Connecting elements on semiconductor chips for semiconductor components and methods for producing the same
07/21/2005US20050156304 LSI package provided with interface module
07/21/2005US20050156303 Structure of gold fingers
07/21/2005US20050156298 Semiconductor device including semiconductor elements mounted on base plate
07/21/2005US20050156289 Semiconductor chip leadframe module
07/21/2005US20050156265 Lithography device for semiconductor circuit pattern generation
07/21/2005US20050156251 Semiconductor power module
07/21/2005US20050156204 Semiconductor device
07/21/2005US20050156186 Light-emitting diode with prevention of electrostatic damage
07/21/2005US20050156181 White-light LED and method for regulating the generated light color of the white-light LED
07/21/2005US20050155699 Device transferring method, and device arraying method and image display unit fabricating method using the same
07/21/2005DE19850153B4 Halbleiter-Schaltungsanordnung, insbesondere Hochstromumrichter mit niedriger Zwischenkreisspannung Semiconductor circuit arrangement, in particular Hochstromumrichter low DC voltage
07/21/2005DE19717611B4 Struktur zum Anbringen von elektronischen Komponenten Structure for mounting of electronic components
07/21/2005DE102004056978A1 LED-Beleuchtungssystem mit einem Intensitätsüberwachungssystem LED lighting system with an intensity monitoring system
07/21/2005DE10161593B4 Flacher Halbleiterstapel Flat semiconductor stack
07/20/2005EP1555692A2 Fixing device for electronic components
07/20/2005EP1554755A2 Led light engine for ac operation and methods of fabricating same
07/20/2005EP1029356B1 Reduced area imaging devices incorporated within surgical instruments
07/20/2005EP0913866B1 Semiconductor Device and Circuit Board Having the Same Mounted Thereon
07/20/2005EP0818132B1 A method to prevent intrusions into electronic circuitry
07/20/2005CN2712040Y High-efficient semiconductor energy saving lamp
07/20/2005CN2711906Y Multi-chip IC package structure
07/20/2005CN2711529Y Radiation structure for LED lamp
07/20/2005CN1643705A Structures and materials for dye sensitized solar cells
07/20/2005CN1643616A A volumetric data storage apparatus comprising a plurality of stacked matrix-addressable memory devices
07/20/2005CN1641887A 半导体器件 Semiconductor devices
07/20/2005CN1641876A Mounting structure in integrated circuit module
07/20/2005CN1641875A Multi-chip packaging body
07/20/2005CN1641874A 多芯片封装 Multi-chip package
07/20/2005CN1641873A Multi-chip package, semiconductor used therefore and mfg. method
07/20/2005CN1641832A Semiconductor device and manufacturing method for the same
07/20/2005CN1211859C LED device
07/20/2005CN1211858C High frequency power transistor device
07/20/2005CN1211602C Light-emitting equipment using the light of light-emitting diode as base
07/19/2005US6919935 Method of forming an active matrix display
07/19/2005US6919644 Semiconductor device manufacturing method and semiconductor device manufactured thereby
07/19/2005US6919643 Multi-chip module semiconductor devices
07/19/2005US6919641 Semiconductor device and method for fabricating the same
07/19/2005US6919633 Multi-section foldable memory device
07/19/2005US6919631 Structures for improving heat dissipation in stacked semiconductor packages
07/19/2005US6919628 Stack chip package structure
07/19/2005US6919627 Comprises more than two chips stacked on a semiconductor chip carrier in a single package
07/19/2005US6919626 High density integrated circuit module
07/19/2005US6919622 For improved signal transduction/reduced electrical noises; for packaging
07/19/2005US6919584 White light source
07/19/2005US6919581 Image display unit and production method thereof
07/19/2005US6919226 Method for producing a multi-chip circuit module including a multi-layered wiring section utilizing a via-on-via structure
07/19/2005US6919225 Methods and apparatuses relating to block configurations and fluidic self-assembly processes
07/19/2005US6919220 Method of making chip package with grease heat sink
07/19/2005US6919007 Apparatus for mounting chips
07/14/2005WO2005064689A1 Optical data communication module
07/14/2005WO2005064688A1 Semiconductor module
07/14/2005WO2005064673A2 Integrating passive components on spacer in stacked dies
07/14/2005WO2005036567A3 Stand-alone organic-based passive devices
07/14/2005WO2004112128A3 Low profile stacking system and method
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