Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
08/2005
08/04/2005WO2005071742A1 Multilayer electronic component manufacturing method
08/04/2005WO2005071733A1 Semiconductor device, power converter employing it, motor employing it, hybrid automobile employing it, and motor drive system employing it
08/04/2005WO2005046020A3 Electric motor and method for producing said motor
08/04/2005WO2005020290A2 Pv wind performance enhancing methods and apparatus
08/04/2005WO2005001933A3 Multichip semi-conductor component and method for the production thereof
08/04/2005WO2004079792B1 Electrical bus with associated porous metal heat sink and method of manufacturing same
08/04/2005US20050170626 Semiconductor device and method for fabricating the device
08/04/2005US20050170600 Three-dimensional semiconductor package, and spacer chip used therein
08/04/2005US20050170558 Method of forming a stack of packaged memory dice
08/04/2005US20050169620 Optical device
08/04/2005US20050168987 Bulk-shaped lens, light-emitting unit, lighting equipment and optical information system
08/04/2005US20050168961 Stereoscopic electronic circuit device, and relay board and relay frame used therein
08/04/2005US20050168960 Module with a built-in component, and electronic device with the same
08/04/2005US20050168197 Power module
08/04/2005US20050167849 Semiconductor module
08/04/2005US20050167834 Semiconductor device including semiconductor element mounted on another semiconductor element
08/04/2005US20050167819 Method and apparatus for high electrical and thermal performance ball grid array package
08/04/2005US20050167817 Microelectronic adaptors, assemblies and methods
08/04/2005US20050167815 Circuit carrier and package structure thereof
08/04/2005US20050167812 Semiconductor device, three-dimensional semiconductor device, and method of manufacturing semiconductor device
08/04/2005US20050167810 Stacked semiconductor device
08/04/2005US20050167805 Semiconductor device and manufacturing method thereof
08/04/2005US20050167802 Semiconductor device
08/04/2005US20050167798 Die-wafer package and method of fabricating same
08/04/2005US20050167696 Silicon nitride insulating substrate for power semiconductor module
08/04/2005US20050167680 Light-emitting diode structure with electrostatic discharge protection
08/04/2005US20050167603 Apparatus for detecting ionizing radiation
08/04/2005US20050166955 Support system for photovoltaic device and method for its use
08/04/2005US20050166954 Solar cell panel
08/04/2005US20050166953 Solar energy concentrator
08/04/2005DE4313980B4 Integrierte Hybridschaltung und Verfahren zu deren Herstellung A hybrid integrated circuit, and processes for their preparation
08/04/2005DE10361696A1 Integrated semiconductor circuit has at least two modules or chips in a common housing that are galvanically separated by an integrated microprocessed structure
08/04/2005DE102005001856A1 Packungsleiterplatte, Herstellungs- und Spannungsbereitstellungsverfahren Pack PCB, manufacturing and voltage provisioning procedures
08/04/2005DE102004060935A1 Leistungshalbleitervorrichtung Power semiconductor device
08/04/2005DE102004057526A1 Stapelkühler Stack Cool
08/04/2005DE102004049880A1 Weißes Licht emittierende Diode White light-emitting diode
08/04/2005DE102004019724A1 Memory module with bracing element for reducing bending stress, with circuit board carrying semiconductor memory component
08/04/2005DE10109548B4 Schaltungsanordnung zum Schalten von Strömen Circuit arrangement for switching currents
08/03/2005EP1560271A2 Optical device
08/03/2005EP1560267A1 Integrated multi-chip chip scale package
08/03/2005EP1559216A2 Integrated optical detector directly attached to readout integrated circuit
08/03/2005EP1488427B1 A volumetric data storage apparatus comprising a plurality of stacked matrix-addressable memory devices
08/03/2005EP1470583A4 Chip and wafer integration process using vertical connections
08/03/2005CN1650500A Cooling body and rectifier module for an electrical machine
08/03/2005CN1650441A Piezoelectric ignition mechanism
08/03/2005CN1650439A Solar cell module-mounting structure and solar cell module array
08/03/2005CN1650429A A modular integrated circuit chip carrier
08/03/2005CN1650426A Seconductor device and stacked semiconductor device
08/03/2005CN1649920A Film adhesives containing maleimide and related compounds and methods for use thereof
08/03/2005CN1649149A Three-dimensional semiconductor package, and spacer chip used therein
08/03/2005CN1649148A Chip and multi-chip semiconductor device using thereof and method for manufacturing same
08/03/2005CN1649147A Back-to-back packaging integrated circuit and its producing method
08/03/2005CN1649146A Semiconductor device
08/03/2005CN1649145A Module with a built-in component, and electronic device with the same
08/03/2005CN1649144A Multi-chip assembly and method for driving the same
08/03/2005CN1649139A Semiconductor device and method of fabricating the same
08/03/2005CN1649119A Semiconductor device
08/03/2005CN1649118A Semiconductor device having conducting portion of upper and lower conductive layers, and method of fabricating the same
08/03/2005CN1649115A Package method and its structure for multiple chip integrated circuit
08/03/2005CN1649098A Semiconductor device
08/03/2005CN1648687A Apparatus for detecting ionizing radiation
08/02/2005US6925018 System-in-package type semiconductor device
08/02/2005US6924985 Method of waterproofing power circuit section and power module having power circuit section
08/02/2005US6924557 Semiconductor package
08/02/2005US6924556 Stack package and manufacturing method thereof
08/02/2005US6924551 Through silicon via, folded flex microelectronic package
08/02/2005US6924550 comprises die and an interposer substrate which includes depositing solder ball onto a ball-pad on the interposer substrate and molding to form casing; integrated circuits
08/02/2005US6924547 Memory card
08/02/2005US6924496 Fingerprint sensor and interconnect
08/02/2005US6924427 photosensitized interconnected nanoparticle layers and charge carrier materials on conductive layers and wires
08/02/2005US6924173 Semiconductor device and method for the fabrication thereof
07/2005
07/28/2005WO2005069354A2 Advanced packaging shell for pocketable consumer electronic devices
07/28/2005US20050164490 Methods of forming backside connections on a wafer stack
07/28/2005US20050162950 Stacked layered type semiconductor memory device
07/28/2005US20050162946 Stacked layered type semiconductor memory device
07/28/2005US20050162093 Light tube and power supply circuit
07/28/2005US20050161837 Chip and multi-chip semiconductor device using thereof and method for manufacturing same
07/28/2005US20050161833 Semiconductor device and method of manufacturing the same
07/28/2005US20050161823 Semiconductor device
07/28/2005US20050161803 Semiconductor device and method of fabricating the same
07/28/2005US20050161799 Semiconductor device having conducting portion of upper and lower conductive layers, and method of fabricating the same
07/28/2005US20050161797 Multiple die interconnect system
07/28/2005US20050161796 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
07/28/2005US20050161794 Semiconductor device, method for manufacturing the semiconductor device and semiconductor substrate
07/28/2005US20050161793 Semiconductor device and stacked semiconductor device that can increase flexibility in designing a stacked semiconductor device
07/28/2005US20050161792 Junction member and multichip package using same
07/28/2005US20050161791 Multiple die-spacer for an integrated circuit
07/28/2005US20050161790 Stacked IC
07/28/2005US20050161785 Semiconductor device
07/28/2005US20050161782 Hybrid integrated circuit device and manufacturing method of the same
07/28/2005US20050161781 Hybrid integrated circuit device and manufacturing method thereof
07/28/2005US20050161778 Power module and power module assembly
07/28/2005US20050161686 Display device and display unit using the same
07/28/2005US20050161683 White light emitting diode and method for manufacturing the same
07/28/2005US20050161682 Light emitting diodes packaged for high temperature operation
07/28/2005US20050161492 Method of manufacturing mounting boards
07/28/2005US20050161078 Solar cell mechanical interconnection using direct wafer bonding
07/28/2005US20050161075 Solar panel and production method therefor
07/28/2005US20050161073 Positioning system for portable solar panels
07/28/2005DE10361397A1 Bildaufnahmevorrichtung Imaging device
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