Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
08/2005
08/18/2005US20050181543 Semiconductor package module and manufacturing method thereof
08/18/2005US20050181542 Single mask via method and device
08/18/2005US20050181539 Semiconductor device and method of manufacturing same
08/18/2005US20050180698 Light transmitting modules with optical power monitoring
08/18/2005US20050180679 Optoelectronic hybrid integrated module and light input/output apparatus having the same as component
08/18/2005US20050180161 Illumination apparatus and image projection apparatus using the illumination apparatus
08/18/2005US20050180122 Electronic circuit module
08/18/2005US20050179128 Semiconductor device with capacitor
08/18/2005US20050179127 Stack MCP and manufacturing method thereof
08/18/2005US20050179122 IC card
08/18/2005US20050179120 Process for producing semiconductor device, semiconductor device, circuit board and electronic equipment
08/18/2005US20050179057 System semiconductor device and method of manufacturing the same
08/18/2005US20050179044 Method for producing a display unit
08/18/2005US20050179043 Apparatus for producing a display unit
08/18/2005US20050178430 Rigid integrated photovoltaic roofing membrane and related methods of manufacturing same
08/18/2005US20050178429 Flexible integrated photovoltaic roofing membrane and related methods of manufacturing same
08/18/2005US20050178428 Photovoltaic system and method of making same
08/18/2005US20050178427 Hydrogen generator photovoltaic electrolysis reactor system
08/18/2005DE202005007501U1 Vehicle light, consists of at least one light diode chip mechanically and electrically fixed to a circuit board
08/18/2005DE19854180B4 Modulgehäuse für Halbleiterbauteile Module housing for semiconductor devices
08/18/2005DE19835453B4 Verfahren zum Messen der Temperatur eines Leistungshalbleiters und Bauelement A method for measuring the temperature of a power semiconductor component and
08/18/2005DE102005002767A1 Halbleiteranordnung Semiconductor device
08/18/2005DE102004039906A1 Electronic component with a number of integrated members, is formed by producing members with a surface that contains a circuit, and connecting components using bond wires
08/18/2005DE10009733B4 Halbleitervorrichtung und Verfahren zum Herstellen derselben A semiconductor device and method of manufacturing the same
08/17/2005EP1564819A1 Light-emitting diode
08/17/2005EP1563552A1 Optoelectronic component comprising an electroconductive organic material, and method for producing said component
08/17/2005EP0859686B1 Fabricating interconnects and tips using sacrificial substrates
08/17/2005CN1656860A Flexible interconnect structures for electrical devices and light sources incorporating the same
08/17/2005CN1656433A Providing in package power supplies for integrated circuits
08/17/2005CN1655354A IGBT module
08/17/2005CN1655353A Stack MCP and manufacturing method thereof
08/17/2005CN1655333A Multiple chip packaging arrangement
08/17/2005CN1215557C Semiconductor device
08/17/2005CN1215556C Freely integrating holder for power semiconductor
08/17/2005CN1215542C Semiconductor device and its making method
08/17/2005CN1215537C Elements with resin shell capsulation
08/17/2005CA2496125A1 Flexible integrated photovoltaic roofing membrane and related methods of manufacturing same
08/16/2005US6930879 Electronic module
08/16/2005US6930396 Semiconductor device and method for manufacturing the same
08/16/2005US6930385 Cascaded die mountings with spring-loaded contact-bond options
08/16/2005US6930382 Semiconductor device and method of manufacturing the same
08/16/2005US6930378 Stacked semiconductor die assembly having at least one support
08/16/2005US6930373 Circuit arrangement
08/16/2005US6930334 High frequency semiconductor device
08/16/2005US6930332 Light emitting device using LED
08/16/2005US6930303 Linear light source and reading light exposure apparatus
08/16/2005US6930238 Solar cell module-mounting structure and solar cell module array
08/16/2005US6929976 Multi-die module and method thereof
08/16/2005US6929970 Process for preparing nano-porous metal oxide semiconductor layers
08/11/2005WO2005074029A1 Module and mounting structure using the same
08/11/2005WO2005048347A3 Power module
08/11/2005WO2005041257A3 Wireless coupling of stacked dies within system in package
08/11/2005WO2005038910A3 Three-dimensional integrated circuit with integrated heat sinks
08/11/2005WO2004034434A3 Components, methods and assemblies for multi-chip packages
08/11/2005US20050176380 Radio frequency circuit module
08/11/2005US20050176235 Manufacturing method of semiconductor device
08/11/2005US20050176175 Method of manufacturing hybrid integrated circuit device
08/11/2005US20050176174 Methodof making an integrated circuit
08/11/2005US20050176171 Semiconductor device and its manufacturing method
08/11/2005US20050174544 LED light sources for image projection systems
08/11/2005US20050174049 Light-emitting structures
08/11/2005US20050173813 Electronic component and fabricating method
08/11/2005US20050173808 Electronic component and fabricating method
08/11/2005US20050173807 High density vertically stacked semiconductor device
08/11/2005US20050173797 Electronic component and fabricating method
08/11/2005US20050173789 Ultra-thin wafer level stack packaging method and structure thereof
08/11/2005US20050173784 Stacked semiconductor device having mask mounted in between stacked dies
08/11/2005US20050173783 Semiconductor package with passive device integration
08/11/2005US20050173713 Multi-pin light-emitting diode device
08/11/2005DE102005003378A1 Vorrichtung zur Erkennung ionisierender Strahlung A device for detecting ionizing radiation
08/11/2005DE102005002631A1 Multi-chip pack consists of a substrate with numerous contact points, and primary and secondary semiconductor chips
08/11/2005DE102004062194A1 Integrierte Halbleiterschaltungs-Vorrichtung A semiconductor integrated circuit device
08/11/2005DE102004019443B3 Power module has passive semiconductor chip arranged above active semiconductor chip on second film in close contact with surfaces of planar conducting tracks and first film of insulating material with planar conducting tracks
08/11/2005DE10009171B4 Stromrichter und sein Herstellverfahren Converter and its manufacturing method
08/10/2005EP1562277A1 Three-phase ac generator for vehicle
08/10/2005EP1561246A1 Light emitting device
08/10/2005CN2717026Y Multi-chip packaging structure LED
08/10/2005CN2717024Y DC/AC dual-purpose bridge type lighting LED
08/10/2005CN1653623A Power source device
08/10/2005CN1653297A High efficiency solid-state light source and methods of use and manufacture
08/10/2005CN1652663A Stereoscopic electronic circuit device, and relay board and relay frame used therein
08/10/2005CN1652445A Power inverter
08/10/2005CN1652341A Optical device
08/10/2005CN1652335A Stacking packaging structure for light sensitive chips and semiconductor chips
08/10/2005CN1652334A Chip stage package for integrated multi-chip
08/10/2005CN1652333A High frequency circuit module
08/10/2005CN1652332A Electronic assembly stacking structure
08/10/2005CN1652316A Method for mfg multi-layer package
08/10/2005CN1652302A Conductive bond for through-wafer interconnect
08/10/2005CN1214462C Vertical electrical interconnections in stack
08/09/2005US6928144 Guard ring for direct photo-to-electron conversion detector array
08/09/2005US6927969 Circuit arrangement
08/09/2005US6927497 Multi-die semiconductor package
08/09/2005US6927484 Stack arrangement of a memory module
08/09/2005US6927431 Semiconductor circuit constructions
08/09/2005US6927382 Optical excitation/detection device and method for making same using fluidic self-assembly techniques
08/09/2005US6927096 Method of manufacturing a semiconductor device
08/09/2005US6927085 Web fabrication of devices
08/04/2005WO2005071759A1 Light-receiving module
08/04/2005WO2005071743A1 Semiconductor package and semiconductor device
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