Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
09/2005
09/01/2005US20050189549 High speed optical subassembly with ceramic carrier
09/01/2005US20050189548 Optical transmission module
09/01/2005US20050189140 Chip package structure
09/01/2005DE19920445B4 Stapelbaustein aus Halbleiterbausteinen mit integrierter Schaltung ultrahoher Dichte sowie Verfahren zum Herstellen desselben Stack of the same block of semiconductor integrated circuit chips, as well as ultra-high density method for producing
09/01/2005DE102004053958B3 Device for detecting electromagnetic radiation, especially sunlight, for use in vehicle, has metal core conducting plate with region(s) inclined to its plane, at least one optoelectronic component arranged in inclined region
09/01/2005DE102004005666A1 High frequency arrangement for data medium e.g. chip card, has semiconductor body with charge storage made using trench technology and two contact points that are connected to respective pins of another body having integrated circuit
08/2005
08/31/2005EP1569467A2 Illumination system with aligned leds
08/31/2005EP1569276A1 Micro-optics on optoelectronics
08/31/2005EP1568158A1 Bidirectional emitting and receiving module
08/31/2005EP1568076A2 Composite leadframe led package and method of making the same
08/31/2005CN2722442Y Improved LED light
08/31/2005CN2722441Y LED light with high brightness
08/31/2005CN2722034Y LED illuminator
08/31/2005CN2722029Y Impact-proof effective light with long service life
08/31/2005CN1663120A Electronic component comprising a multilayer substrate and corresponding method of production
08/31/2005CN1663048A Interlayer dielectric and pre-applied die attach adhesive materials
08/31/2005CN1663044A Lamp and method of producing a lamp
08/31/2005CN1663032A Composition for removing sidewall residues
08/31/2005CN1661825A Luminous device and illuminator
08/31/2005CN1661819A Technique of solder ball for manufacutirng LED
08/31/2005CN1661788A Integrated circuit package provided with cooperatively arranged illumination and sensing capabilities
08/31/2005CN1661722A 半导体器件 Semiconductor devices
08/31/2005CN1217422C Receiving optics and photosemiconductor device having the same
08/31/2005CN1217409C Insulating grid bipolar transistor modular block capable of preventing short circuit
08/30/2005US6937477 Structure of gold fingers
08/30/2005US6937037 Probe card assembly for contacting a device with raised contact elements
08/30/2005US6936930 Thermal enhance MCM package
08/30/2005US6936922 Semiconductor package structure reducing warpage and manufacturing method thereof
08/30/2005US6936914 Integrated circuit chip module
08/30/2005US6936913 High performance vias for vertical IC packaging
08/30/2005US6936874 Semiconductor apparatus having a large-size bus connection
08/30/2005US6936862 Light emitting diode package
08/30/2005US6936856 Multi substrate organic light emitting devices
08/30/2005US6936833 Semiconductor device package having a switcher connecting plural processing elements
08/30/2005US6936808 Semiconductor device, optoelectronic board, and production methods therefor
08/30/2005US6936532 Substrate having a plurality of bumps, method of forming the same, and method of bonding substrate to another
08/30/2005US6936500 Method for the lateral contacting of a semiconductor chip
08/30/2005US6936497 Method of forming electronic dies wherein each die has a layer of solid diamond
08/30/2005US6936495 Method of making an optoelectronic semiconductor package device
08/25/2005WO2005078808A1 Photovoltaic system and method of making same
08/25/2005WO2005078797A1 Semiconductor device
08/25/2005WO2005078796A1 Electronic component and method for manufacturing the same
08/25/2005WO2005078795A1 Electronic circuit
08/25/2005WO2005078793A1 Method for producing a power module and corresponding power module
08/25/2005WO2005078488A1 Light transmitting modules with optical power monitoring
08/25/2005WO2005011099A3 Switching device, generator-motor apparatus using switching device, drive system including generator-motor apparatus, and computer-readable recording medium on which a program for directing computer to perform control of generator-motor apparatus is recorded
08/25/2005WO2005008765A3 Semiconductor power module with strip conductors which are detached from a substrate as external connections
08/25/2005WO2005000733A3 Integrated circuit on high performance chip
08/25/2005US20050186763 Transferring semiconductor crystal from a substrate to a resin
08/25/2005US20050186712 Method and apparatus for fabricating self-assembling microstructures
08/25/2005US20050186710 Integrated circuit package provided with cooperatively arranged illumination and sensing capabilities
08/25/2005US20050186706 Methods of forming semiconductor circuitry
08/25/2005US20050186705 Semiconductor dice having backside redistribution layer accessed using through-silicon vias, methods
08/25/2005US20050184401 Wiring substrate, manufacturing method thereof, and semiconductor device
08/25/2005US20050184400 Method and structure for interfacing electronic devices
08/25/2005US20050184399 Packaged systems with MRAM
08/25/2005US20050184398 Daisy chaining of serial I/O interface on stacking devices
08/25/2005US20050184387 Ceramic substrate for a light emitting diode where the substrate incorporates ESD protection
08/25/2005US20050184383 Packaging of solid state devices
08/25/2005US20050184379 Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device
08/25/2005US20050184378 Semiconductor device package of stacked semiconductor chips
08/25/2005US20050184377 Semiconductor device and method of manufacturing the same
08/25/2005US20050184376 System in package
08/25/2005US20050184375 Electronic device configured as a multichip module, leadframe and panel with leadframe positions
08/25/2005US20050184373 Semiconductor device and fabrication method for the same
08/25/2005US20050184370 Embedded heat spreader for folded stacked chip-scale package
08/25/2005US20050184301 Multiple ranging apparatus
08/25/2005DE10306643B4 Anordnung in Druckkontaktierung mit einem Leistungshalbleitermodul Arrangement in pressure contact with a power semiconductor module
08/25/2005DE102005001851A1 Multichip package has pad of one semiconductor chip electrically connected to spacer pad which is connected to substrate bonding pad
08/25/2005DE102004003275A1 Verbindungselemente auf Halbleiterchips für Halbleiterbauteile und Verfahren zur Herstellung derselben Connecting elements on semiconductor chips for semiconductor devices and method of manufacturing the same
08/25/2005CA2554494A1 Photovoltaic system and method of making same
08/24/2005EP1565939A1 Semiconductor device having a bond pad and method for its fabrication
08/24/2005EP1565937A1 Power semiconductor module
08/24/2005EP1192627A4 Methods to implement sealing and electrical connections to single cell and multi-cell regenerative photoelectrochemical devices
08/24/2005EP0948810B1 Bump-bonded semiconductor imaging device
08/24/2005CN2720249Y Ball-shape luminous diode lamp-bulb of filament lamp
08/24/2005CN1658736A 电路装置 Circuit means
08/24/2005CN1658377A Method and apparatus for filling vias
08/24/2005CN1216423C Semiconductor device and its production method
08/23/2005US6933715 Sensor system for sensing movement
08/23/2005US6933616 has outward extension portions of under bump metallurgies (UBM) for satisfying the bonding area requirement during wire bonding operation
08/23/2005US6933613 Flip chip ball grid array package
08/23/2005US6933605 Semiconductor package
08/23/2005US6933604 Semiconductor device, semiconductor module and hard disk
08/23/2005US6933598 Semiconductor stacked multi-package module having inverted second package and electrically shielded first package
08/23/2005US6933597 Spacer with passive components for use in multi-chip modules
08/23/2005US6933593 Power module having a heat sink
08/23/2005US6933587 Electronic circuit unit suitable for miniaturization
08/23/2005US6933209 Stacking memory chips using flat lead-frame with breakaway insertion pins and pin-to-pin bridges
08/23/2005US6933208 Method of forming wiring, and method of arranging devices and method of manufacturing image display system by using the same
08/23/2005US6931725 Circuit component built-in module, radio device having the same, and method for producing the same
08/18/2005WO2005076372A1 Optical communication module
08/18/2005WO2005076353A2 Apparatus incorporating small-feature-size and large-feature-size components and method for making same
08/18/2005WO2005076352A1 Semiconductor device and method for manufacturing semiconductor device
08/18/2005WO2005076319A2 Semiconductor component comprising a semiconductor chip stack on a wiring frame and method for producing the same
08/18/2005WO2005045902A3 Semiconductor device and manufacturing method thereof
08/18/2005WO2005022588A3 Semiconductor component comprising a rewiring layer, and method for the production thereof
08/18/2005US20050181597 Method of forming wiring
08/18/2005US20050181548 Method of manufacturing a display panel
08/18/2005US20050181546 Methods for fabricating fuse programmable three dimensional integrated circuits
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