| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 09/14/2005 | EP1573816A2 Electrical connection of optoelectronic devices |
| 09/14/2005 | EP1573815A1 Integrated circuit assembly |
| 09/14/2005 | EP1573813A2 Rf power transistor with internal bias feed |
| 09/14/2005 | EP1573799A1 Three-dimensional device fabrication method |
| 09/14/2005 | CN2726111Y Packaging assembly for stacked integrated circuit |
| 09/14/2005 | CN2725700Y LED lampbulb for festival colour lamp |
| 09/14/2005 | CN1669141A Multi-configuration processor-memory substrate device |
| 09/14/2005 | CN1669139A Semiconductor devices with wire bond inductor and method |
| 09/14/2005 | CN1669099A Surface-mountable component and method for the production thereof |
| 09/14/2005 | CN1667844A Side emitting type colored light-emitting diode packaging arrangement |
| 09/14/2005 | CN1667824A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 09/14/2005 | CN1667421A Sensor device |
| 09/14/2005 | CN1219331C Lighting or light-receiving semiconductor module and method of its manufacture |
| 09/13/2005 | US6944073 Semiconductor integrated circuit device |
| 09/13/2005 | US6943581 Test methodology for direct interconnect with multiple fan-outs |
| 09/13/2005 | US6943454 Memory module |
| 09/13/2005 | US6943445 Semiconductor device having bridge-connected wiring structure |
| 09/13/2005 | US6943443 Electronic circuit device including metallic member having installation members |
| 09/13/2005 | US6943442 Electronic parts packaging structure having mutually connected electronic parts that are buried in a insulating film |
| 09/13/2005 | US6943438 loop height of the bonding wire is secured by adhesive spacers; multiple memory chips can be stacked; molded body without a separate lid; data storage media |
| 09/13/2005 | US6943430 Semiconductor wafer having electrically connected passive device chips, passive devices and semiconductor package using the same |
| 09/13/2005 | US6943378 Opto-coupler |
| 09/13/2005 | US6943294 Integrating passive components on spacer in stacked dies |
| 09/13/2005 | US6943293 High power electronic package with enhanced cooling characteristics |
| 09/13/2005 | US6943067 Three-dimensional integrated semiconductor devices |
| 09/13/2005 | US6942360 Methods and apparatus for an LED light engine |
| 09/09/2005 | WO2005083805A1 Led light source |
| 09/09/2005 | WO2005083803A2 Light-emitting diode arrangement for a high-power light-emitting diode, and method for producing a light-emitting diode arrangement |
| 09/09/2005 | WO2005083801A1 Hydrogen generator photovoltaic electrolysis reactor system |
| 09/09/2005 | WO2005083789A2 Micro-optics on optoelectronics |
| 09/09/2005 | WO2005065336A3 High-frequency chip packages |
| 09/09/2005 | WO2005047859A3 Flat-panel detector utilizing electrically interconnecting tiled photosensor arrays |
| 09/08/2005 | US20050197799 Temperature detection method of semiconductor device and power conversion apparatus |
| 09/08/2005 | US20050196524 Producing flexible active matrix displays; using fluidic self assembly on continuous web material; dispensing slurry containing shaped objects |
| 09/08/2005 | US20050195574 Heat sink |
| 09/08/2005 | US20050194850 Electronic package for electrical machine |
| 09/08/2005 | US20050194695 Method of assembling chips |
| 09/08/2005 | US20050194694 Semiconductor device |
| 09/08/2005 | US20050194676 Resin-encapsulated semiconductor device and lead frame, and method for manufacturing the same |
| 09/08/2005 | US20050194674 Integrated circuit with re-route layer and stacked die assembly |
| 09/08/2005 | US20050194673 Multi-chip package, a semiconductor device used therein and manufacturing method thereof |
| 09/08/2005 | US20050194671 High frequency semiconductor device |
| 09/08/2005 | US20050194663 Optical semiconductor device |
| 09/08/2005 | US20050194660 IGBT module |
| 09/08/2005 | US20050194606 Transferring semiconductor crystal from a substrate to a resin |
| 09/08/2005 | DE202005008232U1 Electrical connection arrangement for electronic appliances has piezoelectric plates on a circuit board with individual anodes and a common cathode supplying the plates |
| 09/08/2005 | DE202005008231U1 Connecting element for an electric connection with an electrode on a piezoelectric board (PB) acts as an element to link the PB to a printed circuit board underneath the PB |
| 09/08/2005 | DE10251863B4 Stromverteilerkasten und Leistungsgerätemodul Power Distribution Box and Power Equipment Module |
| 09/08/2005 | DE102004042798A1 IGBT-Baugruppe IGBT module |
| 09/08/2005 | DE102004042366B3 Semiconductor module comprises a substrate with one or more semiconductor components, and a housing connected to the substrate with an adhesive |
| 09/08/2005 | DE102004007009A1 Verfahren zur Herstellung eines Leistungsmoduls und Leistungsmodul A process for producing a power module and the power module |
| 09/07/2005 | EP1571707A2 Semiconductor device temperature detection method and power conversion apparatus |
| 09/07/2005 | EP1570572A1 Single package multi-chip rf power amplifier |
| 09/07/2005 | EP1570530A1 Solar panel and production method therefor |
| 09/07/2005 | EP1570513A2 Microelectronic packaging and components |
| 09/07/2005 | EP1412966A4 Multi-wavelength semiconductor laser arrays and applications thereof |
| 09/07/2005 | EP1368823B1 Method of manufacturing optical devices and related improvements |
| 09/07/2005 | EP0960442B1 Method of producing a radiation detector by assembling elementary blocks |
| 09/07/2005 | CN1666340A Design of an insulated cavity |
| 09/07/2005 | CN1665027A 半导体器件 Semiconductor devices |
| 09/07/2005 | CN1665023A Resin-encapsulated semiconductor device and lead frame, and method for manufacturing the same |
| 09/07/2005 | CN1664522A Temperature detection method of semiconductor device and power conversion apparatus |
| 09/07/2005 | CN1218482C Semiconductor integrated circuit and its multi-slice package |
| 09/07/2005 | CN1218390C 半导体装置和半导体模块 Semiconductor device and semiconductor module |
| 09/07/2005 | CN1217810C Flexible LED multiple module for lamp shell of vehicle |
| 09/06/2005 | US6940729 Integrated circuit stacking system and method |
| 09/06/2005 | US6940724 DC-DC converter implemented in a land grid array package |
| 09/06/2005 | US6940189 System and method for integrating a digital core with a switch mode power supply |
| 09/06/2005 | US6940175 Semiconductor device in which a plurality of electronic components are combined with each other |
| 09/06/2005 | US6940164 Power module |
| 09/06/2005 | US6940162 Semiconductor module and mounting method for same |
| 09/06/2005 | US6940136 Circuit arrangement with semiconductor elements arranged in chips |
| 09/06/2005 | US6940009 composed of upper/lower conductive layer or mesh and intermediate semiconductor layers composed of a mixture of silicon, mercury and silver nitrate |
| 09/06/2005 | US6939743 Split-gate power module and method for suppressing oscillation therein |
| 09/06/2005 | US6939740 Method of fabricating an encapsulated semiconductor device with partly exposed leads |
| 09/06/2005 | US6939729 Method of transferring a device, a method of producing a device holding substrate, and a device holding substrate |
| 09/06/2005 | US6939188 LED lamp configured to minimize image contrast |
| 09/06/2005 | US6938333 Method of manufacturing a metal-ceramic circuit board |
| 09/01/2005 | WO2005081316A2 Semiconductor component comprising an interposer substrate and method for the production thereof |
| 09/01/2005 | WO2005081315A2 Semiconductor component comprising a stack of semiconductor chips and method for producing the same |
| 09/01/2005 | WO2005081314A2 Optimisation of the number of power outputs for an integrated circuit |
| 09/01/2005 | WO2005081311A1 Circuit device and manufacturing method thereof |
| 09/01/2005 | WO2005064673A3 Integrating passive components on spacer in stacked dies |
| 09/01/2005 | WO2004110113A3 Electrical devices embedded in printed circuit boards |
| 09/01/2005 | WO2003065630A3 Apparatus and method for preventing digital media piracy |
| 09/01/2005 | US20050191791 Methods for dicing wafer stacks to provide access to interior structures |
| 09/01/2005 | US20050190808 Optoelectric composite substrate and method of manufacturing the same |
| 09/01/2005 | US20050190624 Semiconductor device |
| 09/01/2005 | US20050190562 Illumination system with aligned LEDs |
| 09/01/2005 | US20050190528 Electronic component, method of manufacturing the electronic component, and electronic apparatus |
| 09/01/2005 | US20050189641 Semiconductor package |
| 09/01/2005 | US20050189640 Interconnect system without through-holes |
| 09/01/2005 | US20050189639 Semiconductor device |
| 09/01/2005 | US20050189636 Packaging substrates for integrated circuits and soldering methods |
| 09/01/2005 | US20050189634 Semiconductor module and method of manufacturing thereof |
| 09/01/2005 | US20050189633 Chip package structure |
| 09/01/2005 | US20050189632 Sealed three dimensional metal bonded integrated circuits |
| 09/01/2005 | US20050189623 Multiple die package |
| 09/01/2005 | US20050189555 Light-emitting device having light-reflecting layer on power substrate |
| 09/01/2005 | US20050189551 High power and high brightness white LED assemblies and method for mass production of the same |