Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
09/2005
09/28/2005CN1674263A 半导体器件 Semiconductor devices
09/28/2005CN1674219A Semiconductor device and multi-layer substrate used for the same semiconductor device
09/28/2005CN1221033C Semiconductor light emitting element formed no a clear or translucent substrate
09/28/2005CN1221029C High frequency semiconductor device
09/28/2005CN1220990C Method for producing nano composite magnet by spray method
09/27/2005US6950305 Overmolded device with contoured surface
09/27/2005US6949880 Encapsulation for organic LED device
09/27/2005US6949835 Semiconductor device
09/27/2005US6949834 Stacked semiconductor package with circuit side polymer layer
09/27/2005US6949826 High density semiconductor package
09/27/2005US6949823 Method and apparatus for high electrical and thermal performance ball grid array package
09/27/2005US6949818 Semiconductor package and structure thereof
09/27/2005US6949772 LED illumination apparatus and card-type LED illumination source
09/27/2005US6949407 Castellation wafer level packaging of integrated circuit chips
09/27/2005US6949400 Ultrasonic slitting of photovoltaic cells and modules
09/27/2005US6948863 Optical module and optical transceiver module
09/22/2005US20050208914 High frequency circuit block unit, method for producing same, high frequency module device and method for producing same
09/22/2005US20050208750 Method of making cascaded die mountings with springs-loaded contact-bond options
09/22/2005US20050208701 Semiconductor chip packaging method with individually placed film adhesive pieces
09/22/2005US20050208700 Die to substrate attach using printed adhesive
09/22/2005US20050207697 Method of manufacturing an opto-coupler
09/22/2005US20050207165 LED illumination apparatus and card-type LED illumination source
09/22/2005US20050206807 Providing optical elements over emissive displays
09/22/2005US20050206010 Multi-flip chip on lead frame on over molded IC package and method of assembly
09/22/2005US20050206009 Method for manufacturing wiring board and semiconductor device
09/22/2005US20050206001 Electrical device and method for manufacturing the same
09/22/2005US20050205996 Semiconductor apparatus
09/22/2005US20050205989 Heat dissipation assembly and method for producing the same
09/22/2005US20050205986 Module with integrated active substrate and passive substrate
09/22/2005US20050205983 Semiconductor memory device and multi-chip module comprising the semiconductor memory device
09/22/2005US20050205982 Semiconductor device
09/22/2005US20050205981 Stacked electronic part
09/22/2005US20050205980 Method of sensor packaging
09/22/2005US20050205979 Semiconductor package and method for fabricating the same
09/22/2005US20050205978 Semiconductor package and fabrication method thereof
09/22/2005US20050205975 Semiconductor package having step type die and method for manufacturing the same
09/22/2005US20050205974 Optoelectronic semiconductor component
09/22/2005US20050205970 [package with stacked substrates]
09/22/2005US20050205968 Multi-chip package (MCP) with a conductive bar and method for manufacturing the same
09/22/2005US20050205887 [flip chip light-emitting diode package]
09/22/2005US20050205845 Luminescent material, especially for led application
09/22/2005US20050205785 Imaging device with multiple fields of view incorporating memory-based temperature compensation of an uncooled focal plane array
09/22/2005US20050205126 Photovoltaic conversion device, its manufacturing method and solar energy system
09/22/2005DE202005006332U1 Lighting apparatus has many light diodes on metal carrier and heat dissipating element to transfer generated heat to the lamp fastener
09/22/2005DE10251247B4 Halbleiterbaugruppe mit Halbleiterchip, gebildet unter Verwendung eines Halbleiters mit breitem Bandabstand als Basismaterial A semiconductor package with semiconductor chip formed using a semiconductor with a wide band gap as a base material
09/22/2005DE102004032014A1 Circuit module, has passive component with contact areas, and elastic mechanical connection provided between component and one of semiconductor chips, where one contact area is electrically connected with contact areas of chips
09/22/2005DE102004009082A1 Power MOSFET for motor vehicle technology has vertical power MOSFET in semiconductor body with adjacent temperature sensor over insulation filled cavity
09/22/2005DE102004009056A1 Halbleiterbauteil mit einem Umverdrahtungssubstrat und Verfahren zur Herstellung desselben Of the same semiconductor device with a rewiring substrate and methods for preparing
09/22/2005DE102004008135A1 Halbleiterbauteil mit einem Stapel aus Halbleiterchips und Verfahren zur Herstellung desselben Of the same semiconductor device having a stack of semiconductor chips and processes for making
09/21/2005EP1577948A1 Stacked microelectric module with vertical interconnect vias
09/21/2005CN2727968Y Laminated wafer structure
09/21/2005CN1672473A Method for manufacturing board with built-in device and board with built-in device, and method for manufacturing printed wiring board and printed wiring board
09/21/2005CN1672259A Method and apparatus for electronically aligning capacitively coupled chip pads
09/21/2005CN1670970A Photoelectric semiconductor component
09/21/2005CN1670955A 半导体器件 Semiconductor devices
09/21/2005CN1670936A Semiconductor device
09/21/2005CN1220285C Light emitting device using LED
09/21/2005CN1220277C Light emitting or light sensitive semiconductor assembly and method for manufacturing the same
09/21/2005CN1220263C Semiconductor chip, semiconductor IC and method for selecting semiconductor chip
09/21/2005CN1220260C Semiconductor device and making method, and printing mask
09/20/2005US6948137 Semiconductor integrated device
09/20/2005US6946774 Segmented uniform energy megasonic transducer
09/20/2005US6946747 Semiconductor device and its manufacturing method
09/20/2005US6946741 Semiconductor device and manufacturing method thereof
09/20/2005US6946740 High power MCM package
09/20/2005US6946661 Methods and apparatus for X-ray image detector assemblies
09/20/2005US6946601 Electronic package with passive components
09/20/2005US6946384 Stacked device underfill and a method of fabrication
09/20/2005US6946328 Method for manufacturing semiconductor devices
09/20/2005US6946325 Methods for packaging microelectronic devices
09/20/2005US6946323 Semiconductor package having one or more die stacked on a prepackaged device and method therefor
09/20/2005US6946322 Large area printing method for integrating device and circuit components
09/20/2005US6946306 Method of manufacturing a semiconductor device and a fabrication apparatus for a semiconductor device
09/20/2005US6945707 Three-dimensional mounted assembly and optical transmission device
09/20/2005CA2160242C Three dimensional package for monolithic microwave/millimeterwave integrated circuits
09/15/2005WO2005086255A1 Large-area photovoltaic devices and methods of making same
09/15/2005WO2005086235A2 Base semi-conductor component for a semi-conductor component stack and method for the production thereof
09/15/2005WO2005086234A1 Multiple stacked die window csp package and method of manufacture
09/15/2005WO2005086216A1 Semiconductor element and semiconductor element manufacturing method
09/15/2005WO2005013363A3 Circuit arrangement placed on a substrate and method for producing the same
09/15/2005US20050202595 Thin-film semiconductor device and method of manufacturing the same
09/15/2005US20050202592 Semiconductor stacked die devices and methods of forming semiconductor stacked die devices
09/15/2005US20050201175 Radio frequency arrangement, method for producing a radio frequency arrangement and use of the radio frequency arrangement
09/15/2005US20050200413 Flexible substrate and electronic equipment
09/15/2005US20050200006 Semiconductor package and fabrication method thereof
09/15/2005US20050200005 Semiconductor device, semiconductor package, and method for testing semiconductor device
09/15/2005US20050200003 Multi-chip package
09/15/2005US20050199999 Semiconductor device
09/15/2005US20050199994 Semiconductor apparatus and method for manufacturing semiconductor apparatus
09/15/2005US20050199989 Semiconductor device and manufacturing method thereof
09/15/2005US20050199988 Sensor device
09/15/2005US20050199834 Radiographic apparatus and control method therefor
09/15/2005US20050199278 Ventilated photovoltaic module frame
09/15/2005DE102004029361B3 Structure for building cars has two electric/electromechanical components interlinked via connector lugs on a lead frame common to both components
09/15/2005DE102004009284A1 Leuchtdioden-Anordnung für eine Hochleistungs-Leuchtdiode und Verfahren zur Herstellung einer Leuchtdioden-Anordnung Light emitting diode assembly for a high-power light emitting diode and method of manufacturing a light emitting diode assembly
09/15/2005DE102004008208A1 Power semiconductor module, has substrate pre-resistance integrated in supply line extending via conductive track and current supply point to substrate
09/15/2005DE102004007991A1 Switching device e.g. for motor in motor vehicle, comprises diode for reverse polarity protection integrated as additional pn-junction or Schottky contact in semiconductor switch
09/14/2005EP1575151A1 Rectifier of ac generator for vehicle and method for manufacturing the same
09/14/2005EP1575092A2 Reduced area images devices incorporated within surgical instruments
09/14/2005EP1573885A1 Alternator in connection with a remotely-cooled rectifier
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