Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
09/2014
09/11/2014US20140252613 Semiconductor device
09/11/2014US20140252606 Integrated circuit, multicore processor apparatus, and method for manufacturing integrated circuit
09/11/2014US20140252605 Semiconductor package and method of fabricating the same
09/11/2014US20140252561 Via-enabled package-on-package
09/11/2014US20140252524 Array of mutually isolated, geiger-mode, avalanche photodiodes and manufacturing method thereof
09/11/2014DE112013000405T5 Film-Interposer für integrierte Schaltkreise Film interposer for integrated circuits
09/11/2014DE112012005472T5 Elektrische Leistungs-Halbleitervorrichtung und Verfahren zu deren Herstellung Electrical power semiconductor device and process for their preparation
09/11/2014DE112011105892T5 Verpackungssubstrat für einen aktiven Chip und Verfahren zu dessen Herstellung Packaging substrate for an active chip and process for its preparation
09/11/2014DE102014103050A1 Halbleiter-Bauelement und Verfahren zu dessen Herstellung A semiconductor device and method for its production
09/11/2014DE102010054781B4 Modul zur Reduzierung von thermomechanischem Stress und Verfahren zu dessen Herstellung Module to reduce thermo-mechanical stress and process for its preparation
09/11/2014DE102006006421B4 Leistungshalbleitermodul The power semiconductor module
09/10/2014EP2775524A1 Semiconductor device
09/10/2014EP2775523A1 Chip on chip attach (passive IPD and PMIC) flip chip BGA using new cavity BGA substrate
09/10/2014EP2775512A2 Semiconductor devices
09/10/2014EP2774178A1 Power stack structure and method
09/09/2014US8832631 Integrated circuit apparatus, systems, and methods
09/09/2014US8830691 Printed circuit board and method of manufacturing printed circuit board
09/09/2014US8829986 Structure and method for integrated synaptic element
09/09/2014US8829780 White semiconductor light emitting device
09/09/2014US8829776 Light-source circuit unit, illumination device, and display device
09/09/2014US8829689 Module substrate with feature for replacement of faulty chips, semiconductor module having the same, and method for manufacturing the semiconductor module
09/09/2014US8829686 Package-on-package assembly including adhesive containment element
09/09/2014US8829684 Integrated circuit package
09/09/2014US8829677 Semiconductor die having fine pitch electrical interconnects
09/09/2014US8829665 Semiconductor chip and stack package having the same
09/09/2014US8829656 Semiconductor package including interposer with through-semiconductor vias
09/09/2014US8829655 Semiconductor package including a substrate and an interposer
09/09/2014US8829654 Semiconductor package with interposer
09/09/2014US8829551 TL retrofit LED module inside sealed glass tube
09/09/2014US8829546 Rare earth doped layer or substrate for light conversion
09/09/2014US8829537 Integrated apparatus including driver chips, a power supply and LED chips on an isolative substrate
09/09/2014US8829534 Power semiconductor device
09/09/2014US8829362 Electronic device having member which functions as ground conductor and radiator
09/09/2014US8828798 Semiconductor die assemblies, semiconductor devices including same, and methods of fabrication
09/09/2014US8828797 Process for assembling two parts of a circuit
09/09/2014US8827495 Light-emitting device
09/09/2014US8827488 OLED display architecture
09/04/2014WO2014133883A1 High quality factor inductor implemented in wafer level packaging (wlp)
09/04/2014WO2014133374A1 Solid-state sources of light for preferential colour rendition
09/04/2014WO2014131152A1 Semiconductor device including alternating stepped semiconductor die stacks
09/04/2014US20140248742 Multi-chip package having a substrate with a plurality of vertically embedded die and a process of forming the same
09/04/2014US20140248741 Package-on-package assembly and method
09/04/2014US20140248723 Wafer scale packaging platform for transceivers
09/04/2014US20140247572 Printed circuit board
09/04/2014US20140247525 Flexible, space-efficient I/O circuitry for integrated circuits
09/04/2014US20140246788 Stack-type semiconductor package
09/04/2014US20140246787 Semiconductor apparatus
09/04/2014US20140246781 Semiconductor device, method of forming a packaged chip device and chip package
09/04/2014US20140246767 Semiconductor device and method of assembling same
09/04/2014DE112012005457T5 Halbleitervorrichtung Semiconductor device
09/04/2014DE112012005226T5 Leistungshalbleitermodul und Leistungsmodul The power semiconductor module and power module
09/04/2014DE10394239B4 Verfahren zum Verpacken integrierter Schaltungen und integriertes Schaltungsgehäuse A method of packaging of integrated circuits and integrated circuit package
09/04/2014DE102013203666A1 Leuchtband mit bandförmigem Substrat Light band with band-shaped substrate
09/03/2014EP2772938A1 Light emitting diode backlight module field of the invention
09/02/2014US8824163 RF layered module using three dimensional vertical wiring and disposing method thereof
09/02/2014US8824159 Three dimensional structure memory
09/02/2014US8823409 Semiconductor apparatus and method of testing and manufacturing the same
09/02/2014US8823187 Semiconductor package, semiconductor package manufacturing method and semiconductor device
09/02/2014US8823184 Optoelectronic device and method for the production thereof
09/02/2014US8823183 Bump for semiconductor package, semiconductor package having bump, and stacked semiconductor package
09/02/2014US8823181 Stack semiconductor apparatus having a through silicon via and method of fabricating the same
09/02/2014US8823171 Semiconductor package, semiconductor device having the same, and method of manufacturing the same
09/02/2014US8823161 Semiconductor chip, semiconductor package, and method for manufacturing semiconductor chip for reducing open failures
09/02/2014US8823160 Integrated circuit package system having cavity
09/02/2014US8823155 Semiconductor device and method of manufacturing the same
09/02/2014US8823151 Semiconductor device
09/02/2014US8823133 Interposer having an inductor
09/02/2014US8823122 Semiconductor and optoelectronic devices
09/02/2014US8823036 Light emitting diode package and light emitting diode system having at least two heat sinks
09/02/2014US8822923 Sensor head for an X-ray detector, X-ray detector with sensor head and sensor arrangement
09/02/2014US8822817 Direct wafer bonding
09/02/2014US8822808 Photoelectric conversion device, method for manufacturing the same, photo sensor and imaging device
09/02/2014US8822281 Semiconductor device and method of forming TMV and TSV in WLCSP using same carrier
09/02/2014US8821768 Bonding method and bonding material using metal particle
09/02/2014US8820960 Light emitting device
08/2014
08/28/2014WO2014130828A1 Package-on-package structures
08/28/2014WO2014129968A1 Optical imaging apparatus, in particular for computational imaging, having further functionality
08/28/2014WO2014128151A1 A silicon devices / heatsinks stack assembly and a method to pull apart a faulty silicon device in said stack assembly
08/28/2014WO2014127450A1 Led light
08/28/2014US20140242779 Semiconductor device manufacturing method and manufacturing apparatus
08/28/2014US20140239515 Semiconductor packages
08/28/2014US20140239513 Enhanced stacked microelectronic assemblies with central contacts
08/28/2014US20140239509 Semiconductor Device and Method of Forming Topside and Bottom-side Interconnect Structures Around Core Die with TSV
08/28/2014US20140239457 Thermal via for 3d integrated circuits structures
08/28/2014US20140239322 Light emitting device array
08/28/2014US20140239321 Lighting Device, Backlight Module And Illumination Module
08/28/2014US20140238485 Method of Bonding Semiconductor Elements and Junction Structure
08/28/2014DE202013104219U9 Rand-Beleuchtung und Direkt-Beleuchtung kombinierendes Hintergrundlichtmodul Edge lighting and direct lighting a combining backlight module
08/28/2014DE112007002446B4 Elektronische Schaltungsvorrichtung und Verfahren zu ihrer Herstellung An electronic circuit apparatus and methods for their preparation
08/28/2014DE102014102692A1 Elektronisches Bauelement Electronic component
08/28/2014DE102014102364A1 Mehrchipbaugruppe mit getrennten zwischenverbindungen zwischen chips Multi-chip module with separate between connections between chips
08/28/2014DE102014102118A1 Halbleiterbauelement Semiconductor device
08/28/2014DE102013203350A1 Elektronisches Bauelement und Verfahren zu seiner Herstellung An electronic device and method for its preparation
08/28/2014DE102013202904A1 Optoelektronisches Halbleiterbauteil und Verfahren zu seiner Herstellung An optoelectronic semiconductor device and process for its preparation
08/28/2014DE102013109532B3 Leistungshalbleitereinrichtung Power semiconductor device
08/27/2014EP2769477A1 Low-profile wireless connectors
08/27/2014EP2769412A1 Microelectronic package with stacked microelectronic units and method for manufacture thereof
08/27/2014EP2769411A1 Package-on-package assembly with wire bond vias
08/27/2014EP2769410A1 Power semiconducter module and power semiconductor module assembly with multiple power semiconducter modules
08/27/2014EP2769409A1 Stub minimization for multi-die wirebond assemblies with orthogonal windows
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