Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
09/2014
09/18/2014WO2014139789A1 Opto-electronic component
09/18/2014WO2014139674A1 Electronic sub-assembly and method for the production of an electronic sub-assembly
09/18/2014US20140273350 Method of fabricating semiconductor multi-chip stack packages
09/18/2014US20140273346 Manufacture of face-down microelectronic packages
09/18/2014US20140273345 Methods for bonding a hermetic module to an electrode array
09/18/2014US20140273315 Methods and ophthalmic devices with organic semiconductor layer
09/18/2014US20140268980 Memory chip package, memory system having the same and driving method thereof
09/18/2014US20140268877 Luminous element, bar-type luminous element and applications thereof
09/18/2014US20140268591 Printing complex electronic circuits
09/18/2014US20140264954 Passivation and warpage correction by nitride film for molded wafers
09/18/2014US20140264946 Package-on-package structure with reduced height
09/18/2014US20140264939 Semiconductor device
09/18/2014US20140264915 Stacked Integrated Circuit System
09/18/2014US20140264910 Interconnect structures with polymer core
09/18/2014US20140264862 Interconnect Structure and Method
09/18/2014US20140264857 Package-on-Package with Via on Pad Connections
09/18/2014US20140264856 Package-on-Package Structures and Methods for Forming the Same
09/18/2014US20140264851 Semiconductor Device and Method of Forming UBM Structure on Back Surface of TSV Semiconductor Wafer
09/18/2014US20140264847 Semiconductor device
09/18/2014US20140264812 Semiconductor package assembly
09/18/2014US20140264811 Package-On-Package with Cavity in Interposer
09/18/2014US20140264810 Packages with Molding Material Forming Steps
09/18/2014US20140264709 Interconnect Structure for Connecting Dies and Methods of Forming the Same
09/18/2014US20140264474 Stacked semiconductor device and method of forming the same related cases
09/18/2014US20140264462 Film transferable logic circuit, and methods for providing film transferable logic circuit
09/18/2014US20140264410 LED with IC Integrated Lighting Module
09/18/2014US20140264406 Led module
09/18/2014US20140264403 Light-emitting module and method of manufacturing a single light-emitting structure thereof
09/18/2014US20140264400 Integrated multi-chip module optical interconnect platform
09/18/2014US20140264399 Semiconductor light emitting device and method of manufacture
09/18/2014US20140264394 Light emitting diode
09/18/2014US20140264340 Reversible hybridization of large surface area array electronics
09/18/2014US20140263970 Actively Aligned Detectors for Optical and Optoelectronic Arrays
09/18/2014US20140262460 Connection Component with Posts and Pads
09/18/2014DE112012003759T5 Halbleitermodul, Schaltungs-Substrat Semiconductor module circuit substrate
09/18/2014DE102014103529A1 Chipanordnung, waferanordnung und verfahren zu deren herstellung Chip arrangement wafer assembly and process for their preparation
09/18/2014DE102014103403A1 Chipbaugruppe und verfahren zum herstellen derselben Chip module and method of manufacturing the same
09/18/2014DE102014103215A1 Verpackte Vorrichtung mit nicht ganzzahligen Anschlussrastern und Verfahren zu deren Herstellung Packaged device with non-integer connection grids and processes for their preparation
09/18/2014DE102014103186A1 Halbleitervorrichtung und Halbleiterpackage Semiconductor device and semiconductor package
09/18/2014DE102013224640A1 Masse-referenziertes-Einzel-Ende-System-auf-Paket Ground-referenced single-end system-on-package
09/18/2014DE102013224638A1 Auf-Paket-Mehr-Prozessor-Masse-referenzierte-Einzel-Ende-Zwischenverbindung In packet-multiprocessor mass-referenced single-end interconnection
09/18/2014DE102013204337A1 Trägerbauteil mit einem Halbleiter-Substrat für elektronische Bauelemente und Verfahren zu dessen Herstellung Carrier component with a semiconductor substrate for electronic components and process for its preparation
09/18/2014DE102013202542A1 Substrat zur Herstellung einer LED und Verfahren zu dessen Herstellung Substrate for LED and process for its preparation
09/18/2014DE102013106965A1 Packaging Mechanismus für Dies mit unterschiedlichen Grössen der Konnektoren Packaging for this mechanism with different sizes of connectors
09/18/2014DE102013106153A1 Zwischenverbindungsstruktur für eine gestapelte Vorrichtung und Verfahren Interconnect structure for a stacked device and method
09/18/2014DE102013103116B3 Leistungshalbleitermodul und Verfahren zur Herstellung eines Leistungshalbleitermoduls The power semiconductor module and method of producing a power semiconductor module
09/18/2014DE102013102621A1 Optoelektronisches Halbleiterbauelement und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements An optoelectronic semiconductor device and method for producing an optoelectronic semiconductor component,
09/18/2014DE102013102556A1 Optoelektronisches Bauteil, Leuchtmodul und Kraftfahrzeugscheinwerfer The optoelectronic device, light module and motor vehicle headlight
09/18/2014DE102008054307B4 Halbleitervorrichtung mit Leistungsvorrichtung A semiconductor device having power device
09/17/2014EP2779238A1 Luminous element, bar-type luminous element and applications thereof
09/17/2014EP2779237A2 A chip arrangement and a method for manufacturing a chip arrangement
09/17/2014EP2779236A2 Magnetic core inductor (MCI) structures for integrated voltage regulators
09/16/2014US8839176 Semiconductor integrated circuit and pattern layouting method for the same
09/16/2014US8839161 Semiconductor device
09/16/2014US8837655 Memory controller with flexible data alignment to clock
09/16/2014US8837168 Electronic package structure
09/16/2014US8837161 Multi-configuration processor-memory substrate device
09/16/2014US8837150 Electronic device for switching currents and method for producing the same
09/16/2014US8836743 Drive device, print head and image forming apparatus
09/16/2014US8836418 High frequency semiconductor switch
09/16/2014US8836148 Interposer for stacked semiconductor devices
09/16/2014US8836147 Bonding structure of multilayer copper bonding wire
09/16/2014US8836146 Chip package and method for fabricating the same
09/16/2014US8836144 Wafer level package structure
09/16/2014US8836143 Chip package with coplanarity controlling feature
09/16/2014US8836140 Three-dimensional vertically interconnected structure
09/16/2014US8836114 Semiconductor device and method of forming Fo-WLCSP having conductive layers and conductive vias separated by polymer layers
09/16/2014US8836113 Electronic module
09/16/2014US8836112 Semiconductor package for high power devices
09/16/2014US8836102 Multilayered semiconductor device, printed circuit board, and method of manufacturing multilayered semiconductor device
09/16/2014US8836101 Multi-chip semiconductor packages and assembly thereof
09/16/2014US8836097 Semiconductor device and method of forming pre-molded substrate to reduce warpage during die molding
09/16/2014US8835953 Lighting device comprising LEDs with phosphor layers
09/16/2014US8835946 LED module and LED dot matrix display
09/16/2014US8835944 Lighting device
09/16/2014US8835931 Optoelectronic component and method for producing an optoelectronic component
09/16/2014US8835748 Multi-junction PV module
09/16/2014US8835227 Semiconductor device fabrication method and semiconductor device
09/16/2014US8835218 Stackable layer containing ball grid array package
09/16/2014US8833966 Light device and its light emitting diode module
09/16/2014US8833418 Method and system for bonding electrical devices using an electrically conductive adhesive
09/12/2014WO2014138495A1 Package integrity monitor with sacrificial bumps
09/12/2014WO2014138285A1 Via-enabled package-on-package
09/12/2014WO2014137749A1 Smart phone on a chip and method making same
09/12/2014WO2014136735A1 Semiconductor device
09/12/2014WO2014136336A1 Sensor device
09/12/2014WO2014136241A1 Laminate and method of producing same
09/12/2014WO2014136156A1 Semiconductor device
09/12/2014WO2014136007A1 Multi-component electronic module with integral coolant-cooling
09/12/2014WO2014135802A1 Method for producing conductive direct metal bonding
09/12/2014WO2014135577A2 Led module and lighting assembly having a corresponding module
09/12/2014WO2014135109A1 Lamp filament board and lamp filament manufacturing method
09/12/2014WO2014134758A1 Manufacturing method for multichip system-level packaging structure
09/11/2014US20140256089 Stacked semiconductor packages
09/11/2014US20140256088 Semiconductor device having chip mounted on an interposer
09/11/2014US20140256063 Contactless communications using ferromagnetic material
09/11/2014US20140253196 Flip-flops in a monolithic three-dimensional (3d) integrated circuit (ic) (3dic) and related methods
09/11/2014US20140252656 Semiconductor package
09/11/2014US20140252652 Bonding structure of semiconductor package, method for fabricating the same, and stack-type semiconductor package
09/11/2014US20140252626 Semiconductor package and method of fabricating the same
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