Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
10/2014
10/02/2014US20140291677 Integrated multi-sensor module
10/02/2014DE102014202651A1 Halbleitervorrichtung und Halbleitermodul Semiconductor device and semiconductor module
10/02/2014DE102014104497A1 Halbleitergehäuse mit mehreren Ebenen Semiconductor package with multiple levels
10/02/2014DE102013204291A1 Optoelektronisches Bauelement Optoelectronic component
10/01/2014EP2784813A2 Support for capillary self-assembly with horizontal stabilisation, manufacturing method and use
10/01/2014EP2784370A2 Light-emitting module and luminaire
10/01/2014EP2783400A1 Water resistant led devices and led display including the same
10/01/2014EP2783394A1 A hvdc thyristor valve assembly
09/2014
09/30/2014US8848443 Semiconductor memory device and repair method thereof
09/30/2014US8848390 Capacitive proximity communication using tuned-inductor
09/30/2014US8848381 Power semiconductor module and power semiconductor module system
09/30/2014US8848380 Bumpless build-up layer package warpage reduction
09/30/2014US8848368 Computer with at least one faraday cage and internal flexibility sipes
09/30/2014US8847521 Electric-vehicle control apparatus
09/30/2014US8847507 Illuminating device
09/30/2014US8847478 Multi-chip light emitting device lamps for providing high-CRI warm white light and light fixtures including the same
09/30/2014US8847413 Integrated circuit package system with leads having multiple sides exposed
09/30/2014US8847412 Microelectronic assembly with thermally and electrically conductive underfill
09/30/2014US8847408 III-nitride transistor stacked with FET in a package
09/30/2014US8847400 Semiconductor device, method for manufacturing the same, and data processing device
09/30/2014US8847399 Semiconductor device and method of fabricating the same
09/30/2014US8847380 Staged via formation from both sides of chip
09/30/2014US8847378 Semiconductor package
09/30/2014US8847377 Stacked wafer level package having a reduced size
09/30/2014US8847374 Power semiconductor module and manufacturing method thereof
09/30/2014US8847360 Systems and methods for enabling ESD protection on 3-D stacked devices
09/30/2014US8847264 Luminaire
09/30/2014US8847257 Semiconductor light emitting devices and submounts
09/30/2014US8847255 Semiconductor light-emitting device
09/30/2014US8847251 Substrate, light-emitting device, and lighting apparatus having a largest gap between two lines at light-emitting element mounting position
09/30/2014US8847247 Optoelectronic module comprising at least one first semiconductor body having a radiation outlet side and an insulation layer and method for the production thereof
09/30/2014US8847243 Semiconductor package comprising an optical semiconductor device
09/30/2014US8847242 Multi-element LED lamp
09/30/2014US8847239 AC LED device and method for fabricating the same
09/30/2014US8846454 Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer
09/30/2014US8846450 Room temperature metal direct bonding
09/30/2014US8846449 Three-dimensional integrated circuit, processor, semiconductor chip, and manufacturing method of three-dimensional integrated circuit
09/30/2014US8846447 Thin wafer handling and known good die test method
09/30/2014US8846446 Semiconductor package having buried post in encapsulant and method of manufacturing the same
09/30/2014US8846445 Inverse chip connector
09/30/2014US8846423 Bonding an optical element to a light emitting device
09/30/2014US8845835 Carrier structure and manufacturing method thereof
09/30/2014US8845134 Cooling system for light emitting device and light emitting device using the same
09/25/2014WO2014151689A2 Ultra-thin printed led layer removed from substrate
09/25/2014WO2014150918A1 In-package fly-by signaling
09/25/2014WO2014150634A1 Semiconductor photocatalysts employing high surface area substrate
09/25/2014WO2014150564A1 Package-on-package structure with reduced height
09/25/2014WO2014150168A1 Reconfigurable pop
09/25/2014WO2014149579A1 Insulated top side bump connection for a power device, for example for gate, source and drain contacts of a power field effect transistor
09/25/2014WO2014149338A1 Multi-chip module with self-populating positive features
09/25/2014WO2014148485A1 Semiconductor device and manufacturing method therefor
09/25/2014WO2014147787A1 Semiconductor device
09/25/2014WO2014147720A1 Electric power converter
09/25/2014WO2014147709A1 Electronic device, manufacturing method therefor, and network system
09/25/2014US20140285253 Stack package
09/25/2014US20140284817 Semiconductor device and manufacturing method of the same
09/25/2014US20140284806 Semiconductor device die attachment
09/25/2014US20140284805 Multiple helix substrate and three-dimensional package with same
09/25/2014US20140284796 Microelectronic devices and methods for filling vias in microelectronic devices
09/25/2014US20140284785 Semiconductor device and manufacturing method thereof
09/25/2014US20140284777 Multi-Chip Semiconductor Power Device
09/25/2014US20140284764 Semiconductor package having heat slug and passive device
09/25/2014US20140284633 Stacked light emitting diode array structure
09/25/2014US20140284624 Semiconductor Component, Semiconductor Module and Methods for Producing a Semiconductor Component and a Semiconductor Module
09/25/2014DE112011105967T5 Mikroelektronisches Gehäuse und gestapelte mikroelektronische Baugruppe und Rechensystem mit denselben Microelectronic housing and stacked microelectronic assembly and computing system with the same
09/25/2014DE102014103773A1 Mehrchip-Halbleiter-Leistungsbauelement A multi-chip semiconductor power component
09/25/2014DE102013205179A1 Verfahren zum Herstellen einer elektromagnetische Strahlung emittierenden Baugruppe und elektromagnetische Strahlung emittierende Baugruppe A method for producing a electromagnetic radiation emitting assembly and electromagnetic radiation emitting assembly
09/25/2014DE102013205138A1 Halbleiterbauelement, Halbleitermodul sowie Verfahren zur Herstellung eines Halbleiterbauelements und eines Halbleitermoduls A semiconductor device, semiconductor module, and method of manufacturing a semiconductor device and a semiconductor module
09/25/2014DE102013204889A1 Leistungsmodul mit mindestens einem Leistungsbauelement Power module with at least one power device
09/25/2014DE102013204814A1 Fotovoltaik-Modul und Verfahren zur Herstellung eines Fotovoltaik-Moduls Photovoltaic module and method for manufacturing a photovoltaic module
09/25/2014DE102013102828A1 Leistungsbaugruppe mit einer als Folienverbund ausgebildeten Verbindungeinrichtung Power module with a designed as a film composite connector
09/25/2014DE102010038910B4 Halbleitervorrichtung mit Durchgangselektrode und Herstellungsverfahren A semiconductor device having through-electrode and production method
09/25/2014DE102009035920B4 Halbleiterbauelement, Baugruppe und Verfahren zum Herstellen des Halbleiterbauelements A semiconductor device assembly and method of manufacturing the semiconductor device
09/25/2014DE102008049193B4 Niederinduktive Leistungshalbleiteranordnung The low-power semiconductor device
09/24/2014EP2782134A2 Semiconductor device
09/24/2014EP2782133A2 High-frequency module
09/24/2014EP2780941A1 Radio frequency package on package circuit
09/23/2014US8842945 Methods of forming three dimensionally integrated semiconductor systems including photoactive devices and semiconductor-on-insulator substrates
09/23/2014US8842440 Printed circuit board and method of manufacturing printed circuit board
09/23/2014US8842438 3D power module package
09/23/2014US8841783 Semiconductor device and method of manufacturing semiconductor device
09/23/2014US8841779 Semiconductor device and method of forming high routing density BOL BONL and BONP interconnect sites on substrate
09/23/2014US8841778 Three dimensional memory structure
09/23/2014US8841776 Stacked semiconductor chips having double adhesive insulating layer interposed therebetween
09/23/2014US8841759 Semiconductor package and manufacturing method thereof
09/23/2014US8841720 Semiconductor substrate and semiconductor chip
09/23/2014US8841684 Light-emitting device
09/23/2014US8841616 Terahertz wave detecting device, imaging device, and measuring device
09/23/2014US8841204 High yield substrate assembly
09/23/2014US8841171 Method of making stackable semiconductor assembly with bump/flange heat spreader and dual build-up circuitry
09/23/2014US8841169 High density chip packages, methods of forming, and systems including same
09/23/2014US8841167 Manufacturing method of a semiconductor package of small footprint with a stack of lead frame die paddle sandwiched between high-side and low-side MOSFET
09/23/2014US8841141 Method for separating and transferring IC chips
09/23/2014US8840811 Electrically conductive bonding material, method of bonding with the same, and semiconductor device bonded with the same
09/23/2014US8839509 Method for manufacturing electronic apparatus
09/18/2014WO2014143330A1 Memory module having unified pcb design for ssd applications
09/18/2014WO2014142178A1 Semiconductor chip and semiconductor device provided with semiconductor chip
09/18/2014WO2014141346A1 Semiconductor device
09/18/2014WO2014140796A1 Wafer-level flip chip device packages and related methods
09/18/2014WO2014139860A1 Optoelectronic component, lighting module and motor vehicle headlight
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