Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
10/2014
10/21/2014US8865489 Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays
10/16/2014US20140306339 Semiconductor device and manufacturing method of semiconductor device
10/16/2014US20140306250 Solid-state lighting device and method of manufacturing same
10/16/2014US20140306243 Light emitting device
10/14/2014US8861221 Integrated circuit packaging system with a shield and method of manufacture thereof
10/14/2014US8860465 Protecting data from decryption from power signature analysis in secure applications
10/14/2014US8860300 Color-temperature-tunable device
10/14/2014US8860229 Hybrid bonding with through substrate via (TSV)
10/14/2014US8860222 Techniques for wafer-level processing of QFN packages
10/14/2014US8860221 Electrode connecting structures containing copper
10/14/2014US8860215 Semiconductor device and method of manufacturing the same
10/14/2014US8860210 Semiconductor device
10/14/2014US8860201 Stacked integrated circuit package using a window substrate
10/14/2014US8860199 Multi-die processor
10/14/2014US8860198 Semiconductor package with temperature sensor
10/14/2014US8860196 Semiconductor package and method of fabricating the same
10/14/2014US8860179 Inductive loop formed by through silicon via interconnection
10/14/2014US8860170 Power semiconductor with a Si chip and a wideband chip having matched loss and area ratios
10/14/2014US8860153 Semiconductor packages, systems, and methods of formation thereof
10/14/2014US8860079 Semiconductor packages and methods of packaging semiconductor devices
10/14/2014US8860072 Light emitting device and light unit having the same
10/14/2014US8860066 LED module
10/14/2014US8860058 Solid state white light emitter and display using same
10/14/2014US8860057 Light emitting device and manufacturing method of the same
10/14/2014US8860049 Multi-light emitting diode package
10/14/2014US8860048 Three dimensional light emitting diode systems, and compositions and methods relating thereto
10/14/2014US8860046 Light-emitting diode device
10/14/2014US8859979 Pixel matrix with compensation of ohmic drops on the power supplies
10/14/2014US8859907 Method for assembling a circuit board
10/14/2014US8859885 Method for manufacturing photovoltaic cells with multiple junctions and multiple electrodes
10/14/2014US8859390 Structure and method for making crack stop for 3D integrated circuits
10/14/2014US8859340 Molded interposer package and method for fabricating the same
10/14/2014US8858025 Lighting device
10/09/2014WO2014164582A1 Substrate for increased efficiency of semiconductor photocatalysts
10/09/2014WO2014164374A1 Method and apparatus for generating regulated isolation supply voltage
10/09/2014WO2014164270A1 Integrated high voltage isolation using low value capacitors
10/09/2014WO2014164186A1 Electromagnetic interference enclosure for radio frequency multi-chip integrated circuit packages
10/09/2014WO2014163687A1 Stacked memory package, method of manufacturing thereof and pinout designs of ic package substrate
10/09/2014WO2014161738A1 Optoelectronic semiconductor chip and optoelectronic module
10/09/2014US20140301045 Pulse signal output circuit and shift register
10/09/2014US20140299977 Semiconductor Device
10/09/2014DE102014105013A1 Übertragen und Empfangen digitaler und analoger Signale über einen Isolator hinweg Transmitting and receiving digital and analog signals via an insulator away
10/09/2014DE102014104989A1 Integrierte Schaltungs-Gehäusebaugruppen, die eine Glas-Lötstoppmaskenschicht enthalten Integrated circuit package assemblies, which contain a glass-solder resist layer,
10/09/2014DE102013206186A1 Optoelektronisches Bauelement Optoelectronic component
10/09/2014DE102013205998A1 Optoelektronische Baugruppe und Verfahren zum Herstellen einer optoelektronischen Baugruppe The optoelectronic assembly and method of making an optoelectronic assembly
10/09/2014DE102013205858A1 Gehäustes LED-Modul A housed LED module
10/09/2014DE102013205847A1 Optoelektronisches Bauelement und Verfahren zu seiner Herstellung Optoelectronic component and process for its preparation
10/09/2014DE102013204862A1 Optoelektronische Baugruppe und Verfahren zum Herstellen einer optoelektronischen Baugruppe The optoelectronic assembly and method of making an optoelectronic assembly
10/09/2014DE102013110812B3 Verfahren zur Herstellung eines weitergebildeten Metallformkörpers und Verfahren zur Herstellung einer Leistungshalbleitereinrichtung mit einer Lotverbindung diesen weitergebildeten Metallformkörper verwendend. A method for producing a metal shaped article and further developed method of manufacturing a power semiconductor device with a solder joint that further formed using metal molding.
10/09/2014DE102013103409A1 Optoelektronischer Halbleiterchip und optoelektronisches Modul The optoelectronic semiconductor chip and optoelectronic module
10/09/2014DE102012217957B4 Verfahren zur Herstellung einer Mikro-LED-Matrix A process for producing a micro-LED matrix
10/08/2014EP2787544A1 Luminaire
10/08/2014EP2786409A1 Cpu with stacked memory
10/07/2014US8856722 System for semiconductor device, method for manufacturing semiconductor device, semiconductor device and method for bonding substrates
10/07/2014US8856712 Optimized flip-flop device with standard and high threshold voltage MOS devices
10/07/2014US8855836 Methods and systems for implementing software-selectable multipurpose aircraft pins
10/07/2014US8854854 Memory module and memory system
10/07/2014US8854123 On-package multiprocessor ground-referenced single-ended interconnect
10/07/2014US8853866 Semiconductor device and stacked-type semiconductor device
10/07/2014US8853864 Semiconductor device and a method of manufacturing the same
10/07/2014US8853863 Semiconductor device with die stack arrangement including staggered die and efficient wire bonding
10/07/2014US8853854 Semiconductor package and method of manufacturing the same
10/07/2014US8853843 Modular low stress package technology
10/07/2014US8853830 System, structure, and method of manufacturing a semiconductor substrate stack
10/07/2014US8853819 Semiconductor structure with passive element network and manufacturing method thereof
10/07/2014US8853799 Vertically integrated systems
10/07/2014US8853733 Light emitting diode package and method for manufacturing the same
10/07/2014US8853708 Stacked multi-die packages with impedance control
10/07/2014US8853707 High voltage cascoded III-nitride rectifier package with etched leadframe
10/07/2014US8853706 High voltage cascoded III-nitride rectifier package with stamped leadframe
10/07/2014US8853559 Insulation circuit board, and power semiconductor device or inverter module using the same
10/07/2014US8853558 Interconnect structure
10/07/2014US8853007 In-plane silicon heat spreader and method therefor
10/07/2014US8853000 Package on package structrue and method for manufacturing same
10/07/2014US8852999 System-in-a-package based flash memory card
10/07/2014US8852467 Method of manufacturing a printable composition of a liquid or gel suspension of diodes
10/07/2014US8851682 Display module, manufacturing method thereof, and display device
10/07/2014US8850743 Lighting assembly
10/07/2014US8850697 Method for manufacturing a radiation imaging panel comprising imaging tiles
10/02/2014WO2014160239A1 Three-terminal printed devices interconnected as circuits
10/02/2014WO2014159894A1 Led lighting devices
10/02/2014WO2014158388A1 Package-on-package structures
10/02/2014WO2014158250A1 Stacked wafer with coolant channels
10/02/2014WO2014157112A1 Substrate for power modules, substrate with heat sink for power modules, and power module
10/02/2014WO2014157031A1 High-frequency transmission line and electronic device
10/02/2014WO2014156921A1 Semiconductor device
10/02/2014WO2014156422A1 Resin multi-layer substrate and electronic apparatus
10/02/2014WO2014155486A1 Power conversion apparatus
10/02/2014WO2014154551A1 Method for producing an assembly emitting electromagnetic radiation, and assembly emitting electromagnetic radiation
10/02/2014WO2014154023A1 Power system-on-chip architecture
10/02/2014US20140295621 Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming same
10/02/2014US20140295620 Method of manufacturing semiconductor device having plural semiconductor chips stacked one another
10/02/2014US20140295592 Bat-wing lens design with multi-di
10/02/2014US20140291865 Electronic apparatus and fabrication method of the same
10/02/2014US20140291830 Semiconductor packages having package-on-package structures
10/02/2014US20140291829 Adhesive bonding technique for use with capacitive micro-sensors
10/02/2014US20140291823 Chip package and method of manufacturing the same
10/02/2014US20140291710 Light emitting device and image display unit
10/02/2014US20140291708 Alternating Current Vertical Light Emitting Element and Manufacturing Method Thereof
10/02/2014US20140291707 Semiconductor light device having a galvanic non-insulated driver
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