Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
11/2014
11/11/2014US8884445 Semiconductor chip and stacked semiconductor package having the same
11/11/2014US8884440 Integrated circuit device including through-silicon via structure having offset interface
11/11/2014US8884434 Method and system for improving reliability of a semiconductor device
11/11/2014US8884431 Packaging methods and structures for semiconductor devices
11/11/2014US8884425 Thermal management in 2.5 D semiconductor packaging
11/11/2014US8884422 Flip-chip fan-out wafer level package for package-on-package applications, and method of manufacture
11/11/2014US8884421 Multi-chip package and method of manufacturing the same
11/11/2014US8884418 Semiconductor device and method of forming PIP with inner known good die interconnected with conductive bumps
11/11/2014US8884416 Semiconductor apparatus having through vias configured to isolate power supplied to a memory chip from data signals supplied to the memory chip
11/11/2014US8884396 Semiconductor device and manufacturing method thereof
11/11/2014US8884391 Photoelectric conversion device and photoelectric conversion system with boundary region
11/11/2014US8884343 System in package and method for manufacturing the same
11/11/2014US8884309 AC switch having compound semiconductor MOSFETs
11/11/2014US8884264 Variable resistance memory device
11/11/2014US8883566 Method of manufacturing semiconductor device, semiconductor device and multilayer wafer structure
11/11/2014US8883562 Reconstituted wafer stack packaging with after-applied pad extensions
11/11/2014US8883561 Semiconductor device and method of embedding TSV semiconductor die within encapsulant with TMV for vertical interconnect in POP
11/11/2014US8883545 Method and device for producing a solar panel using a carrier
11/11/2014US8882290 Light-mixing type light-emitting apparatus
11/06/2014US20140327436 Power Module with Integrated Current Sensor
11/06/2014US20140327361 High colour quality luminaire
11/06/2014US20140327156 Semiconductor package and method of manufacturing the same
11/06/2014US20140327155 Semiconductor package and method of manufacturing the same
11/06/2014US20140327129 Package on package device and method of manufacturing the same
11/06/2014US20140327021 Led lighting module
11/06/2014US20140326856 Integrated circuit stack with low profile contacts
11/04/2014US8881085 Cell-level electrostatic discharge protection for an integrated circuit
11/04/2014US8880749 Apparatus for mixed signal interface circuitry and associated methods
11/04/2014US8878369 Low power/high speed TSV interface design
11/04/2014US8878358 Semiconductor device
11/04/2014US8878354 Method and apparatus for supplying power to a system on a chip (SOC)
11/04/2014US8878351 Semiconductor device
11/04/2014US8878221 Light emitting module
11/04/2014US8878217 LED package with efficient, isolated thermal path
11/04/2014US8878208 Illuminating device
11/04/2014US8878204 Submount based light emitter components and methods
11/04/2014US8878182 Probe pad design for 3DIC package yield analysis
11/04/2014US8877637 Damascene process for aligning and bonding through-silicon-via based 3D integrated circuit stacks
11/04/2014US8877523 Recovery method for poor yield at integrated circuit die panelization
11/04/2014US8877101 Method of manufacturing a light emitting, power generating or other electronic apparatus
11/04/2014US8876352 Method and system for flexible illuminated devices having edge lighting utilizing light active sheet material with integrated light emitting diode
11/04/2014US8876350 Light source device and display device provided with same
11/04/2014US8876330 Illumination device
10/2014
10/30/2014US20140320202 Apparatus and method for extending bandwidth and supressing phase errors in multi-phase signals
10/30/2014US20140319701 Semiconductor chip and a semiconductor package having a package on package (pop) structure including the semiconductor chip
10/30/2014US20140319552 Semiconductor light emitting module and method of manufacturing the same
10/30/2014US20140319549 Light emitting diode package having a transparent metal layer function as an electrode thereof
10/30/2014US20140319328 Motion sensor and packaging method thereof
10/28/2014US8873282 Interfaces and die packages, and appartuses including the same
10/28/2014US8873245 Embedded chip-on-chip package and package-on-package comprising same
10/28/2014US8873244 Package structure
10/28/2014US8872539 Semiconductor integrated circuit including a power controllable region
10/28/2014US8872419 Light emitting device
10/28/2014US8872414 Light emitting device package
10/28/2014US8872351 Semiconductor devices having through electrodes
10/28/2014US8872328 Integrated power module package
10/28/2014US8872327 Semiconductor device
10/28/2014US8872325 Semiconductor device including an insulating layer and heat sink plates formed in the insulating layer
10/28/2014US8872323 Stack package
10/28/2014US8872320 Semiconductor device and method of forming overlapping semiconductor die with coplanar vertical interconnect structure
10/28/2014US8872319 Stacked package structure including insulating layer between two stacked packages
10/28/2014US8872318 Through interposer wire bond using low CTE interposer with coarse slot apertures
10/28/2014US8872317 Stacked package
10/28/2014US8872312 EMI package and method for making same
10/28/2014US8872306 Electrical interconnection structures including stress buffer layers
10/28/2014US8872292 Push-pull magnetoresistive sensor bridges and mass fabrication method
10/28/2014US8872211 Element-connecting board, producing method thereof, and light-emitting diode device
10/28/2014US8872198 Luminaire and light-emitting apparatus with light-emitting device
10/28/2014US8871641 Low resistance through-wafer via
10/28/2014US8871640 Method of manufacturing semiconductor chip
10/28/2014US8871637 Semiconductor structure with insulated through silicon via
10/28/2014US8871538 Method for fabricating wavelength conversion member for use in LED lighting apparatus
10/28/2014US8870412 Light tube and power supply circuit
10/28/2014US8869387 Methods for making microelectronic die systems
10/23/2014US20140312510 Semiconductor Device
10/23/2014US20140312490 Electrical system and core module thereof
10/23/2014US20140312483 Semiconductor package having ic dice and voltage tuners
10/23/2014US20140312481 Integrated circuit package and method for manufacturing the same
10/23/2014US20140312458 Methods and apparatus related to an improved package including a semiconductor die
10/23/2014US20140312366 Light emitting diode package and method for fabricating the same
10/23/2014US20140312365 Alternating current light-emitting device
10/23/2014US20140312214 Optical communication apparatus
10/23/2014US20140312211 Optical communication apparatus
10/21/2014US8867219 Method of transferring and electrically joining a high density multilevel thin film to a circuitized and flexible organic substrate and associated devices
10/21/2014US8866765 Light emitting unit, manufacturing method thereof and touch panel having the same
10/21/2014US8866637 Data collection process for optical leak detection
10/21/2014US8866543 Integrated circuit having stack structure
10/21/2014US8866396 Light tube and power supply circuit
10/21/2014US8866310 Semiconductor device
10/21/2014US8866305 Methods of forming bonded semiconductor structures
10/21/2014US8866303 Semiconductor device with configurable through-silicon vias
10/21/2014US8866284 Semiconductor device comprising an extended semiconductor chip having an extension
10/21/2014US8866276 Semiconductor chip device with polymeric filler trench
10/21/2014US8866275 Leadframe interposer over semiconductor die and TSV substrate for vertical electrical interconnect
10/21/2014US8866166 Solid state lighting device
10/21/2014US8866165 Light emitting apparatus
10/21/2014US8866125 Integration of LED driver circuit with LED
10/21/2014US8865587 Multi-chip-scale package
10/21/2014US8865525 Method of making cavity substrate with built-in stiffener and cavity substrate manufactured thereby
10/21/2014US8865521 3D semiconductor package interposer with die cavity
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