Patents
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
04/2007
04/19/2007WO2007044577A1 Integrated micro-channels for 3d through silicon architectures
04/19/2007WO2007043983A2 Reversible oxidation of carbon nanotubes
04/19/2007WO2006134410A3 Light-emitting structures
04/19/2007WO2006101150A3 Power semiconductor module
04/19/2007US20070087644 Method of producing image display unit
04/19/2007US20070087528 Method and structure for vertically-stacked device contact
04/19/2007US20070085625 Flexible capacitive coupler assembly and method of manufacture
04/19/2007US20070085190 Decoupling capacitor closely coupled with integrated circuit
04/19/2007DE112004002862T5 Verfahren zum Herstellen einer Halbleitervorrichtung und Halbleitervorrichtung A method of manufacturing a semiconductor device and semiconductor device
04/19/2007DE112004002858T5 Träger für eine Stapel-Halbleitervorrichtung und Verfahren zum Herstellen derselben The support for a stack-type semiconductor device and method of manufacturing the same
04/19/2007DE102006044380A1 Verfahren zum Herstellen eines Substrates mit einem Hohlraum A method of manufacturing a substrate with a cavity
04/19/2007DE102006037292A1 Kalibriertes LED-Lichtmodul Calibrated LED light module
04/19/2007DE102005047106A1 Leistungshalbleitermodul The power semiconductor module
04/19/2007DE102004003275B4 Halbleiterbauteil mit Verbindungselementen auf Halbleiterchips und Verfahren zur Herstellung derselben A semiconductor device comprising connecting elements to the semiconductor chip and method of manufacturing the same
04/18/2007EP1776002A1 Hybrid electronic component and method for manufacturing the same
04/18/2007EP1775769A1 Power semiconductor module
04/18/2007EP1775768A1 Semiconductor device having three-dimensional stack structure and method for manufacturing the same
04/18/2007EP1775767A2 Method of fabricating a vertically montable IC package
04/18/2007EP1775649A1 Production system
04/18/2007EP1774594A2 Light emitting diode assembly
04/18/2007EP1774589A1 Assembling two substrates by molecular adhesion, one of the two supporting an electrically conductive film
04/18/2007EP1774588A1 Assembling two substrates by molecular adhesion
04/18/2007EP1774372A1 Textured transparent film having pyramidal patterns that can be associated with photovoltaic cells
04/18/2007EP1565937B1 Power semiconductor module
04/18/2007EP1464088B1 Electroluminescent device
04/18/2007EP1082572B1 Luminaire with leds
04/18/2007CN2891284Y IGBT module and radiator mounting structure in switch power supply
04/18/2007CN2891283Y Rectifier and radiator mounting structure in switch power supply
04/18/2007CN2891282Y High-voltage silicon stack
04/18/2007CN1950956A Light-emitting device and method for manufacturing same
04/18/2007CN1949686A System and method for transmitting signal between IC
04/18/2007CN1949548A Illuminating device
04/18/2007CN1949508A Infrared focal plane detector with antireflective convergence microlens and microlens preparing method
04/18/2007CN1949507A LED device capable of regulating colour temp
04/18/2007CN1949506A Hybrid module and its manufacturing process
04/18/2007CN1949505A Stacked integrated circuit chip and packaging
04/18/2007CN1949504A Light emitting package, backlight unit and liquid crystal display device including the same
04/18/2007CN1949499A Wiring board, semiconductor device, and method of manufacturing the same
04/18/2007CN1949061A Display device, back-light module and LDE packing structure
04/18/2007CN1947660A Module assembly for multi-tube core backlight lighting diode
04/18/2007CN1311565C Solar array concentrator system and method for concentratiing solar energy
04/17/2007US7206507 Method and apparatus for producing untainted white light using off-white emitting diodes
04/17/2007US7206205 Inverter device and method of manufacturing the device thereof, and electric automobile incorporating the inverter device thereof
04/17/2007US7206204 Electric circuit module
04/17/2007US7205670 Semiconductor device and manufacturing method therefor
04/17/2007US7205651 Thermally enhanced stacked die package and fabrication method
04/17/2007US7205647 Semiconductor multi-package module having package stacked over ball grid array package and having wire bond interconnect between stacked packages
04/17/2007US7205646 Electronic device and chip package
04/17/2007US7205645 Wiring board, semiconductor device, and method of manufacturing wiring board
04/17/2007US7205644 Substrate with outer contacts one one surface and inner contacts disposed around it, electrically connected, memory chips are electrically connected to the inner contacts; molding compound encapsulating the memory chips and the inner contacts; and an ultra-thin plastic shell covering the second surface
04/17/2007US7205626 Light-emitting or light-receiving with plurality of particle-shaped semiconductor devices having light-emitting or light-receiving properties
04/17/2007US7205574 Optical semiconductor device
04/17/2007US7205545 Electromagnetic radiation detection device with integrated housing comprising two superposed detectors
04/17/2007US7205214 Device transferring method
04/17/2007US7205213 Device transferring method
04/17/2007US7205212 Device transferring method
04/17/2007US7204609 Light-emitting diode light source unit
04/12/2007WO2007041155A2 Microelectronic package having multiple conductive paths through an opening in a support substrate
04/12/2007WO2007040193A1 Hybrid integrated circuit device and method for manufacturing same
04/12/2007WO2007000697A3 Method of manufacturing an assembly and assembly
04/12/2007US20070083339 Broadband differential coupling devices, systems and methods
04/12/2007US20070082429 Semiconductor substrate for build-up packages
04/12/2007US20070081314 Electronic component packaging structure and method for producing the same
04/12/2007US20070080457 Manufacturing method for semiconductor device, semiconductor device and semiconductor chip
04/12/2007US20070080442 Semiconductor module having a coupling substrate, and methods for its production
04/12/2007US20070080298 Computer tomograph with optoelectronic data transfer
04/12/2007US20070080292 Method and System for Enhanced Radiation Detection
04/12/2007DE102005052356A1 Beleuchtungseinheit mit Lumineszenzdiodenchip und Lichtleiter, Verfahren zum Herstellen einer Beleuchtungseinheit und LCD-Display A lighting unit comprising LED chip and light guide method of manufacturing a lighting unit and LCD display
04/12/2007DE102005051414B3 Semiconductor component with wiring substrate and solder balls and production processes has central plastic mass and lower film template for lower solder ball arrangement
04/12/2007DE102005047566A1 Herstellungsverfahren und Anordnung mit einem Leistungshalbleiterbauelement und mit einem Gehäuse Production method and arrangement with a power semiconductor device and having a housing
04/11/2007EP1772900A2 Apparatus with at least one power semiconductor device and fabrication process of a power semiconductor device including a pressure sintering step
04/11/2007EP1771891A2 Optoelectronic component that emits electromagnetic radiation and illumination module
04/11/2007EP1771883A2 Image module
04/11/2007EP1771881A1 Electronic module arrangement and corresponding production method
04/11/2007EP1212927B1 A printed circuit board assembly
04/11/2007EP0720232B1 Multi-chip module
04/11/2007CN2888650Y Porcelain rectifying bridge
04/11/2007CN2888649Y Device composed of multi surface-mounted wafers
04/11/2007CN1947267A Semiconductor chip for driving light emitting element, light emitting device and lighting equipment
04/11/2007CN1947255A Photovoltaic module with an electric device
04/11/2007CN1947254A Micro-optics on optoelectronics
04/11/2007CN1947247A Universal interconnect die
04/11/2007CN1945868A Light emitting device assembly and backlight unit using the same
04/11/2007CN1945828A Method for producing stacked wafer
04/11/2007CN1945822A Semiconductor device, semiconductor module and semiconductor module method for producing
04/11/2007CN1945816A Semiconductor apparatus and method thereof
04/11/2007CN1945804A Method of forming a molded array package device having an exposed tab and structure
04/11/2007CN1310320C Flexible interconnection device, fingerprint transducing device and manufacturing method thereof
04/10/2007US7202698 Integrated circuit having a programmable input structure with bounce capability
04/10/2007US7202677 Socket for mating with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component
04/10/2007US7202555 Pitch change and chip scale stacking system and method
04/10/2007US7202506 Multi element, multi color solid state LED/laser
04/10/2007US7202482 Radiation detection apparatus and radiological imaging apparatus
04/10/2007US7202460 Camera module for compact electronic equipments
04/10/2007US7202105 Multi-chip semiconductor connector assembly method
04/10/2007US7200930 Probe for semiconductor devices
04/05/2007WO2007037106A1 Method for manufacturing integrated circuit device having three-dimensional multilayer structure
04/05/2007WO2007036994A1 Semiconductor device, its fabrication method, and film fabrication method
04/05/2007WO2005109552A3 Chip with a power supply device
04/05/2007WO2005101925A3 Apparatus, system, and method for optical pulse gain enhancement for high-finesse external cavity