| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 06/20/2007 | CN1983594A LED luminescent device combined with rectifying circuit on secondary carrier and its production |
| 06/20/2007 | CN1983593A High--power active thin light-emitting diode |
| 06/20/2007 | CN1983592A Image sensing devices, image sensor modules, and manufacturing methods |
| 06/20/2007 | CN1983591A Method and structure for wafer-to-wafer alignments |
| 06/20/2007 | CN1983590A High luminance light emitting diode and liquid crystal display using the same |
| 06/20/2007 | CN1983589A Internal connecting wire with multi-chip packing structure |
| 06/20/2007 | CN1983584A Semiconductor device and inspection method thereof |
| 06/20/2007 | CN1983578A Connecting structure of integrated circuit and its production |
| 06/20/2007 | CN1983544A Manufacturing method for semiconductor device |
| 06/20/2007 | CN1983536A Improvement for packing image sensing chip construction oncircuit board |
| 06/20/2007 | CN1322630C A method and a device for manufacturing a roll of items |
| 06/20/2007 | CN1322593C Solar cell modular and solar cell modular array |
| 06/20/2007 | CN1322584C Leadless type semiconductor package, and production process for manufacturing such leadless type semiconductor package |
| 06/20/2007 | CN1322441C Multi-chip package type memory system |
| 06/19/2007 | US7233534 Electronic circuit package |
| 06/19/2007 | US7233197 Methods and systems for reducing leakage current in semiconductor circuits |
| 06/19/2007 | US7233065 Semiconductor device having capacitors for reducing power source noise |
| 06/19/2007 | US7233059 Semiconductor arrangement |
| 06/19/2007 | US7233057 Integrated circuit package with optimized mold shape |
| 06/19/2007 | US7233030 Device transfer method and panel |
| 06/19/2007 | US7233027 Arrangement comprising at least two different electronic semiconductor circuits |
| 06/19/2007 | US7232957 Hybrid integrated circuit device and method of manufacturing the same |
| 06/19/2007 | US7232710 Method of making cascaded die mountings with springs-loaded contact-bond options |
| 06/19/2007 | US7232709 Process for producing a semiconductor device |
| 06/19/2007 | US7232708 Multi-mode integrated circuit structure |
| 06/19/2007 | US7231712 Method of manufacturing a module |
| 06/14/2007 | WO2007066409A1 Semiconductor device and its manufacturing method |
| 06/14/2007 | WO2007050754A3 Stackable wafer or die packaging with enhanced thermal and device performance |
| 06/14/2007 | WO2006080351A9 Semiconductor device and its manufacturing method |
| 06/14/2007 | US20070133183 Electric motor and method for producing said motor |
| 06/14/2007 | US20070132104 Semiconductor component having plate, stacked dice and conductive vias |
| 06/14/2007 | US20070132081 Multiple stacked die window csp package and method of manufacture |
| 06/14/2007 | US20070132080 Semiconductor chip mounted interposer, semiconductor device, semiconductor chip interposer fabrication method, bare chip mounted interposer, and interposer sheet |
| 06/14/2007 | US20070131954 Light emitting device |
| 06/14/2007 | US20070131349 Method for manufacturing an electronic module, and an electronic module |
| 06/14/2007 | DE60311755T2 Elektronisches Substrat, Leistungsmodul und Motorantrieb Electronic substrate, power module and motor drive |
| 06/14/2007 | DE10254547B4 Anordnung zum mechanischen Schutz für die Chip-Modul-Montage An arrangement for mechanical protection for the chip module assembly |
| 06/14/2007 | DE102005058884A1 Leuchtdiodenmodul, Verfahren zur Herstellung eines Leuchtdiodenmoduls und optische Projektionsvorrichtung Light emitting diode module, method for manufacturing a light-emitting module and optical projection device |
| 06/13/2007 | EP1796163A1 Semiconductor device and electronic control unit using the same |
| 06/13/2007 | EP1796137A2 Apparatus and clocked method for pressure sintering |
| 06/13/2007 | EP1794809A1 Light source, manufacturing method of light source, lighting apparatus, and display apparatus |
| 06/13/2007 | EP1794793A2 Face to face bonded i/o circuit die and functional logic circuit die system |
| 06/13/2007 | EP0885457A4 Method for making a circuit structure having a flip-mounted matrix of devices |
| 06/13/2007 | CN2911965Y White-light LED |
| 06/13/2007 | CN2911963Y Composite LED |
| 06/13/2007 | CN2911962Y Flat rectifying bridge |
| 06/13/2007 | CN1981388A 发光装置 Light-emitting device |
| 06/13/2007 | CN1981387A Light emitting device including RGB light emitting diodes and phosphor |
| 06/13/2007 | CN1981385A Terminal box for solar cell module |
| 06/13/2007 | CN1981378A Light-emitting diode arrangement, optical recording device and method for the pulsed operation of at least one light-emitting diode |
| 06/13/2007 | CN1979848A Stacked type semiconductor memory device and chip selection circuit |
| 06/13/2007 | CN1979847A Relay board provided in semiconductor device, semiconductor device, and manufacturing method of semiconductor device |
| 06/13/2007 | CN1979836A Semiconductor device and electronic control unit using the same |
| 06/13/2007 | CN1321437C Producing method for semiconductor device, semiconductor device, circuit placode and electronic apparatus |
| 06/12/2007 | US7230341 Electronic device and method of manufacturing the same, circuit board, and electronic instrument |
| 06/12/2007 | US7230331 Chip package structure and process for fabricating the same |
| 06/12/2007 | US7230330 Semiconductor die packages with recessed interconnecting structures |
| 06/12/2007 | US7230329 Semiconductor device, electronic device, electronic equipment, method of manufacturing semiconductor device, and method of manufacturing electronic device |
| 06/12/2007 | US7230328 Semiconductor package and laminated semiconductor package |
| 06/12/2007 | US7230320 Electronic circuit device with reduced breaking and cracking |
| 06/12/2007 | US7230318 RF and MMIC stackable micro-modules |
| 06/12/2007 | US7230309 Semiconductor component and sensor component for data transmission devices |
| 06/12/2007 | US7230278 Optoelectronic semiconductor device and light signal input/output device |
| 06/12/2007 | US7230273 Semiconductor device with a plurality of semiconductor elements each including a wide band-gap semiconductor |
| 06/12/2007 | US7230259 Optical coupling device including lead frame having a convexity and method of manufacturing the device |
| 06/12/2007 | US7229851 Semiconductor chip stack |
| 06/12/2007 | US7229850 Method of making assemblies having stacked semiconductor chips |
| 06/12/2007 | US7229848 Method and apparatus for fabricating self-assembling microstructures |
| 06/12/2007 | US7229671 Method for coating package with a filter profile |
| 06/07/2007 | WO2007064779A1 Stacked microelectronic packages |
| 06/07/2007 | WO2007064771A2 Imager device with opaque layer blocking light from the peripheral circuitry and its manufacturing method |
| 06/07/2007 | WO2007063113A1 3d electronic module |
| 06/07/2007 | WO2007062944A1 3-dimensional multichip module |
| 06/07/2007 | WO2007008171A3 Integrated circuit device and method of manufacturing thereof |
| 06/07/2007 | US20070128772 Metal-base circuit board and its manufacturing method |
| 06/07/2007 | US20070128737 Microelectronic devices and methods for packaging microelectronic devices |
| 06/07/2007 | US20070126948 Led package and backlight assembly for lcd comprising the same |
| 06/07/2007 | US20070126128 Semiconductor device and method of manufacturing the same |
| 06/07/2007 | US20070126127 Semiconductor device and method of manufacturing the same |
| 06/07/2007 | US20070126122 Semiconductor device with a wiring substrate and method for producing the same |
| 06/07/2007 | US20070126107 Multi-chip semiconductor connector assembly method |
| 06/06/2007 | EP1568076A4 Composite leadframe led package and method of making the same |
| 06/06/2007 | EP1490908B1 Power module comprising at least two substrates and method for producing the same |
| 06/06/2007 | DE19945470B4 Verfahren zum Herstellen einer mikrofunktionalen Verbundvorrichtung A method of manufacturing a micro-composite functional device |
| 06/06/2007 | DE112005001791T5 Laminierte Verbindungsleitungen für organische, optoelektronische Bauelementemodule Laminated connecting lines for organic optoelectronic devices modules |
| 06/06/2007 | CN2909531Y Storage card structure |
| 06/06/2007 | CN2909530Y Control structure capable of reducing noise of transistor high frequency signal |
| 06/06/2007 | CN1977394A 发光二极管模块 Light-emitting diode module |
| 06/06/2007 | CN1977375A Stacked module systems and methods |
| 06/06/2007 | CN1976026A Packaging structure of illuminating element |
| 06/06/2007 | CN1976025A Semiconductor module and manufacturing method thereof |
| 06/06/2007 | CN1976024A 电路模块 Circuit module |
| 06/06/2007 | CN1976014A Semiconductor device and its production method |
| 06/06/2007 | CN1975239A LED illumination source and device |
| 06/06/2007 | CN1320846C Circuit board and its manufacturing method |
| 06/06/2007 | CN1320695C Structure and method for fabrication of a leadless chip carrier with embedded antenna |
| 06/06/2007 | CN1320666C Light-emitting diode light source module with support piece |
| 06/06/2007 | CN1320650C Semiconductor device, system device using it, and manufacturing method of a semiconductor device |
| 06/06/2007 | CN1320648C Electronic module |
| 06/06/2007 | CN1320646C 半导体器件 Semiconductor devices |