| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 06/06/2007 | CN1320644C Wafer grade package, multiple package overlapping and its producing method |
| 06/06/2007 | CN1320620C Semiconductor device and producing method thereof |
| 06/05/2007 | US7227430 Multichip module |
| 06/05/2007 | US7227407 Integration and terminal arrangement of parallel monitor circuits |
| 06/05/2007 | US7227259 Low-inductance circuit arrangement for power semiconductor modules |
| 06/05/2007 | US7227258 Mounting structure in integrated circuit module |
| 06/05/2007 | US7227252 Semiconductor component having stacked, encapsulated dice and method of fabrication |
| 06/05/2007 | US7227249 Three-dimensional stacked semiconductor package with chips on opposite sides of lead |
| 06/05/2007 | US7227195 Led lamp including a plurality of led chips |
| 06/05/2007 | US7227192 Light-emitting device and manufacturing process of the light-emitting device |
| 06/05/2007 | US7227190 White light emitting device |
| 06/05/2007 | US7227086 Semiconductor chip package having an adhesive tape attached on bonding wires |
| 06/05/2007 | US7226814 Semiconductor package device and method for fabricating the same |
| 06/05/2007 | US7226809 Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assemblies and packages including such semiconductor devices or packages and associated methods |
| 06/05/2007 | US7226808 Method of manufacturing semiconductor device and method of manufacturing electronics device |
| 06/05/2007 | US7225538 Resilient contact structures formed and then attached to a substrate |
| 05/31/2007 | WO2007061815A1 Solid state lighting device |
| 05/31/2007 | WO2007061789A1 Tile for solid state lighting panel |
| 05/31/2007 | WO2007061758A1 Tiles for solid state lighting |
| 05/31/2007 | WO2007060784A1 Circuit module and method for fabricating the same |
| 05/31/2007 | WO2007024483A3 Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices |
| 05/31/2007 | US20070120732 High frequency module |
| 05/31/2007 | US20070120243 Assembly jig and manufacturing method of multilayer semiconductor device |
| 05/31/2007 | US20070120238 Semiconductor/printed circuit board assembly, and computer system |
| 05/31/2007 | US20070120237 Semiconductor integrated circuit |
| 05/31/2007 | US20070120129 Rare earth doped layer or substrate for light conversion |
| 05/31/2007 | US20070119820 Power Module |
| 05/31/2007 | US20070119617 Method for manufacturing component built-in module, and component built-in module |
| 05/31/2007 | DE112005001446T5 Motorsteuerung Motor control |
| 05/31/2007 | DE102005055761A1 Leistungshalbleiterbauelement mit Halbleiterchipstapel in Brückenschaltung und Verfahren zur Herstellung desselben Power semiconductor component with the same semiconductor chip stack in a bridge circuit and methods for making |
| 05/31/2007 | DE102005055713A1 Leistungshalbleitermodul mit Anschlusselementen Power semiconductor module with connecting elements |
| 05/31/2007 | DE102005054543A1 Halbleiterschalter mit integrierter Ansteuerschaltung Semiconductor switch with integrated control circuit |
| 05/30/2007 | EP1791180A1 Semiconductor device |
| 05/30/2007 | EP1791178A2 Pressure contact type power semiconductor module |
| 05/30/2007 | CN2906935Y Novel extra high power LED encapsulation structure |
| 05/30/2007 | CN2906927Y LED encapsulation structure |
| 05/30/2007 | CN2906926Y LED with connection structure |
| 05/30/2007 | CN1973587A Hybrid electronic component and method for manufacturing the same |
| 05/30/2007 | CN1971957A Light emitting element, production method thereof, backlight unit having the light emitting element, and production method thereof |
| 05/30/2007 | CN1971909A Package for optical transceiver module |
| 05/30/2007 | CN1971908A Three wave length LED structure |
| 05/30/2007 | CN1971907A A side-lighting LED illumination lamp, illuminating method of backlight source and mobile phone |
| 05/30/2007 | CN1971906A Lighting stick with LBD wafer |
| 05/30/2007 | CN1971905A Pressure contact type power semiconductor module |
| 05/30/2007 | CN1971904A Lap connected structure of semiconductor component-buried loading board |
| 05/30/2007 | CN1971896A Macromolecule conductive film structure and its semiconductor assembly encapsulation structure |
| 05/30/2007 | CN1971895A Chip buried base plate encapsulation structure |
| 05/30/2007 | CN1971862A Chip buried in semiconductor encapsulation base plate structure and its manufacturing method |
| 05/30/2007 | CN1319422C Hybrid module and making method thereof and mounting method thereof |
| 05/30/2007 | CN1319179C Solar battery |
| 05/30/2007 | CN1319161C Semiconductor device |
| 05/30/2007 | CN1319157C Multilayer circuit board and semiconductor device |
| 05/30/2007 | CN1319138C Packaged semiconductor device and its forming method |
| 05/30/2007 | CN1319076C Extendible drain members for grounding RFI/EMI shielding |
| 05/29/2007 | US7224184 High bandwidth reconfigurable on-chip network for reconfigurable systems |
| 05/29/2007 | US7224181 Clock distribution in a configurable IC |
| 05/29/2007 | US7224070 Plurality of semiconductor die in an assembly |
| 05/29/2007 | US7224058 Integrated circuit package employing a heat-spreader member |
| 05/29/2007 | US7224055 Center pad type IC chip with jumpers, method of processing the same and multi chip package |
| 05/29/2007 | US7224054 Semiconductor device and system having semiconductor device mounted thereon |
| 05/29/2007 | US7224053 Semiconductor device responsive to different levels of input and output signals and signal processing system using the same |
| 05/29/2007 | US7224051 Semiconductor component having plate and stacked dice |
| 05/29/2007 | US7224045 Leadless type semiconductor package, and production process for manufacturing such leadless type semiconductor package |
| 05/29/2007 | US7224001 Semiconductor light source |
| 05/29/2007 | US7224000 Light emitting diode component |
| 05/29/2007 | US7223981 Gamma ray detector modules |
| 05/29/2007 | US7223696 Methods for maskless lithography |
| 05/29/2007 | US7223634 Semiconductor device, method for manufacturing the same, circuit board, and electronic apparatus |
| 05/24/2007 | WO2007058074A1 Double-faced electrode package, and its manufacturing method |
| 05/24/2007 | WO2007016048A3 Infrared scanner for biological applications |
| 05/24/2007 | WO2006053118A3 Spaced, bumped component structure |
| 05/24/2007 | US20070118828 Generation of metal holes by via mutation |
| 05/24/2007 | US20070117369 Method for interconnecting active and passive components, and a resulting thin heterogeneous component |
| 05/24/2007 | US20070117274 Apparatus incorporating small-feature-size and large-feature-size components and method for making same |
| 05/24/2007 | US20070117267 Semiconductor Multi-Package Module Having Inverted Land Grid Array (LGA) Package Stacked Over Ball Grid Array (BGA) Package |
| 05/24/2007 | US20070117266 Method of fabricating a multi-die semiconductor package assembly |
| 05/24/2007 | US20070117262 Low Profile Stacking System and Method |
| 05/24/2007 | US20070117258 Method for the molecular bonding of microelectronic components to a polymer film |
| 05/24/2007 | US20070114665 Power Semiconductor Circuit |
| 05/24/2007 | US20070114649 Low Profile Stacking System and Method |
| 05/24/2007 | US20070114425 Radiographic image sensing system |
| 05/24/2007 | US20070114058 Circuit board and its manufacturing method |
| 05/24/2007 | US20070113881 Method of making solar cell with antireflective coating using combustion chemical vapor deposition (CCVD) and corresponding product |
| 05/24/2007 | DE10234208B4 Waferlevel-Stapelchippackung und Herstellungsverfahren hierfür Wafer-level stack chip package and manufacturing method thereof |
| 05/24/2007 | DE10214566B4 Homogen paralleles Licht emittierende Leuchtdiode Homogeneous parallel light emitting diode |
| 05/24/2007 | DE102005054631A1 Sensoranordnung mit einem Substrat und mit einem Gehäuse und Verfahren zur Herstellung einer Sensoranordnung Sensor arrangement having a substrate and having a housing and method for producing a sensor arrangement |
| 05/24/2007 | DE102005039478B4 Leistungshalbleiterbauteil mit Halbleiterchipstapel und Verfahren zur Herstellung desselben Power semiconductor component with the same semiconductor chip stack and processes for preparing |
| 05/24/2007 | DE102005035393B4 Verfahren zur Herstellung eines Bauelementes mit mehreren Chips sowie ein solches Bauelement A method for producing a component with a plurality of chips, as well as such a component |
| 05/23/2007 | EP1788640A1 Light emitting module and production method therefor |
| 05/23/2007 | EP1787334A2 Light-emitting structures |
| 05/23/2007 | EP0826234B1 Method of manufacturing a hybrid integrated circuit |
| 05/23/2007 | CN2904304Y Plane type photoelectric coupler |
| 05/23/2007 | CN2904303Y Led集成芯片 Led integrated chip |
| 05/23/2007 | CN2904302Y U groove LED integrated chip |
| 05/23/2007 | CN2903663Y LED light source lamp apparatus |
| 05/23/2007 | CN1969448A Motor controller |
| 05/23/2007 | CN1969369A Light emitting diode component |
| 05/23/2007 | CN1967885A LBD lamp assembly |
| 05/23/2007 | CN1967839A Stacking method and stacked structure for attaching memory components to associated device |
| 05/23/2007 | CN1967838A A package having an array of embedded capacitors for power delivery and decoupling of high speed input/output circuitry and methods of forming thereof |