H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices

Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
12/2006
12/06/2006	EP1729350A2 Light emitting diode package
12/06/2006	CN2845177Y Sheet-like LED
12/06/2006	CN2845172Y 光接收二极管结构 Light receiving diode structure
12/06/2006	CN2845171Y Packing structure of light emitting diode body
12/06/2006	CN2845170Y Double IC card system
12/06/2006	CN1875481A Semiconductor device and process for fabricating the same
12/06/2006	CN1874017A White light emitting device
12/06/2006	CN1874014A Semiconductor luminous element packing structure
12/06/2006	CN1873975A High-brightness led with protective function of electrostatic discharge damage
12/06/2006	CN1873974A LED device with protective circuit of diode
12/06/2006	CN1873973A Envelope for luminous elements of semiconductor in large power
12/06/2006	CN1873972A Stack architecture of multiple chips
12/06/2006	CN1873971A Solder foil, semiconductor device and electronic device
12/06/2006	CN1873970A Electronic device and method of manufacturing the same
12/06/2006	CN1873910A Method for fabricating unit of encapsulating system chip through machine
12/06/2006	CN1288765C Luminescent device
12/05/2006	US7146543 Semiconductor device mounting chip having tracing function
12/05/2006	US7145986 Solid state X-ray detector with improved spatial resolution
12/05/2006	US7145361 Configurable integrated circuit with different connection schemes
12/05/2006	US7145286 Wedge shaped uniform energy megasonic transducer
12/05/2006	US7145249 Semiconducting device with folded interposer
12/05/2006	US7145248 Common connection method for flip-chip assembled devices
12/05/2006	US7145247 Offset-bonded, multi-chip semiconductor device
12/05/2006	US7145234 Circuit carrier and package structure thereof
12/05/2006	US7145233 Decoupling capacitor closely coupled with integrated circuit
12/05/2006	US7145228 Microelectronic devices
12/05/2006	US7145227 Stacked memory and manufacturing method thereof
12/05/2006	US7145226 Scalable microelectronic package using conductive risers
12/05/2006	US7145225 Interposer configured to reduce the profiles of semiconductor device assemblies and packages including the same and methods
12/05/2006	US7145224 Semiconductor device
12/05/2006	US7144757 Circuit suitable for vertical integration and method of producing same
12/05/2006	US7144754 Device having resin package and method of producing the same
12/05/2006	US7143929 Ceramic circuit board and method for manufacturing the same
11/2006
11/30/2006	WO2006127782A1 Integrated circuit package having stacked integrated circuits and method therefor
11/30/2006	WO2006126586A1 Circuit substrate connection structure and circuit substrate connection method
11/30/2006	WO2006126525A1 Cu-Mo SUBSTRATE AND METHOD FOR PRODUCING SAME
11/30/2006	WO2006028703A3 Integrated artificial and natural lighting system
11/30/2006	WO2006028643A3 Circuit module system and method
11/30/2006	US20060271901 Mixed-signal functions using R-cells
11/30/2006	US20060271828 Semiconductor device mounting chip having tracing function
11/30/2006	US20060270116 System and method using self-assembled nano structures in the design and fabrication of an integrated circuit micro-cooler
11/30/2006	US20060270108 Method for fabricating semiconductor components with thinned substrate, circuit side contacts, conductive vias and backside contacts
11/30/2006	US20060270094 CMOS type image sensor module having transparent polymeric encapsulation material
11/30/2006	US20060270093 Semiconductor device and manufacturing method thereof
11/30/2006	US20060267680 Component arrangement having a transistor and an open-load detector
11/30/2006	US20060267220 Semiconductor device
11/30/2006	US20060267193 Semiconductor device and communication terminal using thereof
11/30/2006	US20060267186 Semiconductor device
11/30/2006	US20060267185 Encapsulated power semiconductor assembly
11/30/2006	US20060267159 Electronic component and method for manufacturing the same
11/30/2006	US20060267135 Circuit arrangement placed on a substrate and method for producing the same
11/30/2006	DE102005023591A1 Feldmesseinrichtung, Messbaugruppe für eine Feldmesseinrichtung und Herstellungsmethode für eine Mehrzahl von Messbaugruppen Field measuring device, the measuring assembly for a field measuring device and manufacturing method for a plurality of measurement modules
11/30/2006	DE10156769B4 Leistungshalbleitereinrichtung mit einem äußeren Verbindungsanschluß zum Führen eines großen Stromes Power semiconductor device having an external connection terminal for carrying a large current
11/29/2006	EP1727212A1 Semiconductor light-emitting device and illuminating device
11/29/2006	EP1727202A2 Light-emitting diode arrangement
11/29/2006	EP1727198A2 Semiconductor module and semiconductor module heat radiation plate
11/29/2006	EP1726438A2 Ink jet recording apparatus utilizing solid semiconductor element
11/29/2006	EP1726042A2 Reconfigurable processor module with stacked die elements
11/29/2006	CN1871714A Semiconductor device for emitting light and method for fabricating the same
11/29/2006	CN1870268A Semiconductor integrated circuit device and electronic card using it
11/29/2006	CN1870266A Semiconductor integrated circuit device and electronic card using it
11/29/2006	CN1870265A Semiconductor integrated circuit device and electronic card using it
11/29/2006	CN1870262A Small radio communication module and manufacturing method
11/29/2006	CN1870220A Method of manufacturing optical devices and related improvements
11/29/2006	CN1869786A LED array and direct backlight unit
11/29/2006	CN1287455C Semiconductor integrated circuit device and electronic card using same
11/29/2006	CN1287424C Method of manufacturing optical devices and related improvements
11/28/2006	US7142000 Mounting spring elements on semiconductor devices, and wafer-level testing methodology
11/28/2006	US7141876 Semiconductor device
11/28/2006	US7141875 Flexible multi-chip module and method of making the same
11/28/2006	US7141874 Electronic component packaging structure and method for producing the same
11/28/2006	US7141873 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
11/28/2006	US7141872 Semiconductor device and method of manufacturing semiconductor device
11/28/2006	US7141832 Semiconductor device and capacitance regulation circuit
11/28/2006	US7141741 Circuit board
11/28/2006	US7141493 Semiconductor device, method of manufacturing three-dimensional stacking type semiconductor device, circuit board, and electronic instrument
11/28/2006	US7141453 Method of mounting wafer on printed wiring substrate
11/28/2006	US7141452 Methods of reducing bleed-out of underfill and adhesive materials
11/28/2006	US7140883 Contact carriers (tiles) for populating larger substrates with spring contacts
11/28/2006	US7140751 Full-color flexible light source device
11/28/2006	US7140104 Method of producing circuit component built-in module with embedded circuit component
11/23/2006	WO2006124582A1 Method of assembling semiconductor devices with leds
11/23/2006	WO2006124576A2 Integrated circuit with signal bus formed by cell abutment of logic cells
11/23/2006	WO2006122505A1 Integrated circuit packaging and method of making the same
11/23/2006	US20060264041 Microelectronic devices, methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices
11/23/2006	US20060264023 Die-wafer package and method of fabricating same
11/23/2006	US20060262587 Memory module and memory system
11/23/2006	US20060261859 Semiconductor integrated circuit device
11/23/2006	US20060261857 Integrated Circuit Dynamic Parameter Management In Response to Dynamic Energy Evaluation
11/23/2006	US20060261855 Integrated circuit with signal bus formed by cell abutment of logic cells
11/23/2006	US20060261499 Chip package structure
11/23/2006	US20060261493 Wafer level pre-packaged flip chip systems
11/23/2006	US20060261492 Multi-chip module and methods
11/23/2006	US20060261475 Wafer level pre-packaged flip chip
11/23/2006	US20060261471 SIP type package containing analog semiconductor chip and digital semiconductor chip stacked in order, and method for manufacturing the same
11/23/2006	US20060261463 Low cost power semiconductor module without substrate
11/23/2006	US20060261461 Stacking system and method
11/23/2006	US20060261460 Semiconductor device
11/23/2006	US20060261281 Radiation detector, radiation detector element, and radiation imaging apparatus
11/23/2006	DE102006021648A1 Light emitting device for AC and production process comprises at least two micro-platelets having light active layers arranged to emit light alternately during the positive and negative half-cycles of the AC voltage

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