| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 02/13/2007 | US7176117 Method for mounting passive components on wafer |
| 02/13/2007 | US7176063 High density 3-D integrated circuit package |
| 02/13/2007 | US7176059 Method of fabricating an electronic component having at least one semiconductor chip on a circuit carrier with elastic external contacts |
| 02/13/2007 | US7176057 Power module comprising at least two substrates and method for producing the same |
| 02/13/2007 | US7176055 Method and apparatus for manufacturing electronic component-mounted component, and electronic component-mounted component |
| 02/13/2007 | US7174627 Method of fabricating known good dies from packaged integrated circuits |
| 02/08/2007 | WO2006137819A3 High density vertically stacked semiconductor device |
| 02/08/2007 | WO2005022965A3 Expansion constrained die stack |
| 02/08/2007 | US20070031998 Method and apparatus for removing encapsulating material from a packaged microelectronic device |
| 02/08/2007 | US20070029482 Infrared imager |
| 02/08/2007 | DE102006034753A1 Semiconductor device for use in memory module has dummy substrate formed on semiconductor package and comprising of embedded discrete capacitor connected between first and second power signals |
| 02/08/2007 | DE102005035393A1 Bauelement mit einem oder mehreren Chips sowie Verfahren zur Herstellung eines solchen Device having one or more chips as well as methods for producing such |
| 02/08/2007 | DE102005034873A1 Anordnung eines elektrischen Bauelements und eines auf dem Bauelement auflaminierten Folienverbunds und Verfahren zur Herstellung der Anordnung Arrangement of an electrical component and a laminated composite film on the component and method of manufacturing the arrangement |
| 02/08/2007 | DE102005032076B3 Verfahren zum Herstellen eines Schaltungsmoduls A method of manufacturing a circuit module |
| 02/08/2007 | DE102004030541B4 Integrierte Schaltung Integrated circuit |
| 02/08/2007 | DE10141877B4 Halbleiterbauteil und Konvertereinrichtung Semiconductor device and converter means |
| 02/08/2007 | DE10132024B4 Halbleiter-Bauteil und Verfahren zu dessen Herstellung Semiconductor device and process for its preparation |
| 02/07/2007 | EP1750307A2 Edge-emitting LED light source |
| 02/07/2007 | EP1750300A2 Electrical element |
| 02/07/2007 | EP1748731A2 Bluetooth ® wireless dental radiology device and system |
| 02/07/2007 | EP1748728A2 Stand-alone wireless dental radiology device and system |
| 02/07/2007 | CN2867599Y Mixed light luminous diode structure |
| 02/07/2007 | CN2867596Y Modified luminous diode modular structure |
| 02/07/2007 | CN2867595Y Multi-chip package structure internal connection wire |
| 02/07/2007 | CN1910750A Semiconductor package and semiconductor device |
| 02/07/2007 | CN1909367A Ceramic packaging piece for crystal oscillator and its preparation method |
| 02/07/2007 | CN1909363A 半导体功率器件和rf信号放大器 The semiconductor power device and the rf signal amplifier |
| 02/07/2007 | CN1909230A Inter-chip ESD protection structure for high speed and high frequency devices and its forming method |
| 02/07/2007 | CN1909229A Edge-emitting LED light source |
| 02/07/2007 | CN1909219A Multipurpose LED support |
| 02/06/2007 | US7173882 Methods and systems for performing horological functions using time cells |
| 02/06/2007 | US7173340 Daisy chaining of serial I/O interface on stacking devices |
| 02/06/2007 | US7173336 Hybrid integrated circuit device |
| 02/06/2007 | US7173333 Semiconductor device |
| 02/06/2007 | US7173330 Multiple chip semiconductor package |
| 02/06/2007 | US7173325 Expansion constrained die stack |
| 02/06/2007 | US7172910 Web fabrication of devices |
| 02/06/2007 | US7172315 LED lamp assembly |
| 02/06/2007 | US7172130 Electronic device, rubber product, and methods for manufacturing the same |
| 02/01/2007 | WO2007013239A1 Stacked electronic component, electronic device and method for manufacturing stacked electronic component |
| 02/01/2007 | WO2007012911A1 Semiconductor module for a switched-mode power supply and method for its assembly |
| 02/01/2007 | WO2006024626A3 Electric sub-assembly |
| 02/01/2007 | US20070028193 Multiple voltage integrated circuit and design method therefor |
| 02/01/2007 | US20070026571 Roll-to-roll fabricated encapsulated semiconductor circuit devices |
| 02/01/2007 | US20070026570 Roll-to-roll fabricated electronically active device |
| 02/01/2007 | US20070026569 Semiconducting device with folded interposer |
| 02/01/2007 | US20070023905 Semiconducting device with folded interposer |
| 02/01/2007 | US20070023895 Semiconductor device having capacitors for reducing power source noise |
| 02/01/2007 | US20070023769 Led lighting source and led lighting apparatus |
| 02/01/2007 | US20070023767 Semiconductor apparatus having conductive layers and semiconductor thin films |
| 02/01/2007 | US20070023660 Device and method for producing images |
| 02/01/2007 | DE202006013053U1 Lichtemissionsvorrichtung The light emission device |
| 02/01/2007 | DE112005000528T5 Belüfteter Photovoltaikmodulrahmen Ventilated photovoltaic module frame |
| 02/01/2007 | DE102006033039A1 Interposer und Herstellungsverfahren, Halbleiterbauelement und Mehrchip-Packung Interposer and manufacturing processes, semiconductor device and multi-chip package |
| 02/01/2007 | DE102006030081A1 Electrical module unit for sensor, e.g. inertia sensor, has two spraying bodies formed, so that each body surrounds number of conduction cables, and pressing grids freely running between spraying bodies and embedded in spraying bodies |
| 02/01/2007 | DE102006018182A1 System, Verfahren und Vorrichtung zum Leiten von Signalen von einer integrierten Schaltung unter Verwendung von Dickfilm- und Gedruckte-Schaltung-Verbindungen System, method and apparatus for routing signals from an integrated circuit using thick film and printed circuit connections |
| 02/01/2007 | DE102005049858B3 Multilayer circuit-board for communication terminals, has one or more transparent layers joined to one or more decoupling points |
| 02/01/2007 | DE102005034166A1 Gehäuse für ein elektromagnetische Strahlung emittierendes optoelektronisches Bauelement, elektromagnetische Strahlung emittierendes Bauelement und Verfahren zum Herstellen eines Gehäuses oder eines Bauelements Housing for a electromagnetic radiation-emitting optoelectronic component, electromagnetic radiation emitting device and method for producing a housing or a component |
| 02/01/2007 | DE102005033469A1 Halbleitersubstrat, Verfahren zu dessen Herstellung sowie Verfahren zum Herstellen eines Schaltungsmoduls Semiconductor substrate, a process for its preparation and method of manufacturing a circuit module |
| 02/01/2007 | DE10156272B4 Multi-Chip-Speichervorrichtung und Speichermodul mit einer unabhängigen Steuerung der Speicherchips The multi-chip memory module and memory device with an independent control of the memory chips |
| 01/31/2007 | EP1747706A2 Support with solder globule elements and a method for assembly of substrates with globule contacts |
| 01/31/2007 | EP1747585A1 Photovoltaic module with an electric device |
| 01/31/2007 | CN2864993Y Photoelectric chip double-chip type base material packaging structure with control chip |
| 01/31/2007 | CN2864341Y Semiconductor light source for lighting |
| 01/31/2007 | CN2864333Y Flat source device for LED |
| 01/31/2007 | CN1906757A 半导体装置 Semiconductor device |
| 01/31/2007 | CN1906745A Electronic device, semiconductor device using same, and method for manufacturing semiconductor device |
| 01/31/2007 | CN1905224A Semiconductor chip or device with vertical structure through-hole |
| 01/31/2007 | CN1905223A LED light source packaging structure for low-temp. coburning ceramic by thermoelectric separating design |
| 01/31/2007 | CN1905181A Semiconductor packages for surface mounting and method of producing same |
| 01/31/2007 | CN1905145A Method of making a stacked die package |
| 01/31/2007 | CN1905130A Method for manufacturing semiconductor device |
| 01/31/2007 | CN1298203C Circuit apparatus |
| 01/30/2007 | US7170179 Chip select method through double bonding |
| 01/30/2007 | US7170175 Semiconductor device and production method thereof |
| 01/30/2007 | US7170158 Double-sided circuit board and multi-chip package including such a circuit board and method for manufacture |
| 01/30/2007 | US7170157 Semiconductor package having multiple embedded chips |
| 01/30/2007 | US7170099 Optical semiconductor device and a method for manufacturing the same |
| 01/30/2007 | US7170062 Conductive adhesive bonded semiconductor substrates for radiation imaging devices |
| 01/30/2007 | US7169642 Method of fabricating a semiconductor multi-package module having inverted land grid array (LGA) package stacked over ball grid array (BGA) package |
| 01/30/2007 | US7168837 Vehicular headlamp and semiconductor light emitting element |
| 01/30/2007 | US7168623 Self-adhesive electronic circuit |
| 01/30/2007 | US7168161 Manufacturing method of solid-state image sensing device |
| 01/25/2007 | WO2007010863A1 Integrated circuit chip part, multi-chip module, their integration structure, and their fabrication method |
| 01/25/2007 | WO2007010646A1 Semiconductor device |
| 01/25/2007 | US20070021089 Semiconductor device that suppresses variations in high frequency characteristics of circuit elements |
| 01/25/2007 | US20070020907 Method of forming a connecting conductor and wirings of a semiconductor chip |
| 01/25/2007 | US20070020805 Etch stop layer for silicon (Si) via etch in three-dimensional (3-D) wafer-to-wafer vertical stack |
| 01/25/2007 | US20070020791 Image sensor with optical guard ring and fabrication method thereof |
| 01/25/2007 | US20070018716 Circuit arrangement having a transistor component and a freewheeling element |
| 01/25/2007 | US20070018333 Semiconductor packaging device and manufacture thereof |
| 01/25/2007 | US20070018320 Semiconductor chip production method, semiconductor device production method, semiconductor chip, and semiconductor device |
| 01/25/2007 | US20070018307 Integrated circuit chip module |
| 01/25/2007 | US20070018303 Stack package made of chip scale packages |
| 01/25/2007 | US20070018296 Stacked Semiconductor Package having Adhesive/Spacer Structure and Insulation |
| 01/25/2007 | US20070018295 Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured thereby |
| 01/25/2007 | US20070018175 Light emitting diodes with improved light collimation |
| 01/25/2007 | US20070017642 Systems and Components for Enhancing Rear Vision from a Vehicle |
| 01/25/2007 | DE202006013055U1 Wärmeableitungsmodul Heat dissipation module |
| 01/25/2007 | DE19713656B4 Leistungshalbleitermodul The power semiconductor module |