| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 07/05/2007 | US20070152709 Safety system based on reconfigurable array of logic gates |
| 07/05/2007 | US20070152327 Super high density module with integrated wafer level packages |
| 07/05/2007 | US20070152320 Semiconductor device, package structure thereof, and method for manufacturing the semiconductor device |
| 07/05/2007 | US20070152226 LED lamps |
| 07/05/2007 | US20070152213 Methods and structures for reducing lateral diffusion through cooperative barrier layers |
| 07/05/2007 | US20070152154 Method and apparatus for two-dimensional spectroscopy |
| 07/05/2007 | DE202007006264U1 Elektronisches Modul Electronic module |
| 07/05/2007 | DE102006003474B3 Device for transmitting electromagnetic signals between two functional units, has fields which are completely accessible from outside for producing electrically-conducting connections |
| 07/05/2007 | DE102005063283A1 Elektronisches Modul Electronic module |
| 07/05/2007 | DE102005062783A1 Electronic module for controlling electric motor, has upper substrate comprising smaller base surface than base body of lower substrate, and power component fastened to lower substrate at outer side of outer periphery of upper substrate |
| 07/05/2007 | DE102005062600A1 Method for positioning electronic power components on a circuit board used in chip manufacture comprises using a heat-conducting electrically insulating foil |
| 07/05/2007 | DE102005061772A1 Power semiconductor module, has plastics material body with thermal coefficient of expansion of plastics material matched to that of circuit board |
| 07/05/2007 | CA2635220A1 One piece, collapsible pv assembly |
| 07/04/2007 | EP1597762A4 Thin multiple semiconductor die package |
| 07/04/2007 | EP1326079B1 Probe card |
| 07/04/2007 | EP0975472A4 Three dimensional structure memory |
| 07/04/2007 | CN2919539Y Heat radiating encapsulation structure of large power lighting diode |
| 07/04/2007 | CN1993839A Led灯系统 Led lamp system |
| 07/04/2007 | CN1993826A LED light system |
| 07/04/2007 | CN1992363A Light emitting apparatus, method for producing the same and assembly incorporating the same |
| 07/04/2007 | CN1992260A Light emitting device module |
| 07/04/2007 | CN1992259A Semiconductor device having semiconductor element, insulation substrate and metal electrode |
| 07/04/2007 | CN1992258A Multiple chip packaging arrangement |
| 07/04/2007 | CN1992257A Packaging structure for image sensor and identification mould |
| 07/04/2007 | CN1992241A 内存模块整合结构 Memory module integration structure |
| 07/04/2007 | CN1324774C Method of manufacturing optical devices and related improvements |
| 07/04/2007 | CN1324702C 电源装置 Power supply unit |
| 07/04/2007 | CN1324699C 功率半导体模块 Power Semiconductor Modules |
| 07/04/2007 | CN1324669C Semiconductor device producing method, semiconductor device, circuit substrate, and electronic device |
| 07/04/2007 | CN1324668C Semiconductor device and method of fabricating the same, |
| 07/04/2007 | CN1324667C Fan out type wafer level package structure and method of the same |
| 07/03/2007 | US7239173 Programmable memory element with power save mode in a programmable logic device |
| 07/03/2007 | US7239022 Sensor device |
| 07/03/2007 | US7239021 Stacked chip semiconductor device and method for manufacturing the same |
| 07/03/2007 | US7239020 Multi-mode integrated circuit structure |
| 07/03/2007 | US7239014 Capacitor-built-in type printed wiring substrate, printed wiring substrate, and capacitor |
| 07/03/2007 | US7239010 Semiconductor device |
| 07/03/2007 | US7238968 Semiconductor device and method of making the same |
| 07/03/2007 | US7238966 Light-receiving panel or light-emitting panel, and manufacturing method thereof |
| 07/03/2007 | US7238878 Photovoltaic module with light reflecting backskin |
| 07/03/2007 | US7238548 Flip-chip type semiconductor device, production process for manufacturing such flip-chip type semiconductor device, and production process for manufacturing electronic product using such flip-chip type semiconductor device |
| 06/28/2007 | WO2007071696A1 Process for the collective fabrication of 3d electronic modules |
| 06/28/2007 | WO2007071397A1 Illumination device, illumination control apparatus, illumination system |
| 06/28/2007 | WO2007071216A1 Power semiconductor module, method for fabricating it, and use in a switched-mode power supply |
| 06/28/2007 | WO2007010879A3 Light-emitting module and mounting board used therefor |
| 06/28/2007 | WO2006115649A3 Multi-chip module and method of manufacture |
| 06/28/2007 | US20070148821 Thermally enhanced stacked die package and fabrication method |
| 06/28/2007 | US20070148341 Electronic Circuit Device and Manufacturing Method Thereof |
| 06/28/2007 | US20070145580 Semiconductor device |
| 06/28/2007 | US20070145576 Power Semiconductor Circuit And Method Of Manufacturing A Power Semiconductor Circuit |
| 06/28/2007 | US20070145568 Multi-layer interconnection circuit module and manufacturing method thereof |
| 06/28/2007 | US20070145558 Super high density module with integrated wafer level packages |
| 06/28/2007 | US20070145556 Techniques for packaging multiple device components |
| 06/28/2007 | DE102006033893A1 Illumination device for use with display device, has light modules provided, where each module has light sources applied on printed circuit board, and one source has light emitting diode with optical unit that has radiation emission surface |
| 06/28/2007 | DE102005061016A1 Leistungshalbleitermodul, Verfahren zu seiner Herstellung und Verwendung in einem Schaltnetzteil Power semiconductor module, process for its preparation and use in a switching power supply |
| 06/28/2007 | DE102005060081A1 Electronic component e.g. dynamic random access memory module, for e.g. mobile phone, has circuit board with semiconductor components having contact connections groups, where one of connections comes for congruence with other connection |
| 06/27/2007 | EP1801866A2 Semiconductor device and method of manufacturing the same |
| 06/27/2007 | EP1800341A2 Led-array |
| 06/27/2007 | EP1800338A1 Method for producing layers located on a hybrid circuit |
| 06/27/2007 | EP1393432A4 Electron tunneling device |
| 06/27/2007 | CN2916931Y Compact high-power LED encapsulation structure |
| 06/27/2007 | CN2916930Y LED light source |
| 06/27/2007 | CN1989618A Light emitting diode assembly |
| 06/27/2007 | CN1989617A Optoelectronic component that emits electromagnetic radiation and illumination module |
| 06/27/2007 | CN1989616A Semiconductor device |
| 06/27/2007 | CN1988153A Integrated circuit and method for controlling the temperature of a semiconductor material having an integrated circuit |
| 06/27/2007 | CN1988149A 半导体器件 Semiconductor devices |
| 06/27/2007 | CN1988119A Light emitting diode with static damage protective function and its producing method |
| 06/26/2007 | US7236372 Surface mounted power supply circuit apparatus and method for manufacturing it |
| 06/26/2007 | US7236367 Power electronics component |
| 06/26/2007 | US7236009 Operational time extension |
| 06/26/2007 | US7235885 Semiconductor device and method of manufacturing the same, circuit board and electronic device |
| 06/26/2007 | US7235878 Direct cooling of LEDs |
| 06/26/2007 | US7235871 Stacked microelectronic dies |
| 06/26/2007 | US7235829 Electronic card with protection against aerial discharge |
| 06/26/2007 | US7235817 LED Lamp |
| 06/26/2007 | US7235788 Detector for a tomography unit |
| 06/26/2007 | US7235785 Imaging device with multiple fields of view incorporating memory-based temperature compensation of an uncooled focal plane array |
| 06/26/2007 | US7235775 Infrared imaging apparatus for processing emissions in infrared and visible spectrum |
| 06/26/2007 | US7235477 Multi-layer interconnection circuit module and manufacturing method thereof |
| 06/26/2007 | US7235426 Method of backside grinding a bumped wafer |
| 06/26/2007 | US7235425 Semiconductor device and fabrication method for the same |
| 06/26/2007 | US7234231 Method of manufacturing a lead frame |
| 06/26/2007 | CA2343781C Systems and components for enhancing rear vision from a vehicle |
| 06/21/2007 | WO2007070304A1 Microstrip spacer for stacked chip scale packages, methods of making same, methods of operating same, and systems containing same |
| 06/21/2007 | WO2007069606A1 Substrate with built-in chip and method for manufacturing substrate with built-in chip |
| 06/21/2007 | WO2007069427A1 Module having built-in electronic component and method for manufacturing such module |
| 06/21/2007 | WO2007034228A3 Photovoltaic cells comprising two photovoltaic cells and two photon sources |
| 06/21/2007 | US20070141805 Method for bonding plastic micro chip |
| 06/21/2007 | US20070141754 Wire bonding system and method of use |
| 06/21/2007 | US20070138500 Light-emitting device having light-emitting elements |
| 06/21/2007 | US20070138493 Light-receiving module |
| 06/21/2007 | DE10219353B4 Halbleiterbauelement mit zwei Halbleiterchips Semiconductor component having two semiconductor chips |
| 06/21/2007 | DE102004033533B4 Leuchteinheit mit integrierter Platine Light unit with integrated board |
| 06/20/2007 | EP1798767A2 Circuit board and production method therefor |
| 06/20/2007 | CN2914564Y Control device of LED |
| 06/20/2007 | CN2914329Y Integrated circuit stack conformation |
| 06/20/2007 | CN1985371A Electronic device comprising an integrated circuit |
| 06/20/2007 | CN1985370A Electronic device comprising an ESD device |
| 06/20/2007 | CN1983643A Optical device and measuring method |